432 Physical Design Jobs - Page 3

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains– LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux – Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 5+ years Hardware Engineering experience or related work experience. 5+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Principal Duties and Responsibilities: 5+ Years of Experience in Logic design /micro-architecture / RTL coding Must have hands on experience with SoC design, synthesis and timing analysis for complex SoCs. Experience in Verilog/System-Verilog is a must. knowledge of AMBA protocols - AXI, AHB, APB, SoC clocking/reset/debug architecture and peripherals like USB, PCIE and SDCC. Work closely with the SoC DFT, Physical Design and STA teams Hands on experience in Low power SoC design is required Hands on experience in Multi Clock designs, Asynchronous interface is a must. Experience in using the tools in ASIC development such as DesignCompiler, Genus, FusionCompiler and Primetime is required. Understanding of constraint development and timing closure is a plus. Experience in Synthesis / Understanding of timing concepts

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: NUVIA is now part of Qualcomm. Our mission is to reimagine silicon and create computing platforms that will transform the industry. You will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. As CPU Physical Design CAD engineer, you will build and support the world’s best implementation tools and flows. Your tools and flows will ensure our custom CPUs have industry-leading power, performance and area. Roles and Responsibilities Develop, integrate and release new features in our high-performance place-and-route CAD flow Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area Maintain, support and debug implementation flows, and resolve project-specific issues Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA. Work with EDA vendors to define roadmap and to resolve tool issues Preferred Qualifications: Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role High level of proficiency in Tcl as well as Python Experience with automation Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV Experience with advanced technology nodes (5nm or lower) Solid understanding of digital design, timing analysis and physical verification Strong user of industry-standard place-and-route tools such as Cadence Innovus Proven track record of managing and regressing place-and-route flows

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Experience 7 to 10 years Physical design of block level with full understanding of PnR cycle. Good understanding of Physical design fundamentals Good hands-on experience on industry standard pnr tools like ICC2/Innovus Good understanding on signoff tool like Prime time , Redhawk and calibre Should be able to guide junior engineers in resolving technical issues. Tools ICC/Innovus, PT, StarRC, Redhawk, Calibre DRC/LVS ScriptingTCL, Perl

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 2-4 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design . Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Experience Required8+ Years (A must) Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device phy STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs Qualcomm Hexagon DSP IP's . Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Role * Physical Design Life cycle of chip development, especially Floorplanning and PnR * Hands on PD execution at block/SoC level along with PPA improvements * Strong understanding of the technology and PD Flow Methodology enablement. * Work with Physical design engineers to rollout robust, identify areas for flow improvement methodologies. (area/power/performance/convergence), develop plans and deploy/support them * Provide tool support and issue debugging services to physical design team engineers across various sites * Develop and maintain 3rd party tool integration and productivity enhancement routines * Understand advance tech PNR and STA concepts and methodologies and work closely with EDA vendors to deploy solutions. Skill Set * Strong programming experience & Proficiency in Python/Tcl/C++ * Understand physical design flows using Innovus/fc/icc2 tools * Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory * Basic understanding of Timing/Formal verification/Physical verification/extraction are desired * Ability to ramp-up in new areas, be a good team player and excellent communication skills desired Experience 3-5 years of experience with the Place-and-route and timing closer and power analysis environment is required Niche Skills Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.This requirement is for DDR PD team for Bangalore. Number of openings: Sr. Lead (6 to 8 years) 2 Staff (8 to 10 years) 1 Sr Staff (10 to 12 years) 1 Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device phy STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs Qualcomm Hexagon DSP IP's . Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm's Bangalore WLAN PHY (Baseband) team is seeking VLSI Digital Design Engineers to lead IP development for the latest WiFi standards. Our WLAN PHY team, comprised of highly passionate and seasoned domain experts, prides itself on years of experience in taking WLAN PHY designs from concept to silicon independently. WLAN PHY team is responsible for delivering the end-to-end Tx/Rx DSP chains – all the way from antenna samples post ADC to raw bits for upper layers and on the reverse path from raw bits to DAC. The team specializes in working with challenges of practical high-speed wireless communication systems and finding innovative solutions to counter them. The team works extensively on typical signal processing functions like filters, matrix transformations (e.g.QR, Cholesky decomposition), channel estimation, equalization (MMSE, MRC, ML), decoders/encoders (e.g.LDPC, Viterbi) , demodulators, FFT etc. on a day-to-day basis, and contributes to the development/ enhancement/ evaluation of signal processing algorithms to cater to new requirements. We are looking for someone as passionate as us and takes pride in their work. WiFi's ubiquity in modern times is undeniable, and the IEEE 802.11 Working Group is continually developing new standards to satisfy the growing demand for high throughput and low-latency real-time applications, such as VR and AR. Qualcomm is at the forefront of the WiFi revolution, aiming to become the global leader in WiFi chip solutions. The WLAN PHY team in Bangalore is instrumental in realizing this vision. : Looking for a candidate with 1 to 3 years of hands-on experience in micro-architecting and developing complex IPs. Expertise in digital design, VLSI concepts, and experience in creating power/area-efficient IPs across multiple clock domains are essential. Proficiency in RTL coding and familiarity with RTL QA flows such as PLDRC, CDC, and CLP (optional) is expected. Candidates should be capable of proposing design alternatives to meet area/power/performance specifications and presenting these options for review. Experience in leading, guiding, or managing junior team members is advantageous. Repeated success in taking IP designs from requirements to silicon is required. While not mandatory, having developed IPs for wireless technologies (WLAN, LTE, NR, BT, UWB, etc.) or past HLS experience would be beneficial. Skills: Must have: Proficient in Verilog RTL coding, uArch, CDC check, PLDRC, Timing constraints, Python/Perl. Experience in design/debugging complex data-path/control-path IPs. Good communication, analytical & leadership skills. Good to have: System Verilog, Visio, Knowledge of signal processing concepts/algorithms and Wi-Fi standards (802.11a/b/g/n/ac/ax), experience with HLS. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Bachelor’s or Master’s degree from a top-tier institute. 6-8 years of experience in physical design from product-based companies. Experience: Proven experience in managing complex subsystems and small teams. Proficiency in complete Netlist2GDSFloorplan, place and route (PnR), and sign-off convergence, including Static Timing Analysis (STA) and sign-off optimizations. Hand on experience in lower technology nodes. Job : Expertise in meeting demanding Power, Performance, and Area (PPA) requirements for complex subsystems/System on Chips (SoCs), place and route, and IP integration. Experience in low power design implementation, including Unified Power Format (UPF), multi-voltage domains, and power gating. Familiarity with ASIC design flows and physical design methodologies. Strong understanding of circuit design, device physics, and deep sub-micron technology. Experience working on multiple technology nodes in advanced processes. Proficiency in automation to drive improvements in PPA. Managing and driving a small team for project execution and PPA targets

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Responsibilities: STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs. Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo. Education B.Tech or MTech/MS in Electrical/Electronics/Microelectronics/VLSI. Preferred Qualification/Skills 5 - 10 years of experience in STA/Timing Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages – TCL, Perl, Awk Basic knowledge of device physics

Candidate should be exeprinecd in process development in R&D in API synthesis Candidate with the exeprience of handelling Photo reactor will be prefered . Experience in Vitamin synthesis will be prefered

SE NIOR SILICON DESIGN ENGINEER THE ROLE: The focus of this role is to plan, implement, and execute the Physical design and verification of processing subsystems IP, resulting in meeting the signoff criteria for tapeout. THE PERSON: You have a passion for modern, complex processor architecture, digital design, and Implementation in general. You are a team player who has excellent communication skills and experience collaborating with other engineers located in different sites/ timezones . You have strong analytical and problem-solving skills and are willing to learn and ready to take on problems. PREFERRED EXPERIENCE: 5+ Years of experience in relevant domain. Experienced with Blocklevel and Toplevel Physical implementation. Good understanding and hands-on experience in Lower node technologies. (7nm/5nm or below) Preferably working on Lowpower or processor designs. Proficient in Working with various EDA tools. Innovus, Fusion compiler/ICCompiler2, Primetime etc.., Scripting language experience: Perl, Ruby, Makefile , shell preferred. Exposure to leadership or mentorship is an asset ACADEMIC CREDENTIALS: Bachelors or Masters degree in computer engineering/Electrical Engineering #LI-SR4 Benefits offered are described: AMD benefits at a glance .

About Marvell . Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect This role is based in Bangalore - India. You will work with both local and global team members on the physical design of complex chips as well as the methodology to enable an efficient and robust design process. This position also provides an exciting platform to engage with diverse engineering challenges within a collaborative and innovative environment at Marvell. Key responsibilities include: Work with design teams across various disciplines such as Digital/RTL/Analog to ensure design convergence and integration in a timely manner. Implement/support designs with multi-voltage designs through all aspects of implementation (place and route, static timing, physical verification) using industry standard EDA tools. Work with RTL design teams to drive assembly and design closure. Provide technical direction, coaching, and mentoring to junior employees and colleagues when necessary to achieve successful project outcomes. Write scripts in Shell, Python, and TCL to extract data and achieve productivity enhancements through automation. What Were Looking For To be successful in this role you must: Bachelor s, Master s, or PhD degree in Electrical Engineering, Computer Engineering, or a related field. 9+ years of progressive experience in back-end physical design and verification. Expertise in full-chip & sub-hierarchy integration. Experience integrating and taping out large designs utilizing a digital design environment. Good understanding of RTL to GDS flows and methodology. Good scripting skills in Perl, tcl and Python. Good understanding of digital logic and computer architecture Knowledge of Verilog. Good communication skills and self-discipline contributing in a team environment. Experience with multi-voltage and low-power design techniques is a plus. Experience with Cadence Innovus is preferred. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

About Marvell . Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect In this role based in Bangalore - India, you will work with a global team on both the physical design of complex chips as well as the methodology to enable an efficient and robust design process. You will be responsible for maintaining, enhancing, and supporting Marvells Place and Route Flow, leveraging industry-standard EDA tools. Your tasks will include performing synthesis, place and route, as well as timing analysis and closure on multiple intermediate and complex logic blocks. You will play a crucial role in developing and implementing timing and logic ECOs, collaborating closely with the RTL design team to drive modifications that address congestion and timing issues. Additionally, your involvement with the global timing team will include debugging and resolving any block-level timing issues encountered at the partition level. This position provides an exciting platform to engage with diverse engineering challenges within a collaborative and innovative environment at Marvell. What Were Looking For Completed a Bachelor s Degree in Electronics/Electrical Engineering or related fields and have 4-8 years of related professional experience OR a Master s degree and/or PhD in Electronics/Electrical Engineering or related fields. In your coursework, you must have completed a digital logic course and projects that involved circuit design, testing, and timing analysis. Good understanding of standard Synthesis to GDS flows and methodology. Good scripting skills in languages such as Perl, tcl, and Python. Good understanding of digital logic and computer architecture. Hands-on experience in advanced technology nodes upto 2nm. Strong hands-on experience in blocks/subsystem P&R implementation using Cadence Innovus and Synopsys FC. Strong experience in block level signoff power, timing, PV closure & debugging skills. Good top level and full-chip experience is an added advantage Knowledge of Verilog/VHDL. Good communication skills and self-discipline contributing in a team environment. Ability to independently drive subsystems/IPs P&R and signoff closure working with global teams. Ability to mentor juniors and be involved in team development activities. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

Project Role : Application Lead Project Role Description : Lead the effort to design, build and configure applications, acting as the primary point of contact. Must have skills : Design for Testability (DFT) Good to have skills : NAMinimum 7.5 year(s) of experience is required Educational Qualification : 15 years full time education Summary :As an Application Lead, you will lead the effort to design, build, and configure applications, acting as the primary point of contact. Your day will involve overseeing the application development process, coordinating with team members, and ensuring project milestones are met. Roles & Responsibilities:Bachelors degree in computer science, Electronics Engineering or related fields and 6+ years of related professional experience.Thorough knowledge on various DFT/Test architecture solutions and should be involved in DFT-Architecture definition of at-least couple of DesignsCore DFT skills considered crucial for this position should include some of the following Scan compression and insertion, Memory BIST, Logic BIST, JTAG/IJTAG, at-speed test, ATPG, fault simulation, back-annotated gate-level verification, silicon debugUnderstanding of DFT Flows and Methodologies and Experience with Cadence/Mentor/Synopsys Tool set (Genus,Modus,NCSim / DC,Tessent,Spyglass/Tmax)Experience coding in Verilog RTL, and scripting language like TCL, and/or PerlProficient in Unix/Linux environmentsStrong fundamentals in Digital Circuit Design and Logic Design are required. Professional & Technical Skills: - Must To Have Skills: Proficiency in Design for Testability (DFT)- Strong understanding of software development methodologies- Experience in leading and managing software development projects- Knowledge of technologies and tools used in software development- Excellent communication and interpersonal skills Additional Information:- The candidate should have a minimum of 5 years of experience in Design for Testability (DFT)- This position is based at our Chennai office- A 15 years full time education is required Qualification 15 years full time education

About Marvell Marvell s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Built on decades of expertise and execution, Marvell s custom Processor/ASIC solution offers a differentiated approach with a best-in-class portfolio of data infrastructure intellectual property (IP) and a wide array of flexible business models. In this unique role, you ll have the opportunity to work on both the physical design and methodology for future designs of our next-generation, high-performance processor chips in a leading-edge CMOS process technology, targeted at server, 5G/6G, and networking applications. What You Can Expect As a senior leader in the central physical design team, you will: Shape the long-term vision for physical design capabilities and infrastructure in alignment with company-wide technology strategy. Lead RTL-to-GDSII implementation for multiple SoC programs, overseeing synthesis, floorplanning, power grid design, place and route, clock tree synthesis, timing closure, power/signal integrity signoff, and physical verification (DRC/LVS). Provide strategic leadership and technical direction to physical design teams, ensuring successful and timely tapeouts of complex, high-performance SoCs. Mentor and develop engineering talent, fostering a culture of innovation, collaboration, and continuous improvement. Oversee team structure, hiring, performance management, and career development to build and retain a high-performing physical design organization. Drive cross-functional collaboration with design teams to influence design decisions and ensure successful project execution. Navigate and resolve cross-functional conflicts effectively, fostering alignment and maintaining momentum across diverse teams. Drive the development and adoption of next-generation physical design methodologies, flows, and automation to improve productivity and design quality. Manage project schedules, resources, and risk, ensuring alignment with business goals and customer requirements. Represent the physical design function in cross-org and executive-level discussions, contributing to long-term technology and product strategy. Collaborate with EDA vendors and internal CAD teams to evaluate and deploy new tools and technologies. What Were Looking For Bachelor s, Master s, or PhD degree in Electrical Engineering, Computer Engineering, or a related field. 18+ years of progressive experience in back-end physical design and verification, including significant leadership roles. Proven track record of leading and scaling physical design teams, managing complex SoC projects, and delivering high-quality tapeouts under aggressive schedules. Deep expertise in hierarchical physical design strategies, methodologies, and advanced process node challenges. In-depth understanding of current design technologies used in major foundries. Strong understanding of ASIC design flow, RTL integration, synthesis, and timing closure. In-depth knowledge of modern EDA tools and flows. Proficient in automation and scripting using Makefile, Tcl, Python, or Perl to enhance design efficiency and flow robustness. Strong communication and collaboration skills, with the ability to influence cross-functional teams and executive stakeholders. Experience in developing and deploying advanced physical design methodologies and flows. Familiarity with AI/ML-driven optimization in physical design tools is a plus. Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. #LI-MN1

We Are Hiring: Principal Engineers Chip Design (Back End / Front End / Analog IP/IC) Preferred Skills and Experience: Minimum 1+ years of experience in Project Management (Waterfall and Agile Hybrid methodology) Exposure to continuous improvement and cross-functional collaboration Educational Qualifications: Master's degree in VLSI Design from reputed institutes (IITs/NITs preferred) Bachelor's in Electronics and Communication or a related field 1. Job Title: Principal Engineer – Chip Design Back End Required Skills & Experience: Minimum 8+ years of strong experience in backend flows for MCU or low-power SoC designs Leadership experience with DFT, Physical Design, and Formal Verification teams Exposure to Frontend and Analog design processes Ability to collaborate effectively across functional teams Experience in product support during both pre- and post-production stages (including RMA support) 2. Job Title: Principal Engineer – Chip Design Front End Required Skills & Experience: Minimum 8+ years of experience in system architecture for ARM-based MCU product development Expertise in RTL design, RTL coding, and RTL integration Strong debugging and design capabilities Experience leading verification teams, including static and dynamic verification, test management (UPF, GLN, Test Modes) Familiarity with industry-standard EDA tools (e.g., Synopsys for LINT, CDC, SDC validation, and power analysis) Exposure to Backend and Analog design processes Cross-functional collaboration with PD, DFT, and STA teams for timing and power closure Experience in pre- and post-production product support and RMA handling 3. Job Title: Principal Engineer – Analog IP/IC Design Required Skills & Experience: Minimum 8+ years of experience in custom analog/mixed-signal IC design Proficiency in variation-aware design, verification planning, and analog layout parasitic extraction (LPE) Hands-on experience with analog/mixed-signal EDA tools (e.g., Cadence, Synopsys) Strong debugging and design validation skills Product support experience across development lifecycle, including RMA stage

Physical Deisgn Lea LocationBangalore / Hyderabad / Pune Experience - 8+ YoE In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floor planning, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification. Should have experienceon Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl. Must have hands-on experience on Synopsys/Cadence tools. (Innovus, ICC2, Primetime, PT-PX, Calibre). Well versed with timing constraints, STA and timing closure. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl Well versed with timing constraints, STA and timing closure. Do 1. Lead end to end VLSI components & hardware systems a. Design, analyze, develop, modify and evaluate the VLSI components and hardware systems b. Determine architecture and logic design verification through software developed for component and system simulation c. Analyze designs to establish operating data, conducts experimental tests and evaluates results to enable prototype and production VLSI solutions d. Conduct system evaluations and make appropriate recommendations to modify designs or repair equipment as needed e. Allocates modules for testing and verification and reviews data and project documentation f. Provides guidance on technical escalations and review regression testing data g. Prepares documentation containing information such as test case and product scripts for IP and publishes it to the client for feedback and review h. Ensures all project documentation is complete and uploaded as per technical specifications required by the client 2. Provide customer support & governance of VLSI components & hardware systems a. Identify and recommend system improvements to improve technical performance b. Inspect VLSI components & hardware systems to ensure compliance with all applicable regulations and safety standards c. Be the first point of contact to provide technical support to client and help debug specific, difficult in-service engineering problems d. Evaluate operational systems, prototypes and proposals and recommend repair or design modifications based on factors such as environment, service, cost, and system capabilities 3. Team Management a. Resourcing i. Forecast talent requirements as per the current and future business needs ii. Hire adequate and right resources for the team iii. Train direct reportees to make right recruitment and selection decisions b. Talent Management i. Ensure 100% compliance to Wipros standards of adequate onboarding and training for team members to enhance capability & effectiveness ii. Build an internal talent pool of HiPos and ensure their career progression within the organization iii. Promote diversity in leadership positions c. Performance Management i. Set goals for direct reportees, conduct timely performance reviews and appraisals, and give constructive feedback to direct reports. ii. Incase of performance issues, take necessary action with zero tolerance for will based performance issues iii. Ensure that organizational programs like Performance Nxt are well understood and that the team is taking the opportunities presented by such programs to their and their levels below d. Employee Satisfaction and Engagement i. Lead and drive engagement initiatives for the team ii. Track team satisfaction scores and identify initiatives to build engagement within the team iii. Proactively challenge the team with larger and enriching projects/ initiatives for the organization or team iv. Exercise employee recognition and appreciation Deliver No. Performance Parameter Measure 1. Verification Timeliness, Quality and coverage of verification, Compliance to UVM standards, Customer responsiveness 2. Project documentation and MIS 100% on time MIS & report generation Complete Project documentation (including scripts and test cases) 3. Team % trained on new skills, Team attrition %, Employee satisfaction score (ESAT) Mandatory Skills: VLSI Physical Place and Route. Experience5-8 Years.

NVIDIA has continuously reinvented itself. Our invention of the GPU sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. Today, research in artificial intelligence is booming worldwide, which calls for highly scalable and massively parallel computation horsepower that NVIDIA GPUs excel. NVIDIA is a learning machine that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life s work , to amplify human creativity and intelligence. As an NVIDIAN, you ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join our diverse team and see how you can make a lasting impact on the world! NVIDIA is seeking passionate, highly motivated, and creative design engineers to be part of a team working on industry-leading GPUs and SOCs. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of exceptional people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of computing. What youll be doing: In this position, you will expected to lead all block/chip level PD activities. PD activities includes floor plans, abstract view generation, RC extraction, PNR, STA, EM, IR DROP, DRCs & schematic to layout verification. Work in collaboration with design team for addressing design challenges. Help team members in debugging tool/design related issues. Constantly look for improvement in RTL2GDS flow to improve PPA. Troubleshoots a wide variety up to and including difficult design issues and applied proactive intervention. Responsible for all aspects of physical design and implementation of GPU and other ASICs targeted at the desktop, laptop, workstation, and mobile markets. What we need to see: BE/BTECH/MTECH, or equivalent experience. 4+ years of experience in Physical Design. Strong understanding in the RTL2GDSII flow or design implementation in leading process technologies. Good understanding of the RTL2GDSII concepts related to synthesis, place & route, CTS, timing convergence, layout closure. Expertise on high frequency design methodologies. Good knowledge and experience in Block-level and Full-chip Floor-planning and Physical verification. Working experience with tools like ICC2/Innovus, Primetime/Tempus etc used in the RTL2GDSII implementation. Strong knowledge and experience in standard place and route flows ICC2/Synopsys and Innovus/Cadence flows preferred. Well versed with timing constraints, STA and timing closure. Good automation skills in PERL, TCL, tool specific scripting on one of the industry leading Place & Route tools. Ability to multi-task and flexibility to work in global environment. Good communication skills and strong motivation, Strong analytical & Problem solving skills. Proficiency using Perl, Tcl, Make scripting is preferred.

Summary / Role Purpose As a Product Specialist II , you will be part of the team responsible for overall development and validation of Ansys EDA Products. This involves working with Software developers, Architects, Application Engineers, and Semiconductor Customers, from ideation all the way to final product release and deployment. Key focus areas will include all areas related to IP/SoC/3DIC Power Integrity, Signal Integrity, Reliability aspects like EM/ESD/Thermal, Advanced timing/jitter, Packaging - the top challenges for any chip design on advanced nodes like 7/5/3 nm. Key Duties and Responsibilities Be part of Product Engineering Team that Works with Global-Customers / IP-providers / Foundries to understand design challenges of cutting-edge SoCs & 3DICs on 7/5/3 nm and creates EDA product specifications. Works with Software developers to develop state-of-the-art EDA products solving Power-Noise-Reliability challenges across Chip-Package-System Works on Ansys-Seascape platform - Semiconductor Industry s First and Only True Big-Data design Platform! Performs in-depth validation to ensure Product meets accuracy and other requirements. Collaborates with Application Engineers to support Global Customers in solving their design challenges on leading edge SoCs. Minimum Education/Certification Requirements and Experience Bachelor s/Master s degree in Electronics Engineering/VLSI from Top Institutions (NITs/IITs and likes) Strong problem-solving skills Good programming skills Excellent verbal and written communication skills Preferred Qualifications and Skills Passion to learn and deploy new technologies. Ability for minimal travel 2-3 years of prior experience in either of a) ASIC Physical design, b) Power-Integrity / Signal-Integrity / Reliability Closure c) Custom circuit design and simulation At Ansys, we know that changing the world takes vision, skill, and each other. We fuel new ideas, build relationships, and help each other realize our greatest potential. We are ONE Ansys. We operate on three key components: our commitments to stakeholders, our values that guide how we work together, and our actions to deliver results. As ONE Ansys, we are powering innovation that drives human advancement Our Commitments: Amaze with innovative products and solutions Make our customers incredibly successful Act with integrity Ensure employees thrive and shareholders prosper Our Values: Adaptability: Be open, welcome what s next Courage: Be courageous, move forward passionately Generosity: Be generous, share, listen, serve Authenticity: Be you, make us stronger Our Actions: We commit to audacious goals We work seamlessly as a team We demonstrate mastery We deliver outstanding results

Bring substantial experience in effective team management to help mentor, coach and grow the Physical Design and Implementation team with an emphasis on positive influence on team morale and culture Will be responsible for delivering silicon for a wide range of applications Primarily a management position, however, the candidate is required to have significant RTL to GDSII knowledge to probe into technical details Candidate will be required to collaborate and foster good relationship with all parts of engineering: Architecture team, Front End Design teams and Program management Qualifications Minimum 15 years of ASIC physical design experience Minimum 5 years of management experience with leading a physical design and implementation teams from RTL-to-GDSII Should have excellent collaboration and teamwork capabilities across various chip development disciplines. Will be responsible to hire talent and mentor, build expertise, and grow each team member Ability to define and drive flows and methodologies to optimize physical design work, define guidelines and checklists, drive execution, and track progress Ability to resolve design and flow issues related to physical design through the identification of potential solutions and drive resolution Experience in working with the front-end teams to understand chip architecture and drive physical aspects early in the definition cycle Experience working relationships with EDA Vendors Multiple successful tape out Excellent communication (oral and written) skills Ability to present to and interface with internal customers Ability to handle a dynamic environment and to coordinate team action Bachelor s Degree in Electrical Engineering or closely related discipline is required Masters Degree in Electrical Engineering or closely related discipline is preferred Company Overview MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the world s communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications. We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the world s most challenging communication technology problems in the most efficient and effective manner. MaxLinear began by developing the world s first high-performance TV tuner chip using standard CMOS process technology. Others said we couldn t achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, we ve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, we ve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intel s Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers needs. Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Waltham, Massachusetts; Vancouver, Canada; Valencia, Spain; Bangalore and Chennai, India; Villach, Austria; Munich, Germany; Israel; and Singapore. We have approximately 1,500 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market.

Job Description. Arm’s CE-Systems DFT team implements DFT for test chips and hard macros to prove out Arm soft IP power, performance, area, and functionality within the context of an SoC using the latest DFT and process technologies. The DFT team works closely with RTL, Verification, Physical Implementation, and Test engineering teams throughout the life cycle of a project, from an early investigation stage all the way through tape-out and silicon test/characterization on ATE.. Responsibilities. Architect, implement, and validate innovative DFT techniques on test chips as well as hard macros. Insert DFT logic into SoC style designs at the RTL level and at the Synthesis gate level, validate all features, and generate ATE targeted test patterns to be run on silicon. Work closely with front-end design and verification teams on DFT RTL level insertion, back-end synthesis, place-and-route, and static-timing-analysis teams on gate level insertion and timing closure, and Test and Debug teams on silicon characterization and validation.. Required Skills And Experience. This role is for a Senior Principal DFT Engineer with 15+ years of experience in Design for Test. Experience coding Verilog RTL, TCL and/or Perl. Proficient in Unix/Linux environments. Core DFT skills considered for this position should include some of the following Scan compression and insertion, Memory BIST and repair scheme implementation, Logic BIST, JTAG/IJTAG, at-speed test, ATPG, fault simulation, back-annotated gate level verification, silicon debug, memory and scan diagnostics. Bachelors or Master’s degree or equivalent experience in Electronic Engineering, Computer Engineering, or a related field. “Nice To Have” Skills and Experience. Familiarity with IEEE 1149, 1500, 1687, 1838. Synthesis & Static Timing Analysis. Familiarity with SoC style architectures including multi-clock domain and low power design practices.. Validated understanding of Siemens DFT tools. Familiarity with Arm IP like the following Cortex CPUs, Mali GPUs, AMBA protocols, CoreLink interconnects, CoreSight debug. Experience with 2.5D and 3D test. Ability to work both collaboratively on a team and independently. Hard-working and excellent time management skills with an ability to multi-task. An upbeat demeanor to working on exciting projects on the cutting edge of technology. Experience with Siemens, Cadence, and/or Synopsys DFT and simulation tools. In Return. We are proud to have a set of behaviors that reflect our culture and guide our decisions, defining how we work together to defy ordinary and shape outstanding!. Partner and customer focus. Teamwork and communication. Creativity and innovation. Team and personal development. Impact and influence. Deliver on your promises. Accommodations at Arm. At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email accommodations@arm.com . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.. Hybrid Working at Arm. Arm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.. Equal Opportunities at Arm. Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.. Show more Show less

Job Description. Our Solutions Engineering Physical IP team comprises some of the industry’s leading experts in deep submicron circuit design. This position is a wonderful opportunity for you to work with our custom standard cell design engineering team on innovative technologies. Your work will have a significant lasting impact as the designs will be used in Solutions Engineering products servicing the infrastructure, client, automotive, and IoT market segments.. In this role, you will take significant responsibility for the technical leadership and strategic direction within the team. You will proactively identify and drive improvements in design processes, methodologies, and infrastructure to ensure continued excellence and innovation.. Responsibilities. Lead technical strategy and decision-making for key product or functional areas in standard cell development. Drive improvements to methodologies, tools, and processes, proactively inspiring change across project teams and related functions. Act as a recognized technical guide and mentor within your area, providing guidance and direction to other specialists across the team. Collaborate closely with multiple teams, projects, and partners across Arm, significantly influencing broader organizational outcomes. Develop Arm custom standard cells in the latest, sub-3nm process technology nodes. Co-optimize circuit designs with physical design engineers to improve PPA of Arm cores integrated into best-in-class SoCs. Closely collaborate with the mask design team for optimal layout tuning, library view characterization, modeling, and QA validation using diverse EDA tools. Required Skills And Experience. 10+ years of relevant circuit design experience (for BSEE), 8+ years (for MSEE).. Proven track record of providing technical leadership and strategic oversight on complex projects or across multiple teams.. Significant experience in identifying, designing, and verifying cells specifically targeted to improve core and SoC-level PPA.. In-depth understanding of MOSFET electrical characteristics, transistor-level device physics, PPA tradeoffs, layout, and variability especially at 3nm and below.. Expertise in transistor-level design of static circuits, including state-retaining elements like latches and flops.. Extensive hands-on development experience with standard cell EDA view characterization, modeling, and QA.. Proficiency with standard cell characterization tools and Spice circuit simulators.. Strong proficiency in scripting languages such as Perl or Python.. Demonstrated ability to independently resolve complex design and project issues, influencing decisions across multiple projects or departments.. Ability and willingness to proactively mentor and support the development of team members.. Demonstrated positive attitude, respect for team members, continuous skill development, and ability to handle diverse responsibilities effectively.. Strong analytical skills with the ability to clearly present conclusions and recommendations.. “Nice To Have”. Experience leading multi-functional technical initiatives, influencing senior customers, and handling project timelines and risks.. Exposure to physical design implementation flow and signoff.. Accommodations at Arm. At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email accommodations@arm.com . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.. Hybrid Working at Arm. Arm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.. Equal Opportunities at Arm. Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.. Show more Show less