6.0 - 11.0 years

12 - 22 Lacs

Bengaluru

Work from Office

Role & responsibilities PCB Layout Design for Power Electronics: Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS). Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications. Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits. Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for high-reliability applications. Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing. PCB Layout for RF & High-Speed Designs: Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range). Implement micro strip, strip line, coplanar wave guides, and controlled impedance routing. Optimize layouts for minimum crosstalk, reflection, and insertion loss. Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements. Conduct EMI simulations and compliance testing to meet RF regulatory standards. PCB Layout for Analog & Mixed-Signal Circuits: Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces. Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance. Optimize high-precision data acquisition and mixed-signal PCB layouts. Ensure minimized parasitic capacitance and inductance in sensitive analog circuits. Thermal & Mechanical Considerations: Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications. Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions. Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management. Design Validation & Compliance: Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis. Collaborate with fabrication and assembly vendors to ensure high-yield production. Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms. Preferred candidate profile Specific expertise required for functional domain: PCB layout tools: Altium Designer, Cadence Allegro, Mentor Xpedition, KiCad, Eagle, or OrCAD. Power electronics PCB design: High-voltage (>96V), high-current layouts, creepage/clearance design. RF PCB layout: Controlled impedance, high-frequency design, shielding, and SI/PI analysis. Analog circuit PCB layout: Low-noise routing, precision signal integrity, and EMI/EMC mitigation. DFM/DFA considerations: PCB stack-up design, material selection, thermal & mechanical integration. Simulation tools: Ansys SIwave, HyperLynx, LTspice, CST Studio, Keysight ADS for RF/mixed-signal analysis. Knowledge of PCB fabrication & assembly: HDI, flex-PCB, rigid-flex, metal core PCBs (MCPCB).

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