Bonding/RDL routing/Package Interface Aarna Hr Solutions

2.0 - 5.0 years

4 - 7 Lacs

Bengaluru, Karnataka, India

On-site

Description The Bonding/RDL Routing/Package Interface role is crucial for developing innovative packaging solutions in the semiconductor industry. The candidate will be responsible for designing and optimizing bonding and routing strategies, ensuring effective integration of package interfaces, and collaborating with various teams to deliver high-quality products. Responsibilities Design and optimize bonding and routing strategies for advanced packaging solutions. Collaborate with cross-functional teams to ensure seamless package interface integration. Analyze and troubleshoot issues related to RDL routing and bonding processes. Develop and maintain documentation for bonding and routing methodologies and best practices. Conduct testing and validation of package interfaces to ensure reliability and performance. Skills and Qualifications Bachelor's degree in Electrical Engineering, Electronics, or a related field. Strong understanding of semiconductor packaging processes and materials. Proficiency in CAD tools for layout design and simulation (e.g., Cadence, Mentor Graphics). Experience with RDL (Re-distribution Layer) design and bonding techniques. Knowledge of electrical and thermal performance analysis for package interfaces. Familiarity with IPC standards related to electronic packaging.

Posted 1 week ago

Apply

Start Your Job Search Today

Browse through a variety of job opportunities tailored to your skills and preferences. Filter by location, experience, salary, and more to find your perfect fit.