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Bonding/RDL routing/Package Interface Aarna Hr Solutions

2.0 - 5.0 years

4 - 7 Lacs

Bengaluru, Karnataka, India

On-site

Description The Bonding/RDL Routing/Package Interface role is crucial for developing innovative packaging solutions in the semiconductor industry. The candidate will be responsible for designing and optimizing bonding and routing strategies, ensuring effective integration of package interfaces, and collaborating with various teams to deliver high-quality products. Responsibilities Design and optimize bonding and routing strategies for advanced packaging solutions. Collaborate with cross-functional teams to ensure seamless package interface integration. Analyze and troubleshoot issues related to RDL routing and bonding processes. Develop and maintain documentation for bonding and routing meth...

Posted 3 months ago

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