Technical lead - Electronics TAK Technologies

9.0 - 14.0 years

9 - 15 Lacs

noida, greater noida, delhi / ncr

Work from Office

Job Description: We are seeking an experienced Team Lead with expertise in FPGA (Xilinx) and Embedded Linux to drive the development of a thermal imaging system comprising a thermal core, FPGA-based Accelerator, and an embedded Linux Multicore SOM. The system Shall process thermal images and display them on an OLED screen. Leading a team of development engineers, define architecture, ensure seamless integration between FPGA and Linux subsystems and deliver a high-performance, low-latency thermal imaging HW and SW solution. Key Responsibilities: Leading team of FPGA, Embedded Linux, and firmware engineers in designing and developing the thermal imaging software for the defined Architecture. Architect and implement real-time thermal image processing pipelines on Xilinx FPGA (Zynq/Artix/Kintex) and multicore ARM based SOM. Develop and optimize embedded Linux drivers and middleware for thermal data acquisition, processing, and display. Interface thermal sensors (e.g. LYNRED/ FLIR Lepton/IADIY series UC Bolometer cores,) with FPGA and Embedded Linux subsystems. Implement low-latency DMA, image processing algorithms (NUC, AGC), Noise cancellation Algorithm and display drivers. Ensure seamless FPGA-Linux communication (AXI, UART, SPI, I2C,USB, custom IP cores). Define and enforce coding standards, version control (Git) and CI/CD pipelines. Optimise system performance for power, latency, and throughput. Collaborate with hardware engineers on PCB design, signal integrity, and thermal management. Conduct design reviews, assist in debugging, and validation with HW and SW tools. Review Design Documentation. Required Skills & Experience: Min 10 years in FPGA (Xilinx Vitis/Vivado) + Embedded Linux development. Strong expertise in real-time image processing (thermal preferred). Hands-on experience with: Xilinx SoCs (Zynq, MPSoC), AXI, VHDL/Verilog, HLS (C/C++) Embedded Linux (Yocto, Buildroot), Device Drivers, U-Boot, Kernel Modules Sensor interfacing (I2C, SPI, MIPI), DMA, and low-level optimisations OLED,HDMI display controllers Proficiency in Python/C/C++ for embedded applications. Experience with thermal imaging cores. Knowledge of bare board bring-up, SW and HW debugging. Prior work in defence, medical, or industrial thermal imaging is desirable . Experience with AI/ML acceleration on FPGA (TensorFlow Lite, PyTorch).will be added advantage. Education: Bachelors/Masters in ECE, Electrical Engineering, or Computer Science .

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