298 Lvs Jobs - Page 9

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains"“ LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux "“ Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills 3+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. General Summary PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains"“ LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux "“ Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 12+ years Hardware Engineering experience or related work experience. 12+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Overview: WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. AMD together we advance_ Responsibilities: An exciting internship opportunity to make an immediate contribution to AMD's next generation of technology innovations awaits you! We have a multifaceted, high-energy work environment filled with a diverse group of employees, and we provide outstanding opportunities for developing your career. During your internship, our programs provide the opportunity to collaborate with AMD leaders, receive one-on-one mentorship, attend amazing networking events, and much more. Being part of AMD means receiving hands-on experience that will give you a competitive edge. Together We Advance your career! Job Title: Physical Verification Co-op Engineer Location: Bangalore Company: AMD India Pvt Ltd. About Us: AMD is at the forefront of the chip-making industry, dedicated to advancing technology through innovation and excellence in engineering. We are seeking a highly skilled Physical Verification Methodology Engineer to develop and enhance verification methodologies and support our design teams through successful tape-outs. THE ROLE: As a Physical Verification Methodology Engineer, you will be responsible for developing, implementing, and maintaining robust physical verification methodologies. You will collaborate with design teams to ensure smooth verification processes and provide support throughout the tape-out phase. Your role will be pivotal in enhancing the efficiency and reliability of our verification flows. THE PERSON: You are a team player who has excellent interpersonal skills and experience collaborating with other engineers located in different sites and timezones. You have strong analytical and problem-solving skills, willingness to learn and ready to take on problems. You are highly motivated to push the envelope and technically supervise the junior engineers within the team. KEY RESPONSIBILITIES: Develop and refine physical verification methodologies, including DRC, LVS, and ERC, to meet design requirements and industry standards. Provide comprehensive support to design teams, ensuring seamless integration of verification methodologies into the design flow. Assist in resolving complex verification issues and guide teams through debugging processes. Work closely with EDA tool vendors to enhance tool capabilities and address specific verification challenges. Automate verification processes through scripting and tool customization to improve efficiency and accuracy. Generate detailed documentation and training materials for design teams. Ensure compliance with industry standards and best practices in physical verification. Participate in tape-out reviews and provide critical feedback to ensure successful tape-outs. Qualifications: Master’s/Bachelor’s Degree in Electronics Engineering Extensive experience in physical verification and methodology development within the semiconductor industry. Proficiency with industry-standard verification tools such as Calibre, Mentor Graphics, or ICV , Synopsys. Strong debugging skills and in-depth knowledge of DRC/LVS/ERC methodologies. Experience with scripting languages (TCL, Perl, Python) for automation purposes. Excellent problem-solving abilities and attention to detail. Strong communication and collaboration skills. Preferred Experience: Knowledge of PowerVia and 3DStack concepts. Proven track record in supporting design teams through successful tape-outs. Familiarity with layout editing tools such as DesignREV and ICVWB Qualifications: Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Skills : Functional specifications of the IPs, subsystems and SOC, Reviewing and Revising, System Verilog, UVM, Performing RTL simulations using Synopsys and Cadence simulators, Performing UPF

• Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS is a must. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. TSMC 3nm/5nm7nm/16nm Finfet & 3+ exp 3nm Provident fund Health insurance Annual bonus

About The Role Responsibilities may be quite diverse of a technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school. Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum QualificationsB.E/ B.Tech Electronics/Electrical/VLSI Design Engineering with 3+ years of relevant experience in Analog and IO IP design e.g. GPIOs, Thermal Sensor, PLL, ADC/DAC/ Voltage regulators/LDOs, LVDS etc.Preferred Qualifications:Analog Device and Metal Layout FundamentalsAnalog/Mixed Signal FundamentalsReliability Verification.Cadence Virtuoso Layout Suite Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

About The Role Works in the area of Software Engineering, which encompasses the development, maintenance and optimization of software solutions/applications. 1. Applies scientific methods to analyse and solve software engineering problems. 2. He/she is responsible for the development and application of software engineering practice and knowledge, in research, design, development and maintenance. 3. His/her work requires the exercise of original thought and judgement and the ability to supervise the technical and administrative work of other software engineers. 4. The software engineer builds skills and expertise of his/her software engineering discipline to reach standard software engineer skills expectations for the applicable role, as defined in Professional Communities. 5. The software engineer collaborates and acts as team player with other software engineers and stakeholders. Works in the area of Software Engineering, which encompasses the development, maintenance and optimization of software solutions/applications.1. Applies scientific methods to analyse and solve software engineering problems.2. He/she is responsible for the development and application of software engineering practice and knowledge, in research, design, development and maintenance.3. His/her work requires the exercise of original thought and judgement and the ability to supervise the technical and administrative work of other software engineers.4. The software engineer builds skills and expertise of his/her software engineering discipline to reach standard software engineer skills expectations for the applicable role, as defined in Professional Communities.5. The software engineer collaborates and acts as team player with other software engineers and stakeholders. About The Role - Grade Specific Is fully competent in it's own area and has a deep understanding of related programming concepts software design and software development principles. Works autonomously with minimal supervision. Able to act as a key contributor in a complex environment, lead the activities of a team for software design and software development. Acts proactively to understand internal/external client needs and offers advice even when not asked. Able to assess and adapt to project issues, formulate innovative solutions, work under pressure and drive team to succeed against its technical and commercial goals. Aware of profitability needs and may manage costs for specific project/work area. Explains difficult concepts to a variety of audiences to ensure meaning is understood. Motivates other team members and creates informal networks with key contacts outside own area. Skills (competencies) Verbal Communication

Analog Mixed Signal Layout Location: Bangalore, Hyderabad, Noida Skills/Experience: Independent layout development of High Speed blocks like SerDes, Rx, Tx, , PLL, ADC, LDO, Bandgap etc Strong debug skills and good communication Experience (years) : 3 - 7 Years Education Qualification: BE/B-Tech/ME/M-Tech degree in Electronics and Communication, Electrical Engineering, or related field.

Description: Role and Responsibilities Collaborating with the global team to coordinate the complete layout of the plant while maintaining effective team. • Excellent communication skills, along with hands-on expertise, are required, and being a team player is crucial. • Responsible for Layout design and development of critical analog and custom digital block. • Perform layout verification like LVS/DRC/Antenna, quality check and documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation, and execution to meet project schedule/milestones in multiple project environment. • Guide junior team-members in their execution of Sub block-level layouts & review their work. • Contribute to effective project-management. • Effectively communicating with Global engineering teams to assure the success of layout project. Qualification/Requirements 7 to 8-year experience in memory/analog/custom layout design in advanced CMOS process. • A strong understanding of memory design methodology and related issues is important. • The candidate should be well-versed in various levels of memory layouts, including custom memory bits, leaf cells, control blocks, read-write components, sense amplifiers, and decoders. • Should have hands on experience in creating layout of critical blocks such as Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier etc., • Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS is a must. • Good understanding of Analog Layout fundamentals (e.g., Matching, Electro-migration, Latch-up, coupling, crosstalk, IR-drop, active and passive parasitic devices etc.) • Understanding layout effects on the circuit such as speed, capacitance, power, and area etc., • Ability to understand design constraints and implement high-quality layouts. • Excellent command and problem-solving skills in physical verification of custom layout. • Multiple Tape out support experience will be an added advantage. • Excellent verbal and written communication skills. Education BE or MTech in Electronic/VLSI Engineering Must Haves: MANDATE: • A strong understanding of memory design methodology and related issues is important. • The candidate should be well-versed in various levels of memory layouts, including custom memory bits, leaf cells, control blocks, read-write components, sense amplifiers, and decoders.

Microcircuits technology is looking for DFT Engineers to join our dynamic team and embark on a rewarding career journey. Research and draft blueprints, engineering plans, and graphics. Develop test prototypes. Identify solutions to improve production efficiency. Use design software to develop models and drawings of new products. Maintain existing engineering records and designs. Assess all engineering prototypes to determine issues or risks. Estimate cost limits and budgets for new designs. Supervise the manufacturing process of all designs. Coordinate with other engineers, management, and the creative department.

Role & responsibilities Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. • Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS is a must. • Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. • Responsible for on-time delivery of block-level layouts with acceptable quality. • Excellent problem-solving skills in physical verification of custom layout. • Demonstrate high quality and accurate execution to meet project schedule/milestones in multiple project environment. • Ability to guide junior team-members in their execution of Sub block-level layouts & review critical items. • Contribute to effective project-management. • Effectively communicating with Local engineering teams to assure the success of layout project. Educational Background • BE or MTech in Electronic/VLSI Engineering • 5 + year experience in analog/custom layout design in advanced CMOS process. NOTE: **custom layout or analog layout with TSMC 3nm/5nm7nm/16nm Finfet & 5+ exp **** TSMC 3nm Exp - MANDATORY Preferred candidate profile Only Immediate Joiner Perks and benefits

Skills/Experience: Create emulation models from RTL / Netlist. Expertise in mapping designs to Zebu/Palladium/Haps emulation, improving model performance. Knowledge of the Palladium flow and experience in migrating design on Palladium. Good knowledge of runtime and debug skills. Identifying signals and taking wave dumps on palladium platforms and analyse the failures. Exposure to ARM/ARC cores and its architecture Exposure to AMBA bus architectures like AXI/AHB/APB Exposure to bug tracking tools like Jira and version control tools like Github, Bitbucket, GIT Exposure to Flash(NAND) and HDD(Hard disk) like storage technologies. Experience with Palladium like emulation platforms(Veloce or Zebu or Haps) Understanding of JTAG based debuggers Experience (years) : 3 - 12 Years Education Qualification: BTECH/MTECH in Electrical/Electronics/Computer Science Engineering or Equivalent

1. Hands on work on custom layout for analog blocks like High Speed SerDes and General purpose IO designs with Cadence Virtuoso on latest technologies like 5nm and below and also take leadership roles in delivery of IPs 2. Work on Floor planning, power design, signal routing strategy, EMIR awareness andparasitic optimisations 3. Understand and apply analog Layout techniques to ensure the design meets performance with minimum possible area and good yield. 4. Participate in building and enhancing layout flow for faster, higher quality design process. 5. Checking physical verifications like DRC/LVS/ERC/ANT/DFM and other IBM internal checks 6. Collaborate with Circuit Designers to solve challenging problems 7. Writing SKILL/PYTHON scripts to automate repetitive tasks 8. Work with Place and Route engineer to integrate custom macros into top level. 9. Able to perform design reviews across global team 10. Work closely with required global teams to ensure the success of the whole product. 11. Leadership in delivery of macros we plan to own from India Job requirements: 1. Experience in doing layouts for analog blocks like SerDes, ADCs, DACs, LDOs, PLLs, BGAP & amplifiers etc. 2. Experience in designing layouts for high-speed circuits is a plus. 3. Layout experience in the following technology nodes3nm, 5nm and 7nm FinFET. 4. Good team worker with multi-discipline, multi-cultural and multi-site environments 5. Strong fundamental knowledge in semiconductor device physics, layout principles, IC reliability and failure mechanisms 6. Good problem-solving skills are essential where problems are analysed upfront, identifying gaps, and providing optimum solutions 7. Knowledge in Skill/perl/tcl/Python scripting is a plus. Required education Bachelor's Degree Preferred education Bachelor's Degree Required technical and professional expertise The Analog layout design engineer with experience in next generation Ultra high speed serial IO link (HSS) interface for Cognitive, ML,DL, and data center applications. The engineer needs to have knowledge in the design and development full custom analog layouts for ultra high speed 32G/50G/112G IO link interfaces. Preferred technical and professional experience Experience in 7 and 14 nm analog layout design. Working on Cutting edge technology and HSS domain . Quick learner, deep layout design knowledge, problem solving skills and good communication skills with cross teams across the Geos.

About The Role Designs, develops, and builds digital circuits for custom blocks including SRAM, register files, memory compilers, and caches. Designs floorplans, performs circuit design, schematic entry, simulation for major blocks, and verifies functionality to optimize custom circuit for power, performance, area, timing, and yield goals. Creates block level DFT models, develops memory test tools, and improves and automates flows and methodologies to ensure streamlining of design. Collaborates cross functionally to report design progress and to collect, track, and resolve any performance and memory circuit design issues. Optimizes performance, power, and area, reduce leakage of circuits, and drive characterization of individual memory instances and memory compilers. Works with architecture and layout teams to design circuit for best functionality, robustness, and electrical capabilities. Qualifications The candidate must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum qualifications Must have a Bachelors (B.Tech) in Electronics or Masters (M.Tech) in Electrical, Microelectronics or VLSI Engineering. B.Tech with 8+ years and M. Tech with 6+ years' experience required. 6+ years' experience with scripting (Perl, tcl etc. 6+ years' experience in memory design convergence tools including formal equivalence verification, static timing methodology, electrical reliability and robustness analysis. 6+ years' experience with transistor level operation, memory bitcell design, design challenges under process variations and low power circuit techniques, Innovative architectural proposals, driving layouts and its driven decisions. Preferred Qualifications Some experience in scripting, compiler understanding and hands on experience in coding tilers. Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

About The Role In this position, you will be responsible for managing and working on all aspects of STA and timing closure activities of Intel SoCs in lower technology nodes. Your tasks will include but not limited to: Design and Architecture understanding, Interaction with FE/DFT/Verification teams, Clocking, Constraints development, ACIO Timing, Understanding on synchronous and asynchronous paths, Clock domain crossing issues. Understanding and debugging extraction issues, deciding timing signoff modes and corners, Design margins, Hierarchical timing including IO budgeting for partitions. Drive the designs to timing closure, interacting/supporting synthesis and APR team during timing closure cycle, timing ECOs, Timing model build, Timing signoff and quality checks. You will also be part of debug/troubleshoots for a wide variety of tasks up to and including difficult/critical design issues and proactive intervention, as required. Qualifications EducationB.Tech. or M.Tech. in Electrical/Electronics Engineering with 10-14 years' of experience.PreferenceMaster's Degree in Electrical/Electronics Engineering with VLSI/microelectronics specialization, with 10+ years of experience in STA.Key Skills: In-depth knowledge and hands-on experience with the overall silicon implementation flows and methodologies such as STA, Synthesis, Clocking is required. Good understanding and exposure of overall Timing closure cycle in SoC. Good scripting skills in TCL/Perl/Shell. Expertise in STA signoff tools (PT/ETS). Skill in Synopsys tools (PT/DC) and exposure to ICC will be an added advantage. Solid understanding of the process and design interactions as they relate to target frequency and interaction with timing paths and resulting leakage and power trade-offs. Solid technical and good communication skills. Inside this Business Group The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

About The Role Designs, develops, and builds analog circuits in advanced process nodes for analog and mixed signal IPs.Designs floorplans, performs circuit design, extracts chip parameters, and simulates analog behavior models.Creates test plans to verify design according to circuit and block microarchitecture specifications and evaluates test results.Verifies functionality to optimize circuit for power, performance, area, timing, and yield goals.Collaborates cross functionally to report design progress and collects, tracks, and resolves any performance and circuit design issues.Optimizes performance, power, area, and reduces leakage of circuits. Works with architecture and layout team to design circuit for best functionality, robustness, and electrical capabilities. Qualifications Qualifications:B.Tech with 3+ years or M.Tech with 2+ Years of hands-on experience in high-speed analog circuit design, with a proven track record of successful projects.Expertise in designing and verifying analog circuits such as High-speed transmitter, recevier, amplifiers, PLLs, voltage regulators, and data converters.Proficiency in using EDA tools like Cadence Virtuoso, SPICE, or Synopsys. Inside this Business Group The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

We are seeking an Analog Layout Engineer 3-8 for designing PMIC, converters, high-speed clocking circuits, and analog modules in FinFET, CMOS, and BiCMOS/BCD technologies Strong skills in layout, parasitic extraction, and verification tools required. Perks and benefits Competitive Salary Referral program Insurance

* Perform Sub system level floor planning, placement, and routing for high-performance microprocessor design. * Collaborate with cross-functional teams to achieve design goals. * Close the design to meet timing, power, and area requirements. * Implement engineering change orders (ECOs) to rectify functional bugs and timing issues. * Ensure the quality and efficiency of the RTL to GDS2 implementation process. Required education Bachelor's Degree Preferred education Master's Degree Required technical and professional expertise 8+ years of industry experience Good knowledge and hands on experience in physical design , timing and methodology which include logic synthesis, placement, clock tree synthesis, routing , post route closure. Should be knowledgeable in physical verification ( LVS,DRC. etc) ,Noise analysis, Power analysis and electro migration . Good knowledge and hands on experience in static timing analysis (closing timing at chip level) good understanding of timing constraints . Should have experience in handling asynchronous timing, multiple corner timing closure. Preferred technical and professional experience Automation skills in PYTHON, PERL ,SKILL and/or TCL

About The Role In this role, you will be responsible for Timing methodology definition and closure of designs using industry standard tools for chiplet designs for custom and domain specific products. The chiplets will be leveraged to enable modular design and support multiple products. As part of this team, the candidate will work with leading edge technologies and solutions across multiple domains including SoC multi-die implementations (2.5 and 3D), power delivery, leading edge memory technologies, innovate thermal solutions, on die clocking, and fabrics. The team will also look at options to enhance product power/performance/area/cost thru improved tools and methodologies. The successful candidate would be expected to:Responsibilities1. Drive PV convergence/signoff, including static timing, ERC checks, ECO flows and power analysis2. Defining clock frequencies, PV guard-banding, signoff PV corners, ERC checks, Clock/Reset domain crossing design constraints3. Develop and recommend design methodologies to enable more efficient and faster design convergence4. Scripting in an interpreted language (TCL, py)5. Ability to work independently and at various levels of abstraction6. Strong analytical ability and problem solving skills7. Ability to work effectively with both internal and external teams/customers is expected.8. Strong written and verbal communication skills9. Ability to mentor other engineers and technically guide them."" Qualifications Minimum Qualifications:1. Bachelor/Master degree in CS, CE or EE or equivalent experience2. 10+ years of Physical design experience with a strong understanding of digital circuits and proficiency in static timing analysis (STA) tools like PrimeTime or Innovus.3. Experience with signoff corner selection, PV guard-banding, PV convergence, including static timing and power analysis4. Strong experience in SoC and ASIC design flows on taped out designs5. Expertise in timing closure at block/chip level and ECO flows6. Experience with scripting in an interpreted languagePreferred Qualifications:1. Experience with full chip integration, die-to-die and package integration level timing signoff 2. Hands-on experience with synthesis, block and chip level implementation with industry standard PnR flows and tools 3. Strong experience in CPU and GPU design flows on taped out designs4. Design tools and methods development 5. Capable of working in a high performing team to deliver the results required from the organization. Inside this Business Group The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies"”spanning software, processors, storage, I/O, and networking solutions"”that fuel cloud, communications, enterprise, and government data centers around the world. Other Locations IN, Hyderabad Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

About The Role You will be part of ACE India, in the P- Core design team driving Intel's latest CPU's in the latest process technology. In this position, you will be responsible for timing analysis and convergence of complex partitions. Your responsibilities will include but not limited to: 1. Responsible for timing execution and convergence including setup and hold for over 5GHz Freq and low-power digital designs. 2. Deep understanding of Static timing analysis concepts 3. Timing Convergence across all HVM targets 4. Closely work with SD, Integration and Floor plan teams Qualifications Qualifications You must possess a master's degree in electrical or Electronics Engineering with at least 8 or more years of experience in related field or a bachelor's degree with at least 10 years of experience. Technical Expertise in Static Timing Analysis is preferred. Should have minimum of 2 years experience in leading the Team of at least 3-4 people Preferred additional skills Experience of handle complex core design, high-speed designs Timing signoff flows/tools experience both/either Synopsys/Cadence tools Very good knowledge on Timing tools, flows and methodology Ability to handle new feature feasibility studies SD flow knowledge would be plus Familiarity with Verilog/VHDL Tcl, Perl, Python scripting Strong verbal and written communication skills Inside this Business Group The Core and Client Development Group (C2DG) is a worldwide organization focused on the development and integration of SOCs, Core „¢, and critical IPs that power Intel's leadership products, driving most of the Client roadmap for CCG, Delivering Server First Cores that enable continued growth for DCG and invest in future disruptive technologies.

Role and Responsibilities Responsible for Design and development of critical analog, mixed-signal, custom digital block and full chip level integration support. Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Guide junior team-members in their execution of Sub block-level layouts & review their work Contribute to effective project-management. Effectively communicating with Global engineering teams to assure the success of layout project. Qualification/Requirements 8 to 15 years' experience in analog/custom layout design in advanced CMOS process, in various technology nodes (Planar, FinFET ) Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS is a must. Should have hands on experience in creating layout of critical blocks such as Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier etc., Good understanding of Analog Layout fundamentals (e.g., Matching, Electro-migration, Latch-up, coupling, crosstalk, IR-drop, active and passive parasitic devices etc.) Understanding layout effects on the circuit such as speed, capacitance, power and area etc., Ability to understand design constraints and implement high-quality layouts. Ability to understand design hierarchy and different architectures for Memory designs. Excellent command and problem-solving skills in physical verification of custom layout. Multiple Tape out support experience will be an added advantage. Experience in managing multiple layout projects, ensuring quality checks are taken care at all stages of layout development. Excellent verbal and written communication skills. Education BE or MTech in Electronic/VLSI Engineering All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. 8 to 12 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. 8+ years hands-on experience of different PnR steps including Floorplanning, Power planning, Placement & Optimization, CTS, Routing, Static timing analysis, Post route optimization, ECO implementation and DRC closure Well versed with high frequency design & advanced tech node implementations In depth understanding of PG-Grid optimization, including identification of high vs low current density paths & layer/via optimization, Adaptive PDN experience In depth knowledge of custom clock tree including H-tree, SPINE, Multi-point CTS, Clock metrics optimization through tuning of CTS implementation. Well versed with tackling high placement density/congestion bottlenecks In depth knowledge of PnR tool knobs/recipes for PPA optimization Experience in automation using Perl/Python and tcl Good communication skills and ability & desire to work in a cross-site cross-functional team environment. Education Requirements Required:Bachelor's, Electrical Engineering or equivalent experience

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 2 to 5 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language