1 Ic Package Jobs

Setup a job Alert
JobPe aggregates results for easy application access, but you actually apply on the job portal directly.

HCLTech logo
IC Package Design Eng HCLTech

5.0 - 10.0 years

11 - 21 Lacs

bengaluru

Work from Office

Role & responsibilities IC Package Layout Design Engineer Good understanding of package/substrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage. Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C. Good Exposure to Stackup design, substrate DFM, DFA rules and adherence. Should have expertise in constraint setting in layout tool. Preferred candidate profile Experinec in IC Package Layout Design, Substrate Design, Flip Chip, Wire bond, Cadence APD ...

Posted 2 days ago

AI Match Score
Apply
cta

Start Your Job Search Today

Browse through a variety of job opportunities tailored to your skills and preferences. Filter by location, experience, salary, and more to find your perfect fit.

Job Application AI Bot

Job Application AI Bot

Apply to 20+ Portals in one click

Download Now

Download the Mobile App

Instantly access job listings, apply easily, and track applications.

Google Play App Store

Featured Companies

View All Companies