35 Ic Design Jobs - Page 2

> If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates. Requisition ID: 74529 Staff Digital IC Design Engineer Seeking an experienced Digital IC design engineer for architecting and developing complex mixed signal ICs for Power, Isolation and Infrastructure applications. This person will work in a design group at the forefront of Powering the A.I., EV and Energy revolution, working to develop technologies that will revolutionize various end markets by enabling new levels of power efficiency. Responsibilities Derive requirements and architecture for Digital sub system from product specification and requirements. Interface with analog design teams to understand the interface requirements between analog and digital domains. Work with the team members to fine-tune the overall design leading to efficient implementation and verification cycles. Acts as a technical chip lead, manage chip and block schedule as needed to ensure on time tape out. Develops innovative new designs for patenting or protecting as trade secrets. Participates and contributes to product definition. Creates good documentation and reports on design results through design reviews. Attends design reviews to provide input and learn from other designers experiences. Research design techniques through technical publications and seminars Educational Background BTech and 8+ years experience MTech and 6+ years experience PhD and 3+ years experience Minimum Requirements Strong motivation to contribute to all facets of chip design from conceptualization to release to production Working knowledge of digital IC circuit design in an HDL synthesis environment Ability to develop RTL code and understand how RTL will map to gate-level structures Knowledge of scripting/language (Python, PERL, shell, TCL) Deep understanding of the digital design flow from architecture through RTL design, verification, synthesis, timing closure, PR preparation and scan insertion Experience with Verilog, System Verilog and functional coverage Developed and executed comprehensive product and block level verification plans Knowledge of mixed signal concepts and digital-analog interfaces Experience in AMS modelling and verification Good verbal and written communication skills, positive attitude, desire to learn, and willingness to work on a team Additional skills (one or more of these are highly desirable) Competence in high-level languages (e.g., MATLAB, C), scripting languages (e.g., Tcl, Perl, Python, SKILL), and version control systems (e.g., SVN, SOS) Working knowledge of System Verilog and/or UVM Experience with digital design verification, and full-chip mixed-signal verification. Experience with digital IO interfaces such at SPI, I2C etc. Competence in exploring digital and system/architecture trade-offs such as memory size (ROM, RAM, FLASH, OTP, cache), clock speed, multiple clock domains, and the necessity for dedicated logic and DSP. Experience with both digital front end and back-end tools Familiarity with DSP techniques and algorithms Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Job Segment: Front End, Design Engineer, Electrical Engineering, Network, Telecom, Technology, Engineering

Job Area: Engineering Services Group, Engineering Services Group > Layout Engineer General Summary: Develops block, macro, or chip level layouts and floorplans according to project requirements, specifications, and design schematics. Applies understanding of design manuals, established processes, layout elements, and basic electronic principles to create accurate designs that meet project needs. Conducts analyses, tests, and verifies designs using different tools and techniques to identify and troubleshoot issues, and stays abreast of new verification methods. Works with multiple internal and external stakeholders to align on projects, provide updates, and resolve issues. Minimum Qualifications: Bachelor's degree in Electrical Engineering, Computer Science, Mathematics, Electronic Engineering, or related field and 2+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. OR Associate's degree in Computer Science, Mathematics, Electrical Engineering or related field and 4+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. OR High School diploma or equivalent and 6+ years of experience designing custom layouts in relevant domain (e.g., analog, mixed signal, RF, digital design), or related work experience. 2+ years of experience using layout design and verification tools (e.g., cadence, LVS, rmap). Solid experience of 3 to 6 years in developing high speed IO/ESD/Analog layout design. Expertise in working on FinFet layouts in lower nodes, preference to TSMCN 7nm and below. Expertise in using the best and latest features of Cadence VXL and Calibre DRC/LVS. Basic understanding of IO/ESD designs. Knowledge on Basic SKILL/PERL. Capable of working independently and with team and getting work done with contract work force. The ability to work & communicate effectively with global engineering teams.

Manage Silicon/Solution project through full life cycle from inception to mass production In your new role you will: Manage Silicon/Solution project through full life cycle from inception to mass production Lead product development projects with significant complexity, risk and noticeable impact for the WCS organization Look at the bigger picture, with business in mind, in order to identify challenges and work closely with your stakeholders to come-up with solutions Identify, scope, prioritize (drive, if necessary) manufacturing improvement i n yield, quality, cost and capacity Conduct a forward-looking risk management to identify possible mitigation measures and/or backup scenarios Assume full responsibility for your projects by continuously assessing the progress and adjusting the project plan to ensure that goals are met even in the face of challenges. You are best equipped for this task if you have: A degree in Electrical Engineering, Physics, Microelectronics or similar At least 6 years of professional experience related including 4 years of leading projects and project teams A formal PM certification (e.g. IPMA or PMI) or training or hands on Project Management experience is plus Hands-on project management experience in the arena of mixed signal ASIC development. Experience with IC Design, ASIC flow is a plus. Experience with larger cross functional projects and inter-disciplinary teams a plus. Leadership skills, a strong driver mentality and a proven ability for on-time delivery Experience in managing crisis situations and conflicts Great intercultural competencies and communication skills and bring your messages across with excellent English skills Ability to thrive in a matrix organization Willingness to travel if needed

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 2-4 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3+ yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills. Applicants :Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. 6 - 18 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills. Applicants :Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 8+ years of experience in IC design. 2-4 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills. Applicants :Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Project Manager Design Job Description In your new role you will: Manage Silicon/Solution project through full life cycle from inception to mass production Lead product development projects with significant complexity, risk and noticeable impact for the Look at the bigger picture, with business in mind, in order to identify challenges and work closely with your stakeholders to come-up with solutions Conduct a forward-looking risk management to identify possible mitigation measures and/or backup scenarios Assume full responsibility for your projects by continuously assessing the progress and adjusting WCS organization Identify, scope, prioritize (drive, if necessary) manufacturing improvement in yield, quality, cost and capacity the project plan to ensure that goals are met even in the face of challenges. Your Profile You are best equipped for this task if you have: A degree in Electrical Engineering, Physics, Microelectronics or similar At least 6 years of professional experience related including 4 years of leading projects and project teams A formal PM certification (e.g. IPMA or PMI) or training or hands on Project Management experience is plus Hands-on project management experience in the arena of mixed signal ASIC development. Experience with IC Design, ASIC flow is a plus. Experience with larger cross functional projects and inter-disciplinary teams a plus. Leadership skills, a strong driver mentality and a proven ability for on-time delivery Experience in managing crisis situations and conflicts Great intercultural competencies and communication skills and bring your messages across with excellent English skills Ability to thrive in a matrix organization. Contact: Jyoti.vimal@Infineon.com #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: "¢ Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Additional About The Role : 7-14 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills.

Candidate should have very good experience in Physical design activities of block and SoC level. Should be well experienced in floor-planning, partitioning, placement, clock tree synthesis, route , physical verification and all signoff checks closure. Experience with tools such as Innovus/Encounter, ICC, Caliber, LEC, Primetime etc is highly desirable. Full chip tape out experience based on 5nm/7nm/16nm technologies is preferred. Candidate would be required to work on various phases of SOC physical design activities of top level & block level - floor-planning, partitioning, placement, clock tree synthesis, route, physical verification (LVS/DRC/ERC/Antenna etc). Should have excellent problem solving skill to help through congestion resolution and timing closure. Candidate should be able to meet congestion, timing and area metrics of design. Would be required to do equivalence checks, STA, Crosstalk delay analysis ,noise analysis, power optimization. Should be able to implement timing and functional ECOs. In this role, the Engineer will apply Broadcoms proven design methodology and milestone flow to meet Broadcoms rigorous criteria for achieving Right-first time silicon. Candidate should be able to work independently and guide other team members. Should be experienced in working in a global team and dynamic environment. Should possess ability to learn and adapt to new tools and methodologies. Excellent communication skill is a must. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.