11 Fusion Compiler Jobs

As an R&D Engineer at Synopsys, you play a crucial role in driving innovation in the field of physical design, with a focus on high-performance cores and IPs. Your deep understanding of physical design, coupled with your expertise in place & route, timing closure, and power optimization, enables you to tackle complex design challenges with ease. Your proficiency in low-power, high-performance design, particularly with advanced nodes under 5nm, sets you apart in the industry. Your responsibilities include developing and implementing innovative methodologies for high-performance cores and IPs, collaborating with a global team to enhance Performance, Power, and Area (PPA) metrics, and utilizing advanced technologies and tools to improve design quality and process efficiency. You will contribute to both flow development and the implementation of complex IPs, addressing critical design challenges using Synopsys implementation tools. Your impact as an R&D Engineer at Synopsys is significant, as you drive innovation in high-performance core and IP implementation methodologies, enhance the efficiency and predictability of the implementation process, and contribute to the development of cutting-edge semiconductor technologies. By solving complex design challenges and supporting the continuous advancement of Synopsys" technological capabilities, you play a key role in achieving best-in-class PPA and TAT targets. To excel in this role, you must possess deep knowledge of physical design, place & route, timing closure, and power optimization, along with experience in low-power, high-performance design and advanced nodes under 5nm. Proficiency in industry-leading tools like Fusion Compiler, Primetime, and Formality, as well as scripting languages such as TCL, Perl, and Python, is essential. A BS or MS in Electrical Engineering or a related field with 5+ years of relevant experience is required. Additionally, your self-motivation, strong investigative and problem-solving skills, enthusiasm for learning new technologies, and excellent communication skills in English are crucial attributes for success in this role. Joining the global team at Synopsys, you will contribute to the advancement of state-of-the-art high-performance cores and IPs implementation. Working with industry-leading tools and technologies, you will be part of a team focused on developing innovative methodologies to implement CPUs/GPUs and interface IPs efficiently. Your role will involve tackling complex design challenges, improving PPA metrics, and achieving best-in-class targets, thereby contributing to the continuous enhancement of Synopsys" technological capabilities.,

You should have 3+ years of experience in RTL, UPF & Physical aware Synthesis for cutting-edge technology nodes, logic equivalence checking, Scripting, and Netlist Timing Signoff. Proficiency in Python/Tcl is required. You should be familiar with Synthesis tools such as Fusion Compiler/Genus and have fair knowledge in LEC, LP signoff tools. Proficiency in VLSI front-end design steps including Verilog/VHDL, Synthesis, QoR optimization & Equivalence Checking is essential. Familiarity with standard software engineering practices like Version Control, Configuration Management, Regression is a plus. You should be sincere, dedicated, and willing to take up new challenges. Minimum Qualifications: - Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR - Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR - PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Qualcomm is an equal opportunity employer that provides reasonable accommodations for individuals with disabilities during the application/hiring process. If you require accommodations, you may contact Qualcomm at disability-accommodations@qualcomm.com. Qualcomm expects its employees to adhere to all applicable policies and procedures, including security and confidentiality requirements regarding Company confidential information and other proprietary data. Please note that Qualcomm's Careers Site is for individuals seeking jobs at Qualcomm. Staffing and recruiting agencies are not authorized to use this site for submissions. Qualcomm does not accept unsolicited resumes or applications from agencies. For more information about this role, kindly contact Qualcomm Careers. 3074295,

Qualcomm India Private Limited is a leading technology innovator that drives digital transformation to create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will be involved in planning, designing, optimizing, verifying, and testing electronic systems, circuits, mechanical systems, and various other cutting-edge technologies to launch world-class products. Collaboration with cross-functional teams is essential to develop solutions that meet performance requirements. The ideal candidate should hold a Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or a related field. We are seeking PDN engineers with EMIR and PG planning expertise and a minimum of 4 years of experience. Responsibilities include IR signoff for CPU/high-performance cores, Signal EM & Power EM Signoff for Chip TOP level & Block level CPU/DSP, Development of PG Grid spec for different HM, and validating PG Grid and IR Drops. Additionally, working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations is crucial to enhance PDN Design. The desired skill set includes hands-on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level, proficiency in scripting languages like Tcl and Perl, and familiarity with tools such as Redhawk, Redhawk_SC, Innovus, and Fusion Compiler. The ability to communicate effectively with global cross-functional teams and experience in Power Planning/Floorplanning and Physical Verification is an added advantage. Qualcomm is an equal opportunity employer committed to providing accessible accommodations for individuals with disabilities during the application/hiring process. If you require assistance, please contact disability-accommodations@qualcomm.com. Abiding by all applicable policies and procedures, including security requirements, is expected from Qualcomm employees. Please note that our Careers Site is exclusively for individuals seeking job opportunities at Qualcomm. Staffing and recruiting agencies are not authorized to submit profiles, applications, or resumes through this platform. Unsolicited submissions will not be considered. For more information about this role, please reach out to Qualcomm Careers directly.,

Qualcomm India Private Limited is seeking a Hardware Engineer to join their Engineering Group, specifically focusing on Hardware Engineering. As a Qualcomm Hardware Engineer, you will be responsible for planning, designing, optimizing, verifying, and testing electronic systems including circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems to contribute to the development of cutting-edge, world-class products. Collaboration with cross-functional teams to meet performance requirements is a key aspect of this role. Key responsibilities for this position include: - IR Signoff CPU/high performance cores - Signal EM & Power EM Signoff for Chip TOP level & Block level CPU/DSP and other HMs - Development of PG Grid spec for different HM - Validating the PG Grid using Grid Resistance & Secondary PG Resistance Checks - Validating the IR Drops using Static IR, Dynamic IR Vless & VCD Checks for validating Die & Pkg Components of IR Drops - Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design - Good knowledge on PD would is desirable - Proficiency in Python, Perl, TCL The ideal candidate should possess the following qualifications and skills: - Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field - 4+ years of experience in PDN engineering with EMIR and PG planning expertise - Hands-on experience in PDN Signoff using Redhawk/RHSC/Voltus at block level/SOC Level - Good understanding of Power Integrity Signoff Checks - Proficiency in scripting languages (Tcl and Perl) - Familiarity with Innovus for RDL/Bump Planning/PG eco - Ability to effectively communicate with global cross-functional teams - Experience with tools such as Redhawk, Redhawk_SC, Innovus/Fusion Compiler, Power Planning/Floorplanning, and Physical Verification Qualcomm is an equal opportunity employer and is committed to providing accessible processes for individuals with disabilities. If you require accommodations during the application/hiring process, please contact disability-accommodations@qualcomm.com or Qualcomm's toll-free number. It is essential for Qualcomm employees to adhere to all applicable policies and procedures, including confidentiality requirements. Staffing and recruiting agencies are advised not to use Qualcomm's Careers Site for submissions, as unsolicited applications will not be considered. For more information about this role, please reach out to Qualcomm Careers directly.,

Qualcomm India Private Limited is seeking a Hardware Engineer to be a part of the Engineering Group, specifically in the Hardware Engineering team. As a Qualcomm Hardware Engineer, you will be involved in various aspects of planning, designing, optimizing, verifying, and testing electronic systems. This role will require you to work on circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems to contribute to the development of cutting-edge, world-class products. Collaboration with cross-functional teams is essential to develop solutions that meet performance requirements. To be considered for this position, you must have a minimum of a Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or a related field, along with at least 3 years of Hardware Engineering or related work experience. Alternatively, a Master's degree with 2+ years of experience or a PhD with 1+ year of experience in the same fields will also be considered. Proficiency in Synthesis, LEC, Low power checks, Memory BIST insertion, Constraints validation, and the development of signoff quality constraints and power intent constraints is required. Experience with TCL script development, RTL development, or Physical Design will be advantageous. The ideal candidate should have at least 6 years of experience in Hardware Engineering. Qualcomm is an equal opportunity employer and is committed to providing reasonable accommodations for individuals with disabilities during the application/hiring process. If you require an accommodation, please contact disability-accommodations@qualcomm.com. Qualcomm expects its employees to adhere to all applicable policies and procedures, including those related to the protection of company confidential information. Please note that Qualcomm's Careers Site is intended for individuals seeking job opportunities directly with Qualcomm. Staffing and recruiting agencies are not authorized to submit profiles, applications, or resumes through the Careers Site. Unsolicited submissions from agencies will not be accepted. For more information about this role, please reach out to Qualcomm Careers directly.,

Job Title: Physical Design Engineer PnR / STA Location: Bangalore Experience: 6 - 10 Years Notice Period: 015 Days (Immediate joiners preferred) Job Type: Full-Time | Onsite Job Description: We are looking for a skilled Physical Design Engineer with strong experience in Place & Route (PnR) and Static Timing Analysis (STA) to join our growing silicon engineering team. The ideal candidate will take ownership of block-level or full-chip implementation and timing closure for high-performance, low-power SoCs. Key Responsibilities: Drive RTL to GDSII flow for block-level or full-chip implementation Perform floorplanning, placement, clock tree synthesis (CTS), routing, and physical verification (LVS/DRC) Execute timing closure using PrimeTime (STA) and handle multi-mode, multi-corner (MMMC) analysis Develop and optimize power, performance, and area (PPA) Collaborate closely with RTL, DV, DFT, and backend teams to resolve implementation and timing issues Work on advanced node technologies (7nm/5nm/3nm) with signoff-quality methodologies Create scripts for flow automation and report generation Required Skills: Hands-on experience with industry-standard tools (Innovus, ICC2/Fusion Compiler, PrimeTime, RedHawk/Voltus) Strong knowledge of PnR flow , STA , RC extraction , and signal/power integrity Solid understanding of timing constraints (SDC) and timing exceptions Familiarity with low-power design techniques, multi-voltage domains, and UPF Experience with scripting languages: Tcl , Perl , Python Strong problem-solving skills and ability to work in a fast-paced team environment Preferred Qualifications: Bachelor’s/Master’s degree in Electronics, Electrical, or VLSI Engineering Tapeout experience on multiple SoC designs Exposure to hierarchical and flat design methodologies Why Join Us? Work on high-volume SoCs with leading semiconductor teams Exposure to cutting-edge EDA tools and latest technology nodes Transparent career growth path and technical mentorship Competitive compensation and work-life balance.

Providing Customer Support and Collaborating with R&D teams to drive product development for wide deployment. Demonstrating differentiated PPA results to showcase our technologys superiority. Providing technical support to key global customers to address PPA bottlenecks and design challenges on the most advanced designs. Aggressively engaging in worldwide critical benchmarks and deployments to ensure the highest quality and performance of designs. Utilizing scripting languages such as Perl and Tcl for automation and optimization tasks. Staying updated with the latest advancements in ASIC design flow, VLSI, and CAD development to continually improve processes. The Impact You Will Have: Enhancing the performance and efficiency of Fusion Compiler designs. Driving innovations that contribute to the success of Synopsys cutting-edge technologies. Providing critical support that helps key customers overcome their PPA challenges. Contributing to the development of new features that keep Synopsys at the forefront of the industry. Improving the overall quality and reliability of our products through meticulous design and optimization. Fostering strong relationships with global customers, reinforcing Synopsys reputation as a leader in chip design and software security. What You ll Need: BS/MS in Electrical Engineering or Computer Science with 4+ years of relevant experience. Hands-on experience with synthesis and place and route (P&R) tools. Proficiency with EDA tools such as DC, FM, ICC2, and Fusion Compiler. Knowledge of advanced placement and routing rules. Experience with scripting languages like Perl and Tcl. Strong understanding of ASIC design flow, VLSI, and CAD development. Never give-up attitude and flexibility in supporting worldwide engagements. Who You Are: Excellent communicator with strong command of English. Highly motivated and self-driven. Detail-oriented with a focus on quality and performance. A team player who thrives in collaborative environments. Adaptable and eager to learn new technologies and methodologies.

The successful candidate: - has solid engineering understanding of the underlying concepts of IC design,implementation flows and sign-off methodologies for deep submicron design. - has intimate knowledge of the full design cycle from RTL to GDSII, including development of timing constraints - has good scripting & programming skills (Perl, Tcl, Python etc); knowledge of CAD automation methods. - Can interface with the larger product team to understand design constraints, deliverable formats, customer requirements - Independent, timely decision maker and able to cope with interrupts - Knowledge of IP Subsystem implementation & FE flows are added advantages 8+ years of hands-on experience in ASIC physical implementation and EDA tools with recent contribution to project tape-outs.Must demonstrate knowledge of the Synopsys tools, flows and methodologies including Design Compiler, IC Compiler/2, Fusion Compiler, Primetime, Formality, Star-RCXT, Hercules/ICV and other industry tools.

Greeting with HCL Tech! We were looking somebody who is having experience in Physical design Experience: 4 to 10 Years Location: Kochi JD#1 : 4-6years Tapeout experience in block level PnR implementation including synthesis for medium to complex blocks Good to have experience in TSMC/Intel lower technology node(16/14nm or below) Experience in independently analyzing/resolving congestion, timing issues and basic understanding of clock tree build Basic Timing understanding to independently analyze timing paths Experience in ICC2/Innovus/DC tools, Fusion compiler being added advantage Basic equivalency check understanding. Good to have Conformal LEC experience. Should have understanding of basic shell scripting, tool based TCL scripting to automate redundant tasks JD#2 : 6-10years Tapeout experience in full chip floorplan/full chip partitioning flow. Experience in die-size estimation spread sheet IP based and synthesis based Experience in IO/Bump planning & placement, custom analog/PG planning and route implementation Experience in ICC2/Innovus/DC tools, Fusion compiler being added advantage Experience in RDL routing Experience in interfacing with cross functional teams and block PnR teams Good understanding of basic shell scripting, tool based TCL scripting to automate all custom activities Experience in version control systems Experience in managing/mentoring small teams

Principal Physical Design Engineer Greater Bangalore -Hybrid/Hyderabad (Hybrid ) PrincipalPhysical Design Engineer Company Background We are a well-funded, stealth-mode startup based in Mountain View, CA, founded by senior technical and business executives hailing from category leaders in infrastructure semiconductors and hyperscale cloud services, and backed by top-tier investors with an immensely successful formula & track record on early-stage investments. We are a diverse team of expert chip/software/systems architects and developers who excel in hardware/software solution co-design. Our team has built, and delivered into production, technologies that process over half of the world's global data center traffic. Summary Join an ambitious and highly experienced team of silicon and hyperscale data center systems experts as a Physical Design Engineer. Our team is motivated by a singular mission: to revolutionize the performance and scalability of next-generation distributed computing infrastructure. You have the opportunity to build a groundbreaking new category of product, working alongside some of the industry's most talented hardware and software engineers to create truly disruptive infrastructure solutions that delight our customers. We are looking for talented, motivated engineers with experience in physically implementing large-scale networking and computing semiconductor products, and who are looking to grow in a fast paced, dynamic startup environment. We are looking for experienced physical design engineers who have the range to contribute across the full lifecycle of complex chip development, from CAD tool flow setup, early floorplan exploration in conjunction with microarchitecture development, through block partitioning, power planning, clock network design and construction, through P+R, timing closure, package design, PI/SI analysis, physical verification, and tapeout. Roles and Responsibilities Build and support the CAD tool flow for physical implementation in a cloud-first development environment. Work with architects and microarchitects on the chip-level floorplan and block partitioning. Evaluate tradeoffs in functional partitioning, block size, and interface complexity with other stakeholders. Define and construct the major physical structures, including the clock and reset architecture, the power delivery network, and interconnect topologies. Execute on block-level, cluster-level, and top-level physical implementation, from synthesis, floorplan and power plan, through P+R, through timing closure, physical verification, and tapeout. Interface with foundry and library partners on 3rd party IP and process technology issues, including updates to device models, IP integration requirements, and pre-tapeout signoff. Skills/Qualifications : Proven industry experience and successful track record in the physical implementation of large, high-performance network switching/routing fabrics (Ethernet, Infiniband, HPC), Network Interface Controllers, Smart-NICs, CPUs, or GPUs in the latest silicon process nodes. Deep experience with the latest CAD tools through the entire physical design workflow, e.g., Cadence Genus and Innovus, Synopsys ICC2/FusionCompiler, Tempus, PrimeTime SI, PrimeTime PX, StarRC, ICV, Calibre. Strong familiarity with various analysis tools such as Redhawk, Voltus. Experience with circuit analysis using HSPICE is a plus. Expert knowledge of SystemVerilog, as well as Perl, Python or other scripting languages. Minimum BSEE/CE + 15 years or MSEE/CE + 12 years experience. Proven track record of execution on products which have shipped in high-volume. Contact: Uday Mulya Technologies muday_bhaskar@yahoo.com "Mining The Knowledge Community"

Principal Physical Design Engineer Greater Bangalore -Hybrid/Hyderabad (Hybrid ) PrincipalPhysical Design Engineer Company Background We are a well-funded, stealth-mode startup based in Mountain View, CA, founded by senior technical and business executives hailing from category leaders in infrastructure semiconductors and hyperscale cloud services, and backed by top-tier investors with an immensely successful formula & track record on early-stage investments. We are a diverse team of expert chip/software/systems architects and developers who excel in hardware/software solution co-design. Our team has built, and delivered into production, technologies that process over half of the world's global data center traffic. Summary Join an ambitious and highly experienced team of silicon and hyperscale data center systems experts as a Physical Design Engineer. Our team is motivated by a singular mission: to revolutionize the performance and scalability of next-generation distributed computing infrastructure. You have the opportunity to build a groundbreaking new category of product, working alongside some of the industry's most talented hardware and software engineers to create truly disruptive infrastructure solutions that delight our customers. We are looking for talented, motivated engineers with experience in physically implementing large-scale networking and computing semiconductor products, and who are looking to grow in a fast paced, dynamic startup environment. We are looking for experienced physical design engineers who have the range to contribute across the full lifecycle of complex chip development, from CAD tool flow setup, early floorplan exploration in conjunction with microarchitecture development, through block partitioning, power planning, clock network design and construction, through P+R, timing closure, package design, PI/SI analysis, physical verification, and tapeout. Roles and Responsibilities Build and support the CAD tool flow for physical implementation in a cloud-first development environment. Work with architects and microarchitects on the chip-level floorplan and block partitioning. Evaluate tradeoffs in functional partitioning, block size, and interface complexity with other stakeholders. Define and construct the major physical structures, including the clock and reset architecture, the power delivery network, and interconnect topologies. Execute on block-level, cluster-level, and top-level physical implementation, from synthesis, floorplan and power plan, through P+R, through timing closure, physical verification, and tapeout. Interface with foundry and library partners on 3rd party IP and process technology issues, including updates to device models, IP integration requirements, and pre-tapeout signoff. Skills/Qualifications : Proven industry experience and successful track record in the physical implementation of large, high-performance network switching/routing fabrics (Ethernet, Infiniband, HPC), Network Interface Controllers, Smart-NICs, CPUs, or GPUs in the latest silicon process nodes. Deep experience with the latest CAD tools through the entire physical design workflow, e.g., Cadence Genus and Innovus, Synopsys ICC2/FusionCompiler, Tempus, PrimeTime SI, PrimeTime PX, StarRC, ICV, Calibre. Strong familiarity with various analysis tools such as Redhawk, Voltus. Experience with circuit analysis using HSPICE is a plus. Expert knowledge of SystemVerilog, as well as Perl, Python or other scripting languages. Minimum BSEE/CE + 15 years or MSEE/CE + 12 years experience. Proven track record of execution on products which have shipped in high-volume. Contact: Uday Mulya Technologies muday_bhaskar@yahoo.com "Mining The Knowledge Community"