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IC Package Design Eng HCLTech

5.0 - 10.0 years

8 - 18 Lacs

bengaluru

Work from Office

Role & responsibilities IC Package Layout Design Engineer Experience with IC Package Layout Design using Cadence Allegro APD (will consider Mentor Graphics XPD, XSI tools experience also) Good understanding of package/substrate design and package assembly rules related to flip chip designs. Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage. Expertise in High-Speed Complex PCB and Package designs with HDI, Blind and Buried Via technologies. Hands-on expertise with PCB and Package layout designs involving High Speed Parallel Bus interfaces including DDR, GDDR and HSIO interfaces including PCIe, SERDES and Type C. Good Exposure to Stac...

Posted 3 months ago

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