Semiconductor IC Package Design Engineer Izmo Microsystems Pvt Ltd.

5.0 - 7.0 years

10 - 20 Lacs

Bengaluru

Work from Office

Job Title: System-in-Package (SiP) Engineer - Semiconductor IC Package Design Location: Whitefield, Bangalore, India Tools Experience : Cadence APD/SIP MUST HAVE HAVE SYSTEM-IN-PACKAGE DESIGN EXPERIENCE. Company Overview: izmo Microsystems Pvt. Ltd. (www.izmomicro.com) is a pioneering semiconductor and systems company specializing in System-in-Package (SiP) miniaturization. With state-of-the-art facilities in Bangalore, we offer advanced 3D packaging solutions to meet the demands of high-density, high-performance systems across various industries, including consumer electronics, automotive, telecommunications, and green energy. Position Overview: We are seeking an experienced System-in-Package Engineer to lead the design and development of innovative SiP solutions. The ideal candidate will have a strong background in advanced packaging technologies and a proven track record of delivering high-performance SiP designs from concept to production. Key Responsibilities: Lead the design and layout of complex SiP solutions, including FCBGA and FCCSP packages, from initial concept through to tape-out. Collaborate with cross-functional teams, including digital designers, SI/PI engineers, and manufacturing teams, to define package requirements and ensure design integrity. Develop and optimize package layer stack-ups, padstacks, and design constraints to meet electrical and mechanical performance targets. Conduct feasibility studies, including fan-out analysis, mock-up designs, and package size reduction initiatives. Perform design rule checks (DRC), design verification, and ensure compliance with manufacturing and reliability standards. Drive continuous improvement in design methodologies and workflows, leveraging scripting and automation where applicable. Basic Qualifications: Bachelors or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field. Minimum of 5 years of experience with Cadence APD/SIP, with demonstrated ability to independently design and layout FCBGA/FCCSP packages. In-depth understanding of BGA package substrate technologies, assembly processes, and high-speed design principles. Familiarity with bill of materials (BOM), layer stack-ups, and design rules for high-speed applications. Working knowledge of package reliability, signal integrity (SI), and power integrity (PI) considerations. Strong problem-solving skills, with an entrepreneurial mindset and hands-on work ethic. Excellent teamwork and communication skills, with the ability to thrive in a dynamic, cross-functional environment. Preferred Qualifications: Experience with multi-chip modules, interposers, 2.5D, or heterogeneous package designs. Proficiency in scripting languages for design automation and reporting. Understanding of transmission line theory and SI/PI fundamentals. Why Join Us: At izmo Microsystems, you'll be at the forefront of semiconductor packaging innovation, working in a cutting-edge facility equipped with advanced technologies such as 3D die stacking and fine-pitch wire bonding. We offer a collaborative environment where your expertise will contribute to the development of next-generation electronic devices.

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