Technical Lead (PCB Layout) Johnson Controls

8.0 - 12.0 years

0 Lacs

maharashtra

On-site

You will be a key contributor to the design and development of high-speed, high-density printed circuit boards (PCBs) for embedded systems and IoT applications. You will work on designing Embedded Hardware Devices that will be used to integrate with the Building Automation units on the current architecture. This role involves working closely with cross-functional teams to deliver robust, manufacturable, and cost-effective PCB designs that meet performance and quality standards. Lead PCB Design Projects: Manage and execute PCB layout activities for rigid, flexible, and rigid-flex boards using advanced technologies (e.g., HDI, microvias, via-in-pad). Mentorship & Leadership: Mentor junior designers, conduct peer reviews, and ensure adherence to design best practices and standards. Tool Expertise: Utilize industry-standard tools Mentor Graphics Xpedition tool for schematic capture and PCB layout. Cross-functional Collaboration: Work closely with electrical, mechanical, and manufacturing engineers to resolve design issues and optimize for fabrication and assembly. Design Validation: Work closely with the manufacturing team to meet DFM/DFT and DFA checks. Perform impedance modeling, and thermal analysis to ensure robust and reliable designs. Documentation: Create and maintain design guidelines, templates, checklists, and project documentation. Process Improvement: Lead initiatives to evaluate and implement new design tools and methodologies. Supplier Interaction: Provide technical support to suppliers regarding PCB specifications and manufacturing queries. Work closely from Electrical and Mechanical aspects to create schematic symbols, PCB mechanical restriction guidelines, PCB component footprints and 3D component models. Responsible for completing PCB designs by agreed project time, cost, quality, and performance requirements. BE (ECE/EIE/EEE) - minimum 8+ years of experience in Mentor Graphics Xpedition tool. Knowledge of EMC/EMI design considerations. Very strong high-speed and multilayer layout skills including stack-up design, differential pair, impedance control, matched delay, etc. Strong understanding of signal integrity, power integrity, and thermal management. Experience with high-speed digital, analog, RF, and mixed-signal board designs. Familiarity with IPC standards and controlled impedance design. Experience in designing high-density boards that incorporate microcontroller, mixed-signal circuits, and peripherals such as Ethernet, USB, I2C, SPI, DDRx, etc. Solid knowledge in the board fabrication process. Strong communication skills to interact with colleagues, peers, and stakeholders in Global Engineering centers. Able to work efficiently independently as a team member and have the capacity to work on tight deadlines with high efficiency. Self-learner, able to work with autonomy, readiness for foreign/domestic travel for short/long-term basis. Excellent communication and project management skills. Nice to Have: Experience in Altium tool, Experience with Valor NPI or similar DFM tools.,

Posted 1 week ago

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