Job
Description
We are looking for Embedded Electronics Engineers in the team. In this role, it is expected that the candidate should have hands-on experience in electronics hardware design and development of digital analogue and mixed domain functional and performance circuits solutions. As a core member of EE team you will create design with microprocessors/ microcontrollers and peripheral interface such as memory devices, GPIO, power supply electronics and embedded systems bring-up. Responsibilities: 1. Designing and development of new hardware functional system for multiple products. 2. Collaborate with with the embedded software development team for Electronics hardware/ firmware co-design and system performance requirement translating to design implementation ; optimization. 3. Ability to synthesize user and technical performance hardware requirements and develop appropriate solutions. 4. Electronic component and circuit analysis to design functional sub-system by simulation and physical implementation. Requirements Skills: Must to have: 1. 2 years to 4+ years of experience in low-power circuit design, system bring-up, engineering-build integration and debug. 2. 2 years to 4+ years of experience driving design development from component selection, schematic capture, PCB layout and routing, Component foot-print for the product Electronics BoM through assembly. 3. 3+ of experience in Multi-layer, mixed-signal board-level design in Altium/ Eagle. 4. Experience of power topology: DC-DC, Flyback Converters, LDOs, etc. 5. Experience of Battery charger design, fuel gauge, analogue sensor instrumentation; protection circuits. 6. Hand-on experience in hardware implementation of embedded system data communication protocols such as 1-wire, I2C, SPI, UART, USB. 7. Experience of BDC/ BLDC or steppers motors, motor drive circuit design and its working principles. 8. Diverse experience in microcontroller/ microprocessor based circuit design and bring-up. Ideally from ST/ TI/ NXP/ Renesas and sensor interface on PCB assembly level. 9. Ability to design and implement smart sensors , sensors instrumentation like current, voltage signal conditioning, Time-of-Flight, Proximity, Position, ALS, etc on a PCB assembly level. 10. Knowledge about Design calculations/Documentation during Product Development Life Cycle milestones. 11.Knowledge of EMI- EMC and ESD standards and practices is a plus Good to have: 1. Strong communication and documentation skills and ability to operate independently. 2. Experience with RTOS 3. Experience with ESP32 and ESP-IDF . 4. Experience with portable, battery operated designs and power budgeting. 5. Knowledge about Wi-fi, Bluetooth, BLE, RF Antenna design Technologies is a plus. 6. Experience of Microphone and Speaker circuit design is a plus 7. Familiar with PCB fabrication technologies, Rigid-Flex PCBs, Flex Cables. 8. Hand-on experience of manufacturing process including DFM and DFT for consumer products at scale. 9. Familiar with MIPI Camera CSI and DSI interface implementation ; display Modules and their communication protocols; Audio signal processing interface.
