Qualification : BSc/Msc- Chemistry BE- Chemical Purpose of Position To monitor the plating chemical preparation, Chemical monitoring and maintenance, Chemical indent, conducting experiment etc. Ensure Plating chemistries are analysed, Monitored and controlled on regular basis in plating plant Specific Responsibilities Ensure that the Quality policy is understood, implemented, and practiced at all levels in the plating department. Establish and maintain documented procedures for the identification of chemicals at all stages in the plating department. Establish and maintain a documented procedure for process control in the plating department. Conduct a monthly review of trends in the plating chemicals and initiate corrective action for major deviations in the chemistry. Establish and maintain a documented procedure for handling, storage, preservation, and labeling of chemicals in the plating department. Maintain and control inventory of plating chemicals and safety equipment in the plating department. Ensure proper housekeeping and disposal of used chemical containers in the plant. Prepare a monthly statement of chemical consumption in-plant. Ensure Gold/Silver accountability norms are fixed and reported every month. Develop and maintain SOPs, WIs, and formats required for the lab. Participate in the goal-setting process for the department and strive for excellence. Maintain housekeeping standards and ensure safety measures. Specific Authorities: In charge of the Lab Authorized to analyze the plating baths and make chemical additions Authorized to update the Lab records Lab analytical chemicals ordering in Coupa Preparation and modification of the Lab and Chemicals storage & handling procedures (QMS/EHS) Authorized to operate ICP Lab and Chemical safety Draw chemicals from Main Chemical stores Gold addition to bath in the presence of Finance, WH, and Plating Manager or their representative Addition of Silver Potassium Cyanide. Skill Sets & Competencies Electroplating Process Knowledge : Understanding the fundamentals and practical aspects of electroplating. Chemistry Preparation : Skills in preparing and handling chemical solutions for plating. Process Parameters : Knowledge of factors influencing plating quality such as temperature, current density, and solution composition. Analytical Techniques : Proficiency in techniques including Atomic Absorption Spectroscopy (AAS), Inductively Coupled Plasma (ICP), pH measurement, turbidity measurement, conductivity measurement, Oxidation-Reduction Potential (ORP) measurement, wet analysis, and gravimetric analysis. Plating Experimentation : Experience with Hull Cell testing for evaluating plating quality. Troubleshooting : Ability to diagnose and resolve issues in the plating process. Plating Quality Requirements : Understanding quality standards and requirements for plating. Chemical Handling and Safety : Knowledge of proper handling, storage, and safety procedures for chemicals. 5S Housekeeping Technique : Familiarity with this technique for organizing and maintaining a clean workspace. SAP Exposure : Experience using SAP software for process management and reporting. Gold Accountability : Understanding of gold-related processes such as gold assay, variance, and stock reporting (advantageous). Performance Monitoring and Reporting : Skills in monitoring, controlling, and improving plating processes and chemicals. Process Validation and Revalidation : Experience with validating and revalidating electroplating processes. Basic Computer Skills : Proficiency in MS Office and other basic computer applications. QMS and System Requirements : Understanding of Quality Management Systems (QMS) and requirements specific to the plating area. IATF 16949 Compliance : Knowledge of and ability to execute requirements of the IATF 16949 standard for automotive quality management. EHS Compliance : Adherence to Environmental, Health, and Safety regulations.
