Job Title: Lead RTL to GDS Engineer Block/Sub-System Level Company: Wafer Space an ACL Digital Group Location: Bangalore, India Experience: 7+ - 20+ Years Notice Period: Immediate to 30 Days Compensation: Best in Industry Overview: Wafer Space, part of ACL Digital , is actively hiring a Lead RTL to GDS Engineer with deep expertise in block/subsystem-level physical design and signoff for advanced SoC designs (7nm and below). The role involves leading full RTL to GDSII implementation, owning delivery, mentoring junior engineers, and collaborating across functions. We’re looking for professionals who are passionate about driving execution quality, solving complex physical design challenges, and making impactful contributions in high-performance silicon projects. Key Skills & Responsibilities: Technical Responsibilities: Lead end-to-end RTL to GDSII implementation at block/subsystem level. Perform synthesis, floorplanning, placement, CTS, routing, and optimization for PPA. Full signoff closure experience including: Static Timing Analysis (STA) Physical Verification (DRC/LVS using Calibre) IR drop, Electromigration (EM), Crosstalk Drive low power design closure using UPF/CPF flows . Debug and resolve complex design and convergence issues. Collaborate with RTL, DFT, verification, and packaging teams for integration and handoff. Guide flow/methodology improvements and automation scripting (TCL, Python, Perl). Leadership Responsibilities: Provide technical leadership and mentorship to junior engineers. Conduct design reviews and drive quality across the team. Interact with program managers and cross-functional teams to ensure timely delivery. Key Skills: RTL to GDSII implementation Block & Subsystem level design STA (PrimeTime/Tempus) Synthesis (Design Compiler/Fusion Compiler) Place & Route (ICC2, Innovus) Calibre DRC/LVS RedHawk / Voltus (IR/EM analysis) Low power design (UPF/CPF) Scripting (TCL, Python, Perl) Tape-out experience at advanced nodes (7nm, 5nm, 3nm) Team leadership & technical mentoring Preferred Experience: Experience with TSMC, Samsung, Intel process nodes. Hands-on tape-out experience at FinFET nodes (5nm and below). Background in SoC integration and hierarchical design. Why Join Wafer Space – an ACL Digital Group? Work on cutting-edge SoC designs and the latest technology nodes. Be part of a highly technical and collaborative team. Best-in-industry compensation and growth opportunities. Lead from the front and make a real impact in semiconductor innovation. If this opportunity isn’t for you, please share or refer someone in your network who would be a great fit. Referrals are highly appreciated! (prabhu.p@acldigital.com)
