4 Bump Planning Jobs

Qualcomm India Private Limited is a leading technology innovator that pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment, packaging, test systems, FPGA, and/or DSP systems in order to launch cutting-edge, world-class products. Collaboration with cross-functional teams is essential to develop solutions and meet performance requirements. This position is focused on floor-planning expertise at both block and top levels for industry-leading CPU core designs, emphasizing scalability and achieving aggressive Power, Performance, and Area (PPA) targets. Working on cutting-edge technology nodes and applying advanced physical design techniques to enhance CPU performance and efficiency is a key aspect of this role. Key responsibilities include driving floorplan architecture and optimization in collaboration with PD/RTL teams, engaging in cross-functional collaboration with Physical design, timing, power, and packaging teams, partnering with EDA tool vendors and internal CAD teams for improved design efficiency, making strategic trade-offs in design decisions to achieve optimal PPA outcomes, and ensuring end-to-end Physical verification closure for subsystem. The ideal candidate will have experience in physical design including floor-planning, placement, clock implementation, and routing for complex, big, and high-speed designs. Knowledge of physical synthesis and implementation tools such as Cadence Innovus/Genus and Synopsys Fusion Compiler is preferred, along with a good understanding of CMOS circuit design, static timing analysis, reliability, and power analysis. Strong collaboration skills, innovative thinking for power and performance improvements, scripting skills, and expertise in Physical Verification flow are required. Preferred skills for this role include clock implementation, power delivery network design choices, process technology knowledge, experience in flow and methodology development, hands-on experience with Synthesis, DFT, Place and Route, and Timing and Reliability Signoff. Interaction with design and architecture teams, working with sub-micron technology process nodes, and prior experience in flow and methodology development are advantageous. Minimum qualifications include a Bachelor's degree in Electrical/Computer Engineering, 8+ years of direct top-level floor-planning experience, a strong background in VLSI design, physical implementation, and scripting, as well as experience working with industry-standard Synthesis and Place and Route tools. Self-motivation, time management skills, and a commitment to abide by all applicable policies and procedures are expected from applicants. Qualcomm is an equal opportunity employer committed to providing reasonable accommodations for individuals with disabilities during the application/hiring process. Staffing and recruiting agencies are advised not to submit unsolicited profiles, applications, or resumes. For more information about this role, please contact Qualcomm Careers.,

Foundry Services (FS) is an independent foundry business established to meet customers" unique product needs. With the first Open System Foundry model globally, combined offerings include wafer fabrication, advanced process, packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities. This helps customers build innovative silicon designs and deliver customizable products from Intel's secure, resilient, and sustainable supply source. This job opportunity in FS will be part of the Customer Solutions Engineering (CSE) group, responsible for bringing the best of Intel technologies to FS customers, accelerating solutions from architecture to post-silicon validation. We are seeking an experienced Floorplan Engineer to focus on floor plan, die estimation, and power planning for high-performance designs. Responsibilities include establishing integration plans for die with optimization for package and board constraints, bump planning, die file generation, collaborating with architects for IP or SoC placement optimization, clocking and dataflow collaboration, deriving specifications for IP blocks, coordinating with power delivery team, maximizing die-per-reticle/good-die-per-wafer, RDL routing knowledge, and package integration before tape-out. **Qualifications:** - 12+ years of experience after a Bachelor or Master of Engineering degree in Electrical/Electronic/VLSI Engineering or related field. - Led multiple SOCs as SOC Floorplan lead, expertise in design planning, die estimation, knowledge of clocking, high-speed design signal routing, industry protocols, IP architecture, library/memory/technology/submicron issues. - Strong teamwork, flexibility, ability to thrive in a dynamic environment. **Job Type:** Experienced Hire **Shift:** Shift 1 (India) **Primary Location:** India, Bangalore Intel Foundry is committed to transforming the global semiconductor industry by providing cutting-edge silicon process and packaging technology. Innovating under Moore's Law, fostering collaboration, and investing in geographically diverse manufacturing capacities. Intel Foundry enables the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, dedicated to customer success with full P&L responsibilities.,

We are looking for highly skilled Physical Verification Engineers to join our team. The ideal candidates will have extensive experience in physical verification tasks such as DRC, LVS, and parasitic extraction using tools like Mentor Graphics Calibre. You will be working on cutting-edge technologies and collaborating with cross-functional teams to ensure seamless tapeouts and compliance with foundry design rules. Your main responsibilities will include implementing Physical Verification with a focus on hard macro/core finishing activities. You must have led and been primarily responsible for physical verification checks, fixing, and sign-off. It is essential to have an excellent understanding of the Physical Verification flow, with experience in analyzing and debugging DRC, ERC, LVS, DFM, Antenna, PERC, and Rule deck issues primarily using the Calibre tool. Additionally, a deep understanding of ESD, latch-up, etc., is required. You will be responsible for owning and executing Physical Verification activities at the Top/Block level. Collaborating closely with the PD team to address their PV issues and suggest solutions is a key aspect of the role. Working with CAD team to refine existing flows/methodologies and resolve issues is also part of the job scope. Experience in IO, Bump planning, RDL routing Strategy, and developing/implementing timing and logic ECOs are considered advantageous. Knowledge of tools like Innovus/FC for DRC fixing, Python, PERL/TCL scripting, and the ability to plan, work independently, and coordinate with cross-functional teams are essential. Closing sign off DRC based on PNR markers is a plus. The ideal candidate should have experience with physical verification checks such as DRC, LVS, Antenna, ERC, PERC, ESD, etc. Experience with PnR tools like ICC/Innovus and understanding sign-off PDV tools like PDK Concepts, SVRF, Calibre, and ICV is required. A good overall understanding of the Custom IC design flow, layouts, and backend tool flow would be beneficial. Hands-on experience with tools like Innovus/Fusion Compiler, Tech lef is preferable. People management, floorplanning, power planning, and PDN experience are considered a big plus. The ability to script in TCL/PERL and familiarity with physical convergence in PnR tools are also advantageous. In return, we offer a competitive salary, performance-based bonuses, comprehensive benefits package including health insurance, retirement plans, and paid time off. Additionally, you will have opportunities for professional development and career growth in a collaborative and innovative work environment with state-of-the-art facilities.,

Quest Global is a leading organization known for its innovation and rapid growth in the engineering services sector. With a rich domain expertise and a strong presence in the top OEMs across seven industries, we are a company with a 25-year legacy and a vision to reach a centennial milestone. Driven by ambition, passion, and humility, we are on a journey to shape the future through engineering. We are in search of individuals who embody the spirit of humble geniuses, believing in the power of engineering to turn the impossible into reality. Our ideal candidates are innovators inspired by technology and driven to design, develop, and test solutions as trusted partners for Fortune 500 clients. As a diverse team of engineers, we understand that our work goes beyond technical solutions; we are shaping a brighter future for all. If you are eager to contribute to meaningful projects and be part of an organization that values collective success and learning from failures, we invite you to join us. We are looking for achievers and courageous challenge-crushers who possess the following skills and characteristics: Responsibilities: - Performing floor-planning and routing studies at block and full-chip level - Executing top-level floorplan and clock pushdown to Partition - IO Planning and bump planning - Collaboration with Package team to meet Die file milestones - Conducting full chip and partition level timing analysis - Exploring low power techniques and power reduction opportunities - Designing and analyzing clock distribution - Executing Physical verification activities at full-chip level - Leading technical activities of physical design throughout technology readiness, design, and execution Qualifications: - Proficiency in Netlist2GDSII Implementation, including Floorplanning, Power Grid Design, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification, and Chip finishing - Experience in Physical Design Methodologies and sub-micron technology of 16nm and lower nodes - Handling designs with >1M instance count and 1 GHz frequency - Programming skills in Tcl/Tk/Perl for automating design processes and enhancing efficiency - Hands-on experience with PNR Suite from Cadence & Synopsys (Innovus & ICC2) - Strong background in Static Timing Analysis (PrimeTime SI), EM/IR-Drop analysis (PT-PX, Redhawk), and Physical Verification (Calibre) Education Type: M.E/M.Tech/MS-VLSI Design & Embedded System Job Type: Full Time-Regular Experience Level: Mid Level Total Years of Experience: 5 - 8,