1764 Ansys Jobs - Page 12

Job Opening at a leading Technology company in India on Contractual Basis Designation:- Mechanical Engineer Qualification & Experience :- 3 Year Diploma Course (Mechanical) with 2 Yrs experience BE/B. Tech (Mechanical) with 1 year experience Salary:- Rs. 22,750 CTC Skills: Experience in any of the below skill set CNC / VMC / MASTERCAM / ANSYS or Any other FEA Software / Electric Vehicle & Automobile Eng. / PLC, SCADA, HMI / CATIA (3D Experience) or Any other CAD Software / Robotics Duration of Contract : 1 Year and extendable up to 3 years Number of Positions (Immediate): 800 Across State of Telangana Interested candidate can send resume on soni.pandey@tnmhr.com Contact on:- 9867906351

We are seeking a highly motivated and technically proficient Technical Lead to manage and guide our efforts in supporting academic institutions in the adoption and effective use of Ansys simulation software . The ideal candidate will possess a deep understanding of simulation technologies and engineering principles, coupled with strong communication and leadership skills. Duties: Lead and mentor a team of technical engineers and application specialists in supporting academic institutions. Oversee day-to-day operations, allocate tasks, and ensure timely and high-quality support delivery. Develop and maintain strategic relationships with key academic stakeholders (faculty, department heads, lab administrators). Stay updated on the latest developments in simulation tools, particularly within the Ansys ecosystem, to guide the team and educational partners effectively. Work closely with faculty members to understand their curriculum, research needs, and recommend relevant Ansys tools and simulation methodologies. Conduct training sessions for faculty and lab instructors to enable them to independently use and teach Ansys products. Assist in integrating Ansys software into academic courses, labs, and research projects with tailored technical recommendations. Skills: Proven experience leading technical teams or projects in an academic or corporate setting. Excellent understanding of Finite Element Analysis, Electrical machines, Machine design Self-starter with excellent verbal, communication, and interpersonal skills. Strong proficiency in one or more Ansys simulation tools (Ansys Mechanical, Fluent, HFSS, Workbench, etc.). Solid understanding of Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), and Multiphysics simulations.

Job Description- JOB DESCRIPTION Analysis center of excellence has an immediate opening for a Team Lead – FEA who will be technically leading & guiding a team of highly skilled engineers and performing engineering & technical activities in Mechanical & Structural design & analysis. This position engages with stakeholders to develop new analysis competencies by preparing a verified and validated model through collaborating with test engineers. Help supervisor in hiring right talent, train resources to make them productive and retain by creating high performance culture. Develops and maintains relationships and partnerships with customers, stakeholders, peers, and direct reports. This position provides guidance and technical approaches on products and processes to junior engineers. Also, responsible to deal with Vertiv global counterparts in the form of providing progress reports, project summaries, and other related technical documents. This position will also be responsible for coordinating and communicating regularly with experts in Vertiv organization around the world. This position will be located at Vertiv Global Engineering Center, Pune, India. Job Specifications Must have Full Time ME / MTech. with specialization in Machine Design/ Aerospace/ Production from a reputed Institute. Must have minimum 12 years of experience in FEA domain and minimum 3 years of experience in people management. Must have expertise on Linear, Non-Linear, Modal and Vibration Analysis using ANSYS Software. Deep understanding of contact & material non-linearities and ability to debug convergence issues. Proficiency in model idealization and Able to prepare good quality Shell meshing & having knowledge of creating a solid mesh. Ability to do connections and integration (Weld/Bolt/contacts etc.) Sound knowledge of subjects like Solid mechanics/ FEM/ Strength of Material/ Mechanical Vibration. Expert in ability to interpret the FEA results and predict the root cause of failure. Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Capable of Handling Multiple Projects simultaneously. Provides technical leadership & coaching to the team to execute projects and recommend/make key engineering decisions. Deploy standardized process and work methodologies. Track monitor metrics for sustained performance covering quality & delivery. Must be flexible, with a high tolerance for organizational complexity and ability to work with partners across different cultures and time-zones. Work with Engineering team of different line of business for simulation need and recommend design changes as applicable. Experience in understanding top level functional requirement of a product. Desirable experience in telecommunication and electrical industry products. Knowledge of Seismic Analysis and industry standards (IBC, UL, and Telcordia) will be added advantage. Strong Conceptual, problem solving and Analytical Skills. Must be fluent in English with excellent communication skills – strong written and verbal. Ability to prepare comprehensive technical reports, crisp presentations, proposals, statements of work etc. Good experience with MS Office tools (Excel, Word, PowerPoint). Candidate must be a self-starter with a positive attitude, high ethics, and a track record of working successfully under pressure in a time-constrained environment. About The Team Work Authorization No calls or agencies please. Vertiv will only employ those who are legally authorized to work in the United States. This is not a position for which sponsorship will be provided. Individuals with temporary visas such as E, F-1, H-1, H-2, L, B, J, or TN or who need sponsorship for work authorization now or in the future, are not eligible for hire. Equal Opportunity Employer We promote equal opportunities for all with respect to hiring, terms of employment, mobility, training, compensation, and occupational health, without discrimination as to age, race, color, religion, creed, sex, pregnancy status (including childbirth, breastfeeding, or related medical conditions), marital status, sexual orientation, gender identity / expression (including transgender status or sexual stereotypes), genetic information, citizenship status, national origin, protected veteran status, political affiliation, or disability.

To support the simulation team at the customer location in analyzing their products with the Ansys tool. Duties: Perform 2D & 3D FE analysis of mechanical, electromechanical devices, and components. Providing online/offline training to customers on the Ansys tool. Well-versed with 3D FEA Pre/Solver/Post processors of Ansys LS-Dyna and Mechanical. Must be skilled in the following Linear and Nonlinear analysis types: -Statics -Dynamics -Thermal -NVH/Acoustics -Durability/Fatigue -Topology optimization (Basic) -Design optimization Perform the following with a focus on quality and delivery metrics. Finite Element Preprocessing (Geometry clean-up/de-featuring & meshing), Solving (Convergence, numerical stability, and accuracy) Post Processing (Generation of stress, deformation contours, and other essential features) Verification and Validation of FEA Results with test data/analytical data Generation of FE Analysis Reports Interact with customer teams for inputs and deliverables Preparation of analysis summary for technical review meetings with the clients Provide valuable recommendations and design suggestions to clients. Skills: Proven experience in structural analysis with ANSYS LS-Dyna and LSTC. Demonstrated problem-solving skills with a passion for learning and teaching. Excellent understanding of Strength of Materials, Engineering Mechanics, Machine design, Mechanics of Machines, Engineering Mathematics, and Finite Element Analysis Self-starter with excellent verbal, communication, and interpersonal skills. Demonstrated ability in FEA simulation and clear presentation of simulation results. Strong ability to handle multiple projects.

Exposure to Aero Repairs/Concession Activities Proficiency in MS Office (Word, Excel, PPT) Hands-on experience with Tools NASTRAN, PATRAN & ISAMI Education Requirements BE / MTech in Aerospace or Mechanical Engineering Skills Required to Succeed in This Job Experience in Aero-structure, preferably with wing and high-lift devices Knowledge of concession treatment process Ability to provide stress assessment for various manufacturing non-conformities Strong knowledge in Strength of Materials, Aircraft Materials, and stress justification using hand calculations (classical methods) Experience working on AIRBUS A350 or legacy programs Familiarity with AIRBUS concession processes and methods Knowledge of AIRBUS-specific tools like ISAMI Experience with SAP PR3/PAC Fatigue and Damage Tolerance experience is an added advantage Able to meet tight deadlines and handle customer demands Willing to work early or late shifts based on project needs

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelors degree in electrical engineering or equivalent work experience; Masters degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNAs and TDRs Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Industry: Robotics / Automation / Electromechanical Systems We’re hiring a Machine Design Engineer with 3–5 years of experience in robotic system design , dynamic motion systems , and gearbox development . Key Skills: Expertise in CAD tools : SolidWorks, Fusion 360, AutoCAD Design of multi-DOF robotic mechanisms , actuators, and gearbox systems Power transmission design: gears, harmonic drives, cams, lead screws Simulation & motion analysis: ANSYS, Adams, MATLAB Strong grasp of rigid-body dynamics , GD&T , and real-world prototyping What You’ll Do: Design high-performance robotic systems with complex motion profiles Develop and simulate custom gearboxes and transmission architectures Build & test adaptive mechanical systems in a cross-functional environment Interested? Reach out to nidhi.parikh@antal.com

Job Title: CAD Design Engineer Qualification: B.Tech / Diploma in Mechanical or related field Software: Proficient in UGNX CAD software Experience: 0 to 5 years of hands-on experience in 3D CAD modelling (parametric & non-synchronous) Skills: Strong 2D to 3D modelling skills Proficient in parametric editing, reverse engineering, prototyping Knowledge of sheet metal, drafting, surfacing, GD&T Basic understanding of CFD solvers (Ansys Fluent/StarCCM+) and methods (internal/external flow, thermal & turbulence modelling) is a plus Familiar with fluid dynamics and heat transfer basics

Our technology services client is seeking multiple CAD/CAE Systems Engineer to join their team on a contract basis. These positions offer a strong potential for conversion to full-time employment upon completion of the initial contract period. Below are further details about the role: Role: CAD/CAE Systems Engineer Experience: 5- 10 Years Location: PAN India Notice Period: Immediate- 15 Days Mandatory Skills: CAD/ CAE, Migration,Cloud, on Prem, desktop, OS/DB servers Job Description: 5-10 years of techno-functional experience in Engineering COTS products Should be from Mechanical engineering or production engineering background Proven skills in application migration and Server knowledge and server management. Hands-on experience in Installation, Configuration, License Management of Engineering Apps for CAD (like Creo, SolidWorks, Catia) and CAE (like Ansys, Simulation). Should have awareness on Management of Engineering Application over cloud and on-prem. Should have good documentation skills and understanding of best practices in application migration projects. Experience in libraries, Engineering design calculations and gap analysis. Profile set up of CAD/ CAE products. Perform backups of engineering applications. Must have good communication skills in English If you are interested, share the updated resume to sushmitha.r@s3staff.com

Position : CAD Engineer -Mechanical Qualification : BE Mechanical, ME Mech Software Knowledge : AutoCAD + Solidworks + Ansys Experience : Mini – 2 years Salary / Month : No bar for right candidate Location : Ahmedabad Job Description: • Responsible for entire concern department • Supporting Staff & Batch Management • Software Training • Development of new technologies • Corporate Training • Reporting • Student Training of Collage Students & Corporate Employees • Must having sound knowledge on mentioned Design Software • Relationship building • Technical Support to students and industries. • Building rapport with students. • Helping students identify strengths and weaknesses.

Job Title: Diploma Engineer Trainer (CNC / EV / Robotics / CAD) Location: Telangana (All Districts) Experience: 0 to 4 Years (Freshers can apply) Qualification: 3-Year Diploma in Mechanical or Electronics Engineering Minimum 2 years of experience preferred Freshers may also apply (special approval obtained) Required Skills (any one or more): CNC / VMC / Mastercam ANSYS or other FEA software Electric Vehicle / Automobile Engineering PLC, SCADA, HMI CATIA (3D Experience) or other CAD software Robotics Job Description: We are hiring Diploma Engineers to provide hands-on training to ITI students in various trades like CNC Machining, Electric Vehicles, Industrial Robotics, and more. Candidates with a passion for teaching and practical knowledge are encouraged to apply. Contact: gopi.c@acesoftlabs.com 9701923036

Job Title: Mechanical Engineer Trainer (CNC / EV / Robotics / CAD) Location: Telangana (All Districts) Experience: 0 to 2 Year (Freshers can apply) Qualification: BE / BTech in Mechanical Engineering Candidates with 1 year of experience preferred Freshers may also apply (special approval obtained) Required Skills (any one or more): CNC / VMC / Mastercam ANSYS or other FEA software Electric Vehicle / Automobile Engineering PLC, SCADA, HMI CATIA (3D Experience) or other CAD software Robotics Job Description: We are looking for passionate Mechanical Engineers to join our training team. Selected candidates will deliver hands-on training to ITI students in trades such as CNC Machining, Electric Vehicles, Finite Element Analysis, Industrial Robotics, and more. Contact: gopi.c@acesoftlabs.com 9701923036

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Internship Profile: CAE Engineer (Online, Work from home) Research Project: 1. Subsonic Aircraft Internship 2. Electric Vehicles Internship Duration: 2 months (Online) (28 July 2025 to 19 September 2025) Last Date to Apply: 28 July 2025

Requirement: Structures & Durability analysis Domain: IHM, Off-R oad vehicles Job Description: 1.Graduate or Post Graduate Degree in Mechanical Stream 2.Experience of 6 to 10 years in FEA package s along with understanding of FEA concepts, systems and application. 3.Sound knowledge of strength of material, Machine design, FEA Fundamentals, Engineering concepts and applications 4.Hands-on experience on FE modelling and connections using Hypermesh with Aba qus profile.. 5.Should possess hands on experience in FEA using ANSYS WB &, Hypermesh or other FEA software like NASTRAN, OPTISTRUCT 6.Detailed documentation of results and post-processing / interpretation of analysis results. 7.Good oral communication skills ( must be able to communicate with the customers)

Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary: Qualcomm is a company of inventors that unlocked 5G - ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. QUALCOMM is the world's leading developer of next generation wireless and multimedia technology. We are looking for a passionate Acoustic Engineer to join QUALCOMMs Advanced Tech R&D team. The ideal candidate will be responsible for the tuning and sound quality optimization of audio and voice for our range of products including earbuds, phones, and vehicles. You will apply your expertise in signal processing, acoustic simulation, and electroacoustic principles to enhance the auditory experience of our customers Responsibilities: Implement, optimize, and validate audio signal processing and audio machine learning solutions for earbuds, phones, PCs, XR and vehicle audio systems. Conduct acoustic analyses and assessments for product development. Develop and validate acoustic models using simulation tools. Collaborate with cross-functional teams to design and integrate acoustic designs. Create performance reports and provide recommendations for sound quality improvements. Design and conduct audio listening experiments, including statistical analysis. Stay updated on the latest trends and technologies in acoustics. Minimum Qualifications: Strong foundation in signal processing, acoustic theory, electroacoustic fundamentals. Proficiency in Python and/or MATLAB. Experience with audio signal modeling and algorithm development. Knowledge of C, C++, or other programming languages for audio applications. Familiarity with audio systems tuning and sound system calibration. Excellent problem-solving skills and attention to detail. Knowledge of machine learning and application to audio. Minimum Qualifications: Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 2+ years of Systems Engineering or related work experience. OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 1+ year of Systems Engineering or related work experience. OR PhD in Engineering, Information Systems, Computer Science, or related field. Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables. Minimum Qualifications: Bachelor's degree in Mechanical Engineering or related field. Location Bangalore, India Job Overview The successful candidate will operate as a member of Corporate Engineering department. Responsibilities include working with US and India teams to conceptualize and design high performance electronic assemblies for Mobile, Modem, Compute, Auto, IOT etc. Specific tasks include daily use of Creo solid modeling software, concept layouts, defining rigid and flexible circuit board outline and mounting constraints, electronic file transfers to/from circuit board CAD designers, shielding/gasket design, design of mechanical parts and system assemblies, creating detailed mechanical drawings, specifying dimensional tolerances and tolerance stackups, creating BOMs for assemblies, working with internal teams for optimal selection of batteries, displays, and audio components, working with internal machine shop for prototypes, and working with external suppliers for design collaboration and fabrication, including injection molded tooling. Candidate with knowledge on basics of thermal analysis and simulations will have preference. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants. Minimum Qualifications 2 to 6 years actively involved in mechanical engineering, Thermal Engineering and design of high-density electronics packaging. 2 to 6 years experience in a mechanical design engineering role designing electronics products / systems. Solid modeling experience utilizing Creo, Simulation experience in Flotherm or ANSYS icepak. Preferred Qualifications Expected to possess a strong understanding of mechanical engineering, thermal engineering and design fundamentals. Experience with defining outline, mounting, and I/O constraints of electronic circuit boards. Demonstrated ability for tolerance analysis and specification, including GD&T fundamentals. Demonstrated success in working with HW, component engineering, and other cross functional teams. Demonstrated success in working with HW and thermal analysis teams for appropriate thermal mitigation techniques. Solid understanding of design fundamentals for CNC, injection molded and stamped metal parts. Demonstrated ability working with supplier base for successful design collaboration and volume production. Strong experience with Creo solid model assembly, part, and drawing creation and Data storage. Experience with top-down skeleton model structuring and master model design techniques within Creo. Experience with IDF/EMN file exchange between mechanical and HW teams. Understands project goals and individual contribution toward those goals. Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides. Interact and collaborate with other internal mechanical engineers for optimal product development processes and schedule execution. Possess excellent verbal and written communication skills Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members. Education Requirements Bachelor Degree, Mechanical Engineering required Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables. Minimum Qualifications: Bachelor's degree in Mechanical Engineering or related field. Job Overview: The successful candidate will operate as a member of Corporate Engineering Hyderabad department. Responsibilities include working with US and India teams to perform thermal and structural analysis of high-performance electronic assemblies. Specific tasks include daily use of thermal and structural analysis software, taking concept layouts from the design team, creating representative analytical models, defining boundary and loading conditions, running simulations, analyzing results, and making recommendations for optimization of designs. The Engineer will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Minimum Qualifications : Bachelor's / Masters degree in Mechanical/Thermal/ Electronic Engineering or a related field. 1-3 years actively involved in thermal and structural engineering analysis of high-density electronics packaging. Strong background in heat transfer fundamentals with a good understanding of electronics cooling technologies (passive and active). Knowledge of packaging technologies, electromechanical design, and thermal management materials. Analysis tools experience utilizing Flotherm,XT, Icepak, 6SigmaET, Celsius EC, Ansys, Abaqus, or equiv. Solid modeling experience utilizing Pro/E or Solidworks mechanical CAD system. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications: Expected to possess a strong understanding of mechanical engineering and analysis fundamentals. Experience creating thermal and structural models of electronic circuit components, boards, and enclosures. Experience applying environmental spec conditions to analytical model boundary and loading conditions. Experience working with HW team for component, board, and system thermal power estimates. Experience specifying appropriate fans and heat sinks for electronic assemblies. Experience working with design teams for optimization based on analysis results. Demonstrated success in working with HW teams for appropriate thermal mitigation techniques. Proficiency with thermal testing (e.g.,LabVIEW, thermocouples, airflow measurements, thermal chambers, J-TAG) for computer hardware. Understands project goals and individual contribution toward those goals. Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides. Excellent verbal and written communication skills Interact and collaborate with other internal mechanical and electronics engineers for optimal product development processes and schedule execution. Effectively multitasks and meets aggressive schedules in a dynamic environment. Prepare and deliver design reviews to project team. Education Requirements Bachelor's / Masters degree in Mechanical/Thermal /Electronic Engineering or a related field. Keywords: Thermal analysis, electronics cooling, Flotherm, XT, Icepak, Celsius EC, thermal testing, thermal engineering, mechanical engineering. Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.