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3DIC and Advanced Packaging Physical Implementation Engineer Synopsys

10.0 - 14.0 years

0 Lacs

karnataka

On-site

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. As an experienced 3DIC and Advanced Packaging Physical Implementation Engineer with a strong background in backend design, particularly in deep sub-micron technology, you will be responsible for various tasks including 3DIC design partition, floor planning, IP placement, TSV placement, and power g...

Posted 1 month ago

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