3DIC and Advanced Packaging Physical Implementation Engineer Synopsys

10.0 - 14.0 years

0 Lacs

karnataka

On-site

As an experienced 3DIC and Advanced Packaging Physical Implementation Engineer at Synopsys, you play a crucial role in driving innovations that shape the Era of Pervasive Intelligence. Your strong background in backend design, particularly in deep sub-micron technology, equips you to excel in optimizing power and thermal performance, generating 3D stacking, and designing AP RDL. Your can-do attitude, quick learning abilities, and exceptional communication skills make you a valuable team player in our global and highly skilled team. **Key Responsibilities:** - Performing 3DIC design partition, floor planning, IP placement, TSV placement, and power grid planning and design. - Optimizing for po...

Posted 1 month ago

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3DIC and Advanced Packaging Physical Implementation Engineer Synopsys

10.0 - 14.0 years

0 Lacs

karnataka

On-site

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. As an experienced 3DIC and Advanced Packaging Physical Implementation Engineer with a strong background in backend design, particularly in deep sub-micron technology, you will be responsible for various tasks including 3DIC design partition, floor planning, IP placement, TSV placement, and power g...

Posted 3 months ago

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