As a Process Engineer at A Sahasra Group Company located in Bhiwadi, you will be responsible for process optimization in Die attach, wire bonding, molding, and Sawing processes within the Semiconductor/Electronics industry. With a minimum of 8 years of experience, you will utilize your expertise to optimize critical parameters, standardize processes, and ensure maximum product yield. Your role will involve optimizing and standardizing critical parameters in various processes such as Die attach, wire bonding, molding, and Saw machine. You will collaborate with equipment suppliers, raw material suppliers, and quality teams to achieve process optimization and yield improvement. Additionally, your responsibilities will include preparing yield reports, analyzing rejection rates, monitoring yield trends, and implementing necessary corrective and preventive actions. To qualify for this position, you must hold a B.E/B.Tech or Diploma in Electronics & Communication, Electrical & Electronics, or Mechanical, along with relevant experience in ASM die bonder, wire bonder, molding machines, and Saw machines. Experience with Process Parameter Optimization through Design of Experiments (DOE), Six Sigma certification, FMEA, and SPC knowledge will be advantageous. The ideal candidate will possess excellent communication skills, organizational abilities, and self-motivation. You should be capable of training others, collaborating across disciplines, and maintaining line discipline and work culture. If you are enthusiastic, creative, and dedicated to process engineering, we encourage you to apply by sending your CV to Mehnaz@sahasraelectronics.com. This is a full-time position with a salary as per industry trends, offering an exciting opportunity for a skilled and ambitious Process Engineer to contribute to the optimization and standardization of critical processes in the Semiconductor/Electronics industry.,
The Product Development Engineer will be responsible for developing test programs for packaged NAND flash memory, performing failure analysis, and device debugging. You will be in charge of NAND product and package qualification, reliability test setup, eFA & action plan. Additionally, you will provide test programs for advanced memories, define test flows for volume testing needs, and support production ramp-up. As a Product Development Engineer, you will conduct product evaluation DOE for reliability, DPPM improvement, production yield improvement, and die sort yield improvement. You will be expected to deliver high throughput time on test code development to achieve high throughput time. Moreover, you will contribute to and drive projects assigned by global new product definition teams to bring new products to market. The ideal candidate should be self-motivated, a self-starter, and able to work with minimal guidance. To excel in this role, you must be familiar with advanced development test programs such as ATL or wafer level test program coding. Knowledge of NAND or DRAM & SRAM testing is essential. You should have the ability to troubleshoot, analyze complex problems, multitask, and meet deadlines. Excellent English communication skills (both written and verbal) and strong interpersonal skills are required. Organization, self-motivation, and discipline are key attributes for success in this position. Collaboration with engineers from various disciplines and customers of different positions is also essential. Preferred skills for this role include good communication, a fit personality, being a young professional, focus, hard work, and good knowledge of NAND flash package. If you are interested and meet the qualifications mentioned above, please email your CV to Mehnaz@sahasraelectronics.com with the subject line indicating the position you are applying for.,
You are a Memory Program Manager in the Engineering domain based in Noida for the initial few months and later in Bhiwadi. As a full-time employee, you will receive a salary in line with industry standards. To qualify for this role, you must possess an MBA or M.Tech in Technology Management along with at least 4 years of experience in Memory or IC program management. Your primary responsibilities will include understanding the program, creating timelines, engaging with stakeholders, and ensuring timely delivery. You will actively participate in cross-functional meetings, provide feedback on system features, and collaborate with various teams and suppliers. As a member of the Program Management Team, you will be accountable for achieving organizational goals through effective leadership, engagement, and collaboration. Key skills required for this role include knowledge of SI/PI, IC/Memory Package design, packaging process flow, and testing. Experience with embedded storage device packaging is considered advantageous. You should demonstrate strong organizational, self-motivated, and disciplined traits, along with the ability to work with diverse teams and customers. Previous experience in working with off-shore teams in a multinational setting is preferred as offshore travelling may be necessary. Additionally, desired skills for this position encompass excellent communication, a fitting personality, youthfulness, focus, hard work ethic, and a good understanding of NAND flash package. If you embody these qualities and possess the necessary qualifications and experience, you are encouraged to apply by sending your CV to Mehnaz@sahasraelectronics.com with the subject line mentioning the position you are applying for.,