Job Title: Account Manager – Corporate Events Client : Leading Event Management company Location: Bengaluru Experience : 3 to 6 years Education : Bachelor's and other relevant qualifications Salary: Commensurate with experience Job Description/Role & Responsibilities : o Understand the comprehensive clients’ business and category with the ability to translate business problems into actionable solutions o Anticipate client needs and strive to identify and resolve potential obstacles o Manage existing clients and grow the business Required skill sets: o Should have event management experience o Proven ability to collaborate with multifaceted teams – conveying a vision into implementable action plans o Experience in managing communications across a multinational hierarchical structure o Strong written and verbal communication skills are an absolute must o Well-versed in the Microsoft suite
As an FPGA Packaging Engineer, you will be responsible for designing and developing the physical packaging of Field-Programmable Gate Arrays (FPGAs). Your primary objective will be to ensure the chip's functionality, performance, and reliability by optimizing the layout, materials, and manufacturing processes to meet specific power, thermal, and signal integrity requirements. Additionally, you will collaborate closely with design teams to integrate the FPGA into the larger system architecture. Your responsibilities will include creating detailed package layouts, selecting appropriate packaging materials, conducting thermal analysis, collaborating on mechanical design, developing manufacturing processes, performing reliability analysis, and ensuring design for manufacturability. You will also be expected to work closely with cross-functional teams, including FPGA design engineers, system architects, and product engineers. To excel in this role, you must possess a strong understanding of FPGA architecture and design principles, expertise in Electronic Design Automation (EDA) tools for package design and analysis, proficiency in 3D modeling and simulation software, knowledge of materials science and packaging materials, experience with thermal management principles and simulation tools, and familiarity with manufacturing processes like surface mount technology (SMT) and flip-chip. Excellent communication and collaboration skills are essential for effective teamwork with cross-functional teams. If you have a Master's or Bachelor's degree in Engineering and 5 to 8 years of relevant experience, along with the required skills and qualifications mentioned above, we invite you to apply for this exciting opportunity as an FPGA Packaging Engineer at our leading Enterprise Solutions company in Bengaluru. The salary offered will be commensurate with your experience and expertise.,