About Meret Audio Meret Audio is a pioneering Indian audio technology company headquartered in Hyderabad, Telangana. We design and manufacture high-fidelity loudspeaker systems, headphones and complete audio systems that blend cutting-edge acoustic engineering with premium craftsmanship. As we expand our product lines into more bespoke, high-end categories, we are seeking an experienced Senior Design Engineer - Audio Electronics to lead the design and execution of the electronics products. Role Overview As our Senior Audio Electronics Design Engineer, you will lead the design and development of the analog and digital electronics that power Meret Audio’s next-generation products. You will architect DSP algorithms, amplifier topologies, and I/O circuitry, working closely with acoustics, mechanical, firmware, and manufacturing teams to deliver robust, high-performance audio electronics from prototype through mass production. Key Responsibilities DSP Architecture & Algorithm Development Design, simulate, and optimize digital signal processing algorithms: EQ filters, crossovers, room-correction, dynamic range control, and active noise cancellation. Implement DSP code in C/C++ or MATLAB/Simulink for TI, NXP, or Analog Devices audio SoCs; validate performance on hardware evaluation platforms. Analog Amplifier & Power Electronics Architect and prototype power amplifier stages (Class-AB, Class-D, or hybrid topologies) optimized for low THD, high efficiency, and thermal stability. Define power-supply designs: SMPS, LDOs, and power-management ICs to meet size, noise, and safety requirements. Input/Output & Interface Circuitry Design analog front-end circuitry: microphone preamps, balanced/unbalanced line-in, headphone outputs, and ADC/DAC interfaces. Develop digital interfaces: I²S, TDM, I²C/SPI control, USB audio, Bluetooth audio modules, and wireless streaming interfaces. Cross-Functional Collaboration & Prototyping Work closely with PCB layout engineers to ensure signal integrity, EMI/EMC compliance, and proper grounding. Partner with mechanical and acoustics teams to integrate electronics seamlessly into enclosures, accounting for thermal management and user controls. Build and test prototypes in our lab: perform audio measurements (frequency response, SINAD, crosstalk), power efficiency tests, and environmental stress screening. Production & Compliance Prepare detailed design documentation: schematics, BOMs, PCB fabrication files, test procedures, and firmware release notes. Coordinate with QA and contract manufacturers to establish production test jigs, yield targets, and compliance with BIS and international safety/EMC standards. Mentorship & Continuous Improvement Mentor junior electronics engineers, share best practices in schematic capture, layout review, and firmware debugging. Stay abreast of emerging audio-electronics technologies and recommend new components, tools, or processes to enhance performance and reduce cost/time to market. Qualifications Education: Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Embedded Systems, or related field. Experience: 5+ years designing high-performance audio electronics in consumer or professional audio equipment (loudspeakers, headphones, mixers, amplifiers). Hands-on experience with DSP platforms (TI C6000 series, ADSP-SHARC, or similar) and writing real-time audio firmware. Proven track record designing analog front-ends and power amplifier stages, with strong understanding of PCB best practices for high-speed and mixed-signal circuits. Familiarity with audio measurement tools (Audio Precision APx series, oscilloscope, spectrum analyzer) and EMC pre-compliance testing. Skills & Attributes: Proficient in schematic capture and PCB layout review (Altium Designer, Cadence OrCAD/Allegro, or similar). Solid grounding in signal integrity, EMI mitigation, and thermal design. Excellent problem-solving skills and attention to detail. Strong communication skills to collaborate across mechanical, acoustics, firmware, and manufacturing teams. Passion for high-fidelity audio and critical listening. What We Offer: Competitive Salary: “Best-in-Industry” compensation package, commensurate with experience. Work Environment: Access to advanced acoustic and electronics labs, rapid-prototype facilities, and cutting-edge R&D tools. Career Growth: Opportunities to publish technical papers, file patents, and progress into senior leadership roles. Job Type: Full-time Pay: From ₹25,000.00 per month Benefits: Paid time off Work Location: In person Expected Start Date: 01/09/2025
Position: Product Development Manager – Headphones Location: Hyderabad, Telangana Employment Type: Full-Time Contact @: admin@meretaudio.com Company Overview At Meret Audio, our philosophy revolves around marrying cutting-edge engineering with meticulous design to produce headphones, loudspeakers, and audio equipment that set new benchmarks for fidelity, comfort, and innovation. As part of our growth strategy, we are seeking a seasoned Product Development Manager to spearhead our headphone division and guide the creation of flagship models—wired, wireless, and noise-cancelling—that delight the most discerning listeners. Position Summary As the Product Development Manager for Headphones, you will lead cross-functional teams to conceptualize, develop, and launch category-defining headphone products. You’ll interface with industrial design, electrical and mechanical engineering, acoustics specialists, firmware/DSP engineers, and marketing to ensure each headphone model exemplifies superior sound quality, ergonomic comfort, and modern feature sets (e.g., Bluetooth connectivity, active noise cancellation, high-resolution audio support). The ideal candidate combines deep technical expertise in headphone transducer engineering, acoustic enclosure design, electronic integration (ANC and wireless), and project management, with a passion for delivering world-class auditory experiences. Key Responsibilities Strategic Roadmapping, Technical Leadership & Cross-Functional Collaboration Define and maintain the headphone product roadmap in alignment with corporate objectives, market trends, and competitive analysis. Own the end-to-end product development lifecycle for headphone families (over-ear, on-ear, in-ear), from initial concept through production. Partner with industrial designers to ensure ergonomic factors—cup shape, headband pressure, ear-tip materials—balance comfort with acoustic isolation. Work closely with electrical engineers and DSP/firmware teams to implement features such as active noise cancellation (feedforward, feedback, hybrid topologies), adaptive EQ, transparency modes, and Bluetooth protocols (e.g., SBC, AAC, aptX, LDAC). Coordinate mechanical engineering efforts to optimize housing materials (plastics, aluminum, composites), hinge mechanisms, swivel joints, and cable/band durability for both aesthetic and functional performance. Oversee acoustic tuning: select driver units (dynamic, planar magnetic, electrostatic) based on target performance (impedance, sensitivity, THD), model enclosure/backplate designs, and refine venting schemes for intended bass response and dispersion characteristics. Prototyping & Testing Manage rapid prototyping workflows: 3D-printing of enclosures, CNC milling for metal parts, custom tooling for driver assembly, and iterative fit-testing with mock-ups. Establish and supervise in-house and third-party acoustic measurement procedures: quasi-anechoic response sweeps, impedance and phase measurements, distortion analysis, latency testing, and SEAM (shielded electroacoustic microphone) verifications for ANC performance. Set up environmental and durability testing: drop tests, hinge fatigue cycles, sweat/corrosion resistance, and battery cycle life assessments for wireless models. Supply Chain & Manufacturing Alignment Collaborate with procurement and supply chain teams to qualify and onboard key suppliers for drivers, PCBs, microphones (for ANC and voice pickup), Bluetooth modules, batteries, cushions, and headband materials. Liaise with contract manufacturers (CMs) to develop efficient production methodologies, ensuring strict tolerances for driver placement, enclosure gasketing, and PCB assembly. Author comprehensive manufacturing documentation: Bills of Materials (BOMs), assembly drawings, Gerber files, mechanical tolerancing sheets, and QA checklists. Quality Assurance & Compliance Lead durability and reliability testing programs, including mechanical stress tests (hinge life, fatigue), environmental stress screening (temperature/humidity cycling), and electrical safety checks. Define Quality Gates and Production Acceptance Criteria (PAC) for pilot and mass-production units; review first-off build reports and enforce corrective actions. Oversee electrical safety checks per BIS (Bureau of Indian Standards) requirements, including insulation resistance, earthing continuity, and over-current protection. Ensure all wireless headphone models obtain WPC (Wireless Planning & Coordination) approval under the Indian Radio Equipment Rules. Achieve BIS Certification (ISI mark) for electrical safety and any other relevant certifications. Team & Project Management Mentor and manage a multidisciplinary team of audio engineers, mechanical engineers, and firmware engineers; foster a collaborative culture focused on innovation and continuous improvement. Develop project plans with clear milestones (alpha prototypes, beta builds, tooling sign-off, pre-production, mass production), monitor budgets, allocate resources, and track progress using project management tools (e.g., Jira, Asana, or MS Project). Communicate status updates, risks, and mitigation strategies to senior leadership and stakeholders, ensuring alignment on go-to-market timelines. Qualifications & Experience Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Acoustical Engineering, or equivalent required. Master’s or Ph.D. in a related field (e.g., Audio Engineering, Acoustics, Applied Physics) is advantageous. Professional Experience: 5+ years of hands-on experience leading headphone or in-ear audio product development in a consumer electronics, professional audio, or specialty audio equipment company. Proven track record of multiple headphone product launches—covering wired, wireless (Bluetooth), and noise-cancelling architectures. Deep technical expertise in: Driver Technology: Familiarity with dynamic, planar magnetic, and/or electrostatic transducer design; knowledge of diaphragm materials (PET, Mylar, Beryllium-coated, etc.), magnet assembly (ferrite vs. neodymium), voice-coil thermal considerations, and acoustic suspension topologies. Acoustic Enclosure Design: Enclosure resonance control, cavity tuning, damping materials selection, and acoustic port/vent placement to achieve target low-frequency extension without boominess. Crossover and Filtering: For multi-driver in-ear or hybrid headphone designs, understanding of passive and active crossover topologies, high-pass/low-pass filters, and impedance matching for seamless blending. Active Noise Cancellation (ANC): Expertise in feedforward, feedback, and hybrid ANC systems; microphone array design; adaptive algorithms; and calibration processes to minimize latency and maximize attenuation across low-frequency bands. Wireless Audio Integration: Knowledge of Bluetooth SoCs, antenna design, RF certification processes, codec support (aptX HD, aptX Adaptive, LDAC), Qualcomm QCC series, or similar chipsets. DSP & Firmware: Hands-on experience collaborating on firmware development for noise cancellation, adaptive EQ, and digital audio processing pipelines; proficiency with C/C++ and embedded system debugging tools. Strong familiarity with simulation and measurement tools: MATLAB/Simulink, COMSOL Multiphysics, Listen Inc. Soundcheck, Klippel Suite, Apollo Twin or similar DAW measurement setups, and Klippel’s TDK-Lambda measurement rigs. Excellent understanding of mechanical CAD software (SolidWorks, Creo, or equivalent) for enclosure and component design. Demonstrated ability to drive cost-efficient designs without sacrificing performance—balancing BOM costs, yield optimization, and aesthetic requirements. Preferred Skills & Attributes Excellent leadership and mentoring capabilities; experience managing multidisciplinary engineering teams. Outstanding project management skills: adept at creating detailed Gantt charts, managing risk registers, and meeting aggressive time-to-market deadlines. Proficient communication skills—both written and verbal—capable of translating complex technical concepts to marketing, sales, and executive stakeholders. Passion for high-fidelity audio and strong critical listening skills; regularly participate in listening evaluations to refine sonic tuning. Creative problem-solver who thrives in a fast-paced environment and embraces continuous innovation. Exposure to user experience (UX) design considerations for headphones: intuitive controls, companion mobile apps, and voice assistant integration. International travel flexibility (up to 15–20%) to visit suppliers, contract manufacturers, and attend trade shows (e.g., CES, IFA, Audio Engineering Society conventions). Compensation & Benefits Salary: Highly competitive “Best in Industry” compensation package commensurate with qualifications and experience. Bonus & Incentives: Eligibility for annual performance-based bonuses. Professional Growth: Opportunities to collaborate with top acousticians, publish technical papers, and present at industry conferences. Job Type: Full-time Pay: From ₹50,000.00 per month Benefits: Paid time off Work Location: In person Speak with the employer +91 9030751188 Expected Start Date: 01/09/2025
About Meret Audio Meret Audio is a pioneering Indian audio technology company headquartered in Hyderabad, Telangana. We design and manufacture high-fidelity loudspeaker systems, headphones and complete audio systems that blend cutting-edge acoustic engineering with premium craftsmanship. As we expand our product lines into more bespoke, high-end categories, we are seeking an experienced Senior Design Engineer - Audio Electronics to lead the design and execution of the electronics products. Role Overview As our Senior Audio Electronics Design Engineer, you will lead the design and development of the analog and digital electronics that power Meret Audio’s next-generation products. You will architect DSP algorithms, amplifier topologies, and I/O circuitry, working closely with acoustics, mechanical, firmware, and manufacturing teams to deliver robust, high-performance audio electronics from prototype through mass production. Key Responsibilities DSP Architecture & Algorithm Development Design, simulate, and optimize digital signal processing algorithms: EQ filters, crossovers, room-correction, dynamic range control, and active noise cancellation. Implement DSP code in C/C++ or MATLAB/Simulink for TI, NXP, or Analog Devices audio SoCs; validate performance on hardware evaluation platforms. Analog Amplifier & Power Electronics Architect and prototype power amplifier stages (Class-AB, Class-D, or hybrid topologies) optimized for low THD, high efficiency, and thermal stability. Define power-supply designs: SMPS, LDOs, and power-management ICs to meet size, noise, and safety requirements. Input/Output & Interface Circuitry Design analog front-end circuitry: microphone preamps, balanced/unbalanced line-in, headphone outputs, and ADC/DAC interfaces. Develop digital interfaces: I²S, TDM, I²C/SPI control, USB audio, Bluetooth audio modules, and wireless streaming interfaces. Cross-Functional Collaboration & Prototyping Work closely with PCB layout engineers to ensure signal integrity, EMI/EMC compliance, and proper grounding. Partner with mechanical and acoustics teams to integrate electronics seamlessly into enclosures, accounting for thermal management and user controls. Build and test prototypes in our lab: perform audio measurements (frequency response, SINAD, crosstalk), power efficiency tests, and environmental stress screening. Production & Compliance Prepare detailed design documentation: schematics, BOMs, PCB fabrication files, test procedures, and firmware release notes. Coordinate with QA and contract manufacturers to establish production test jigs, yield targets, and compliance with BIS and international safety/EMC standards. Mentorship & Continuous Improvement Mentor junior electronics engineers, share best practices in schematic capture, layout review, and firmware debugging. Stay abreast of emerging audio-electronics technologies and recommend new components, tools, or processes to enhance performance and reduce cost/time to market. Qualifications Education: Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Embedded Systems, or related field. Experience: 5+ years designing high-performance audio electronics in consumer or professional audio equipment (loudspeakers, headphones, mixers, amplifiers). Hands-on experience with DSP platforms (TI C6000 series, ADSP-SHARC, or similar) and writing real-time audio firmware. Proven track record designing analog front-ends and power amplifier stages, with strong understanding of PCB best practices for high-speed and mixed-signal circuits. Familiarity with audio measurement tools (Audio Precision APx series, oscilloscope, spectrum analyzer) and EMC pre-compliance testing. Skills & Attributes: Proficient in schematic capture and PCB layout review (Altium Designer, Cadence OrCAD/Allegro, or similar). Solid grounding in signal integrity, EMI mitigation, and thermal design. Excellent problem-solving skills and attention to detail. Strong communication skills to collaborate across mechanical, acoustics, firmware, and manufacturing teams. Passion for high-fidelity audio and critical listening. What We Offer: Competitive Salary: “Best-in-Industry” compensation package, commensurate with experience. Work Environment: Access to advanced acoustic and electronics labs, rapid-prototype facilities, and cutting-edge R&D tools. Career Growth: Opportunities to publish technical papers, file patents, and progress into senior leadership roles. Job Type: Full-time Pay: From ₹25,000.00 per month Benefits: Paid time off Work Location: In person Expected Start Date: 01/09/2025
Position: Product Development Manager – Headphones Location: Hyderabad, Telangana Employment Type: Full-Time Contact @: admin@meretaudio.com Company Overview At Meret Audio, our philosophy revolves around marrying cutting-edge engineering with meticulous design to produce headphones, loudspeakers, and audio equipment that set new benchmarks for fidelity, comfort, and innovation. As part of our growth strategy, we are seeking a seasoned Product Development Manager to spearhead our headphone division and guide the creation of flagship models—wired, wireless, and noise-cancelling—that delight the most discerning listeners. Position Summary As the Product Development Manager for Headphones, you will lead cross-functional teams to conceptualize, develop, and launch category-defining headphone products. You’ll interface with industrial design, electrical and mechanical engineering, acoustics specialists, firmware/DSP engineers, and marketing to ensure each headphone model exemplifies superior sound quality, ergonomic comfort, and modern feature sets (e.g., Bluetooth connectivity, active noise cancellation, high-resolution audio support). The ideal candidate combines deep technical expertise in headphone transducer engineering, acoustic enclosure design, electronic integration (ANC and wireless), and project management, with a passion for delivering world-class auditory experiences. Key Responsibilities Strategic Roadmapping, Technical Leadership & Cross-Functional Collaboration Define and maintain the headphone product roadmap in alignment with corporate objectives, market trends, and competitive analysis. Own the end-to-end product development lifecycle for headphone families (over-ear, on-ear, in-ear), from initial concept through production. Partner with industrial designers to ensure ergonomic factors—cup shape, headband pressure, ear-tip materials—balance comfort with acoustic isolation. Work closely with electrical engineers and DSP/firmware teams to implement features such as active noise cancellation (feedforward, feedback, hybrid topologies), adaptive EQ, transparency modes, and Bluetooth protocols (e.g., SBC, AAC, aptX, LDAC). Coordinate mechanical engineering efforts to optimize housing materials (plastics, aluminum, composites), hinge mechanisms, swivel joints, and cable/band durability for both aesthetic and functional performance. Oversee acoustic tuning: select driver units (dynamic, planar magnetic, electrostatic) based on target performance (impedance, sensitivity, THD), model enclosure/backplate designs, and refine venting schemes for intended bass response and dispersion characteristics. Prototyping & Testing Manage rapid prototyping workflows: 3D-printing of enclosures, CNC milling for metal parts, custom tooling for driver assembly, and iterative fit-testing with mock-ups. Establish and supervise in-house and third-party acoustic measurement procedures: quasi-anechoic response sweeps, impedance and phase measurements, distortion analysis, latency testing, and SEAM (shielded electroacoustic microphone) verifications for ANC performance. Set up environmental and durability testing: drop tests, hinge fatigue cycles, sweat/corrosion resistance, and battery cycle life assessments for wireless models. Supply Chain & Manufacturing Alignment Collaborate with procurement and supply chain teams to qualify and onboard key suppliers for drivers, PCBs, microphones (for ANC and voice pickup), Bluetooth modules, batteries, cushions, and headband materials. Liaise with contract manufacturers (CMs) to develop efficient production methodologies, ensuring strict tolerances for driver placement, enclosure gasketing, and PCB assembly. Author comprehensive manufacturing documentation: Bills of Materials (BOMs), assembly drawings, Gerber files, mechanical tolerancing sheets, and QA checklists. Quality Assurance & Compliance Lead durability and reliability testing programs, including mechanical stress tests (hinge life, fatigue), environmental stress screening (temperature/humidity cycling), and electrical safety checks. Define Quality Gates and Production Acceptance Criteria (PAC) for pilot and mass-production units; review first-off build reports and enforce corrective actions. Oversee electrical safety checks per BIS (Bureau of Indian Standards) requirements, including insulation resistance, earthing continuity, and over-current protection. Ensure all wireless headphone models obtain WPC (Wireless Planning & Coordination) approval under the Indian Radio Equipment Rules. Achieve BIS Certification (ISI mark) for electrical safety and any other relevant certifications. Team & Project Management Mentor and manage a multidisciplinary team of audio engineers, mechanical engineers, and firmware engineers; foster a collaborative culture focused on innovation and continuous improvement. Develop project plans with clear milestones (alpha prototypes, beta builds, tooling sign-off, pre-production, mass production), monitor budgets, allocate resources, and track progress using project management tools (e.g., Jira, Asana, or MS Project). Communicate status updates, risks, and mitigation strategies to senior leadership and stakeholders, ensuring alignment on go-to-market timelines. Qualifications & Experience Education: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Acoustical Engineering, or equivalent required. Master’s or Ph.D. in a related field (e.g., Audio Engineering, Acoustics, Applied Physics) is advantageous. Professional Experience: 5+ years of hands-on experience leading headphone or in-ear audio product development in a consumer electronics, professional audio, or specialty audio equipment company. Proven track record of multiple headphone product launches—covering wired, wireless (Bluetooth), and noise-cancelling architectures. Deep technical expertise in: Driver Technology: Familiarity with dynamic, planar magnetic, and/or electrostatic transducer design; knowledge of diaphragm materials (PET, Mylar, Beryllium-coated, etc.), magnet assembly (ferrite vs. neodymium), voice-coil thermal considerations, and acoustic suspension topologies. Acoustic Enclosure Design: Enclosure resonance control, cavity tuning, damping materials selection, and acoustic port/vent placement to achieve target low-frequency extension without boominess. Crossover and Filtering: For multi-driver in-ear or hybrid headphone designs, understanding of passive and active crossover topologies, high-pass/low-pass filters, and impedance matching for seamless blending. Active Noise Cancellation (ANC): Expertise in feedforward, feedback, and hybrid ANC systems; microphone array design; adaptive algorithms; and calibration processes to minimize latency and maximize attenuation across low-frequency bands. Wireless Audio Integration: Knowledge of Bluetooth SoCs, antenna design, RF certification processes, codec support (aptX HD, aptX Adaptive, LDAC), Qualcomm QCC series, or similar chipsets. DSP & Firmware: Hands-on experience collaborating on firmware development for noise cancellation, adaptive EQ, and digital audio processing pipelines; proficiency with C/C++ and embedded system debugging tools. Strong familiarity with simulation and measurement tools: MATLAB/Simulink, COMSOL Multiphysics, Listen Inc. Soundcheck, Klippel Suite, Apollo Twin or similar DAW measurement setups, and Klippel’s TDK-Lambda measurement rigs. Excellent understanding of mechanical CAD software (SolidWorks, Creo, or equivalent) for enclosure and component design. Demonstrated ability to drive cost-efficient designs without sacrificing performance—balancing BOM costs, yield optimization, and aesthetic requirements. Preferred Skills & Attributes Excellent leadership and mentoring capabilities; experience managing multidisciplinary engineering teams. Outstanding project management skills: adept at creating detailed Gantt charts, managing risk registers, and meeting aggressive time-to-market deadlines. Proficient communication skills—both written and verbal—capable of translating complex technical concepts to marketing, sales, and executive stakeholders. Passion for high-fidelity audio and strong critical listening skills; regularly participate in listening evaluations to refine sonic tuning. Creative problem-solver who thrives in a fast-paced environment and embraces continuous innovation. Exposure to user experience (UX) design considerations for headphones: intuitive controls, companion mobile apps, and voice assistant integration. International travel flexibility (up to 15–20%) to visit suppliers, contract manufacturers, and attend trade shows (e.g., CES, IFA, Audio Engineering Society conventions). Compensation & Benefits Salary: Highly competitive “Best in Industry” compensation package commensurate with qualifications and experience. Bonus & Incentives: Eligibility for annual performance-based bonuses. Professional Growth: Opportunities to collaborate with top acousticians, publish technical papers, and present at industry conferences. Job Type: Full-time Pay: From ₹50,000.00 per month Benefits: Paid time off Work Location: In person Speak with the employer +91 9030751188 Expected Start Date: 01/09/2025