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15.0 - 24.0 years

40 - 60 Lacs

gurugram

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Role & responsibilities The Head Engineering & Development (Railways) will lead the research, design, and development of electronic systems for rolling stock, including displays, digital electronics, and power/analog electronics. This role will drive innovation and diversification of the companys product portfolio beyond displays and this is very important for us, and this is what we have been looking for. Visit Customers make presentations and identify the needs/wants in view of the new products. Identify OEMs for a potential collaboration. Facilitating Technology transfer by acting as a Point of Contact (as may be applicable in some cases) for fast induction of the product keeping in view the time-to-market. 1. Embedded Systems Development Lead the design and development of embedded hardware (PCBs, SoCs, FPGAs) and firmware for railway applications, including: Select and validate processors (ARM Cortex, PowerPC, x86), microcontrollers (STM32, NXP, Renesas), and FPGAs (Xilinx, Intel/Altera) for railway-grade applications. Ensure compliance with IEC standards e.g. IEC 62280 (SIL-2/4), IEC 61373 and other EN 50155 (railway electronics), EN 50657 (software), EN 50121, EN 61000, RDSO and CENELEC standards. 2. Technology Transfer & Collaboration Manage technology transfer from R&D/partners to production, ensuring seamless integration of railway-specific chipsets (TI, Infineon, Microsemi). Collaborate with global technology partners for IP cores, ASICs, and safety-certified components. 3. Cross-Functional Coordination Act as the primary interface between R&D, production, QA, and procurement to align on railway-grade component selection (extended temp, shock/vibration resistance). Ensure EN 50128 compliance or DO-178C (software) for firmware development. 4. Obsolescence Management Develop strategies to mitigate component obsolescence in long-lifecycle railway systems. Identify alternate chipsets, pin-compatible replacements, and redesign solutions while maintaining EN 50126/50129 compliance. 5. Engineering Management Oversee V-model development, HARA (Hazard Analysis), and FMEA for railway safety-critical systems. Ensure projects meet SIL (Safety Integrity Level) requirements and RAM (Reliability, Availability, Maintainability) targets. 6. Innovation & Cost Optimization Drive adoption of AI/ML-based predictive maintenance, IoT-enabled sensors, and edge computing in railway systems. Optimize BOM costs by selecting industrial-grade SoCs (NXP i.MX, TI Sitara) and modular designs. 7. Manufacturing SOP Compliance Ensure adherence to IPC-A-610 (PCB standards) and railway manufacturing SOPs. Resolve EMC/EMI issues (EN 50121-3-2) and thermal management challenges in embedded designs. Preferred candidate profile Bachelor’s/Master’s in Electronics/Electrical/Embedded Systems Engineering. 12–15 years in embedded hardware/firmware development, preferably in railways or automotive or aerospace. Expertise in: Processors: ARM Cortex-R (real-time), PowerPC QorIQ, Intel Atom E3900. FPGAs: Xilinx Zynq UltraScale+, Microsemi ProASIC3. Communication protocols: CAN, Ethernet, MVB, RS-485. Experience with IEC 61508, EN 5012x series, and IRIS certification.

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