Mechanical Design Intern – HTIC Location: IIT Madras Research Park, Chennai Duration: 6 months (extendable based on performance) Stipend: Based on qualifications and skillset About HTIC: HTIC is a multidisciplinary R&D center at IIT Madras, driving innovations in healthcare technologies. We work closely with clinicians, industry partners, and academia to develop impactful medical devices and diagnostic systems. Role Overview: We are seeking a Mechanical Design Intern with strong CAD and prototyping skills to work on the development of micro and nano drone platforms. You will contribute to the mechanical architecture, integration of flight-critical components, and iterative prototyping of airframes and payload modules. Key Responsibilities: Design and model lightweight, structurally optimized drone airframes and subassemblies Create detailed 3D CAD models and 2D manufacturing drawings using SolidWorks/Fusion 360 Design component mounts, gimbal assemblies, and payload enclosures with vibration isolation Perform tolerance stack-up, stress analysis (basic FEA or analytical), and material selection Prototype components using 3D printing, laser cutting, and CNC machining Collaborate with electronics and flight control teams for integration and layout optimization Support flight testing and iterate designs based on real-world feedback Maintain version-controlled design documentation and BOMs Eligibility & Skills: B.E./B.Tech (3rd/4th year) or M.E./M.Tech in Mechanical/Mechatronics/Aerospace Engineering Proficient in SolidWorks (or Fusion 360/Creo) for mechanical design and simulation Prior hands-on experience in drone or RC aircraft design projects is highly desirable Familiarity with lightweight structural design, carbon fiber/tube frame systems, and motor/propeller mounting schemes Understanding of aerodynamics, CG-balancing, and thermal dissipation in compact embedded systems Ability to rapidly prototype, test, and iterate designs in a fast-paced R&D setup Bonus Skills (Preferred): FEA/Simulation (SolidWorks Simulation, Ansys) Exposure to ISO 13485 or design control processes Experience with wearable or compact embedded systems packaging Show more Show less