Head of NPI (New Product Introduction) / Integration

In this role, you will be responsible for leading end-to-end NPI programs, ensuring customer engagement to mass production ramp. You will define NPI project milestones, timelines, and deliverables in alignment with customer expectations. Additionally, you will apply DFM and DFx principles early in the development phase and manage multiple concurrent product qualifications and engineering builds across OSAT sites. Your role will involve serving as the primary interface between customers and OSAT manufacturing teams for NPI activities. You will collaborate with various teams such as R&D, process engineering, quality, and procurement to resolve technical and operational challenges. Furthermore, you will work on optimizing test flow, package assembly processes, and yield improvement strategies. You will be responsible for driving product and package qualification in collaboration with quality and reliability teams. This includes reviewing FA, DOE, and yield analysis results to optimize process windows and ensuring compliance with customer and industry standards. Your tasks will also include overseeing first article builds, engineering samples, and production ramp readiness. You will identify and mitigate risks related to yield excursions, process variation, and supply chain disruptions. Moreover, you will drive cost-effective NPI execution, identifying opportunities for cost savings, process automation, and yield optimization. **Qualifications & Skills:** - **Education:** Bachelor's or Master's degree in Engineering (Electronics, Mechanical, Industrial, or Manufacturing) or related field. - **Experience:** Minimum of 10+ years in semiconductor packaging, assembly, or test, with at least 3 years in an NPI leadership role. Experience in OSAT, IDM, or semiconductor supply chain environments required. - **Technical Skills:** Expertise in Agile, PMP, or Six Sigma methodologies for NPI execution. Experience with flip-chip, wire bonding, die attach, molding, and test process flows. Familiarity with DFM, SPC, DOE, FA, JEDEC, AEC-Q100, MIL-STD, and IPC requirements. Proficiency in JMP, Minitab, Python, SQL, or other statistical tools. - **Soft Skills:** Strong leadership and communication skills, problem-solving mindset, and customer-focused approach. **Preferred Experience (Bonus):** - Experience in high-reliability or automotive semiconductor manufacturing. - Working knowledge of SAP, MES, and smart factory tools. - Exposure to AS9100 with electronics manufacturing. - Knowledge in IATF and APQP process. - Experience in both PCBA/SMT and IC packaging.,