4 Eda Tool Jobs

Qualcomm India Private Limited is a leading technology innovator that pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment, packaging, test systems, FPGA, and/or DSP systems in order to launch cutting-edge, world-class products. Collaboration with cross-functional teams is essential to develop solutions and meet performance requirements. This position is focused on floor-planning expertise at both block and top levels for industry-leading CPU core designs, emphasizing scalability and achieving aggressive Power, Performance, and Area (PPA) targets. Working on cutting-edge technology nodes and applying advanced physical design techniques to enhance CPU performance and efficiency is a key aspect of this role. Key responsibilities include driving floorplan architecture and optimization in collaboration with PD/RTL teams, engaging in cross-functional collaboration with Physical design, timing, power, and packaging teams, partnering with EDA tool vendors and internal CAD teams for improved design efficiency, making strategic trade-offs in design decisions to achieve optimal PPA outcomes, and ensuring end-to-end Physical verification closure for subsystem. The ideal candidate will have experience in physical design including floor-planning, placement, clock implementation, and routing for complex, big, and high-speed designs. Knowledge of physical synthesis and implementation tools such as Cadence Innovus/Genus and Synopsys Fusion Compiler is preferred, along with a good understanding of CMOS circuit design, static timing analysis, reliability, and power analysis. Strong collaboration skills, innovative thinking for power and performance improvements, scripting skills, and expertise in Physical Verification flow are required. Preferred skills for this role include clock implementation, power delivery network design choices, process technology knowledge, experience in flow and methodology development, hands-on experience with Synthesis, DFT, Place and Route, and Timing and Reliability Signoff. Interaction with design and architecture teams, working with sub-micron technology process nodes, and prior experience in flow and methodology development are advantageous. Minimum qualifications include a Bachelor's degree in Electrical/Computer Engineering, 8+ years of direct top-level floor-planning experience, a strong background in VLSI design, physical implementation, and scripting, as well as experience working with industry-standard Synthesis and Place and Route tools. Self-motivation, time management skills, and a commitment to abide by all applicable policies and procedures are expected from applicants. Qualcomm is an equal opportunity employer committed to providing reasonable accommodations for individuals with disabilities during the application/hiring process. Staffing and recruiting agencies are advised not to submit unsolicited profiles, applications, or resumes. For more information about this role, please contact Qualcomm Careers.,

We are looking foran adaptive, self-motivative design verification engineer to join our growing team. As a key contributor,you will be part of a leading team to drive and improve AMDs abilities to deliver the highest quality, industry-leading technologies to market. TheVerification Engineering team furthers and encourages continuous technical innovation to showcase successes as we'll as facilitate continuous career development. THE PERSON: You have a passion for modern, complex processor architecture, digital design, and verification in general. You are a team player who has excellent communication skills and experience collaborating with other engineers located in different sites/timezones. You have strong analytical and problem-solving skills and are willing to learn and ready to take on problems. KEY RESPONSIBILITIES: we'll versed with timing signoff methodology and corner definitions Drive the pre-route timing checks and QoR clean up to eliminate SDC issues and ensure a quality handoff for STA checks Requires a mix of SDC knowledge, EDA timing tool competence and Tcl based scripting capability (in both EDA environment and standalone Linux Tcl shell scripts) Responsible for Timing closure of one or multiple sub chip/subsystem OR Full chip. Ensuring block/SS level Interface timing closure along DRV closure Generating timing ECO using tools DMSA/Tweaker and leading subsystem/Subchip/FC timing closure PREFERRED EXPERIENCE: 3+ years of experience for timing closure of block/SS Experience with analyzing the timing reports and identifying both the design and constraints related issues. Preferred EDA tool experience: Synopsys Design Compiler/Primetime, Spyglass, Fishtail, Tweaker etc Experience in timing closure of high frequency blocks & subsystems (> Ghz range ) Strong Understanding of DFT modes requirements for timing signoff Good understanding of physical design flow and ECO implementation. Strong understanding of SDC constraints, OCV,AOCV,POCV analysis. Strong TCL/scripting knowledge is mandatory. Good understanding of SDC construct( clock generation , false path , multi cycle paths..) ACADEMIC CREDENTIALS: Bachelors orMastersdegree in computer engineering/Electrical Engineering

As a member of the AECG ASIC Group, you will help bring to life cutting-edge designs. As a member of the Back-end design/integration team, you will work closely with the architecture, IP design, Physical Design teams, and product engineers to achieve first pass silicon success. THE PERSON: A successful candidate will work with senior silicon design engineers. The candidate will be highly accurate and detail-oriented, possessing good communication and problem-solving skills. KEY RESPONSIBLITIES: Responsible for the development of complex multi-mode / multi-corner timing constraints that are compatible for RTL and signoff Ensuring constraints quality (SDC) using industry tools like Fishtail , GCA we'll versed with timing signoff methodology and corner definitions Drive the pre-route timing checks and QoR clean up to eliminate SDC issues and ensure a quality handoff for STA checks Requires a mix of SDC knowledge, EDA timing tool competence and Tcl based scripting capability (in both EDA environment and standalone Linux Tcl shell scripts) Responsible for Timing closure of one or multiple sub chip/subsystem OR Full chip. Ensuring full chip level Interface timing closure along DRV closure Generating timing ECO using tools DMSA/Tweaker and leading subsystem/Subchip/FC timing closure PREFERRED EXPERIENCE: 12+ years of experience in building the timing constraints for IPs, blocks and Full-chip implementation in both flat/hierarchical flows. Successfully led static timing analysis (STA) and closure for 2 3 SoC projects from RTL to tape-out. Proficient in analyzing SoC architecture to derive appropriate timing constraints and define STA methodology. Skilled in translating architectural and design specifications into accurate timing constraints (SDC), including clock definitions, generated clocks, exceptions (false paths, multi-cycle paths), and hierarchical timing. Coordinated cross-functional efforts across design, synthesis, P&R, and verification teams to ensure timing signoff. Owned timing budgets, constraint development, and timing ECOs, achieving first-pass silicon success. Experience with analyzing the timing reports and identifying both the design and constraints related issues. Preferred EDA tool experience: Synopsys Design Compiler/Primetime, Spyglass, Fishtail, Tweaker etc Excellent communication and interpersonal skills and always enthusiastic to collaborate with diverse teams. Experience in timing closure of high frequency blocks & subsystems (> Ghz range ) Experience in working full-chip STA closure, defining mode requirements and corners for timing closure. Strong Understanding of DFT modes requirements for timing signoff Good understanding of physical design flow and ECO implementation. Strong understanding of SDC constraints, OCV,AOCV,POCV analysis. Strong TCL/scripting knowledge is mandatory. ACADEMIC CREDENTIALS: Bachelors orMastersdegree in computer engineering/Electrical Engineering

As a Physical Design Engineer, you will be responsible for implementing and optimizing physical designs for high-performance VLSI systems. You will work on a wide range of tasks, including synthesis, placement, routing, and timing closure, ensuring that our designs meet stringent power, performance, and area (PPA) requirements. Responsibilities: 1. Perform RTL-to-GDSII implementation, including synthesis, floorplanning, placement, clock tree synthesis (CTS), routing, and sign-off. 2. Optimize designs for PPA while adhering to design constraints and manufacturing requirements. 3. Conduct static timing analysis (STA), power analysis, and physical verification (DRC/LVS). Collaborate with RTL design, verification, and DFT teams to ensure seamless integration and sign-off. 4. Debug and resolve issues related to timing, signal integrity, and power. 5. Drive closure of physical verification issues such as DRC, LVS, and ERC. 6. Implement low-power design techniques, including power gating, multi-Vt optimization, and dynamic voltage scaling. 7. Work closely with EDA tool vendors to improve design flows and methodologies. 8. Generate and maintain comprehensive documentation for physical design flows and guidelines. Requirements: 1. Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or a related field. 2. 310 years of experience in physical design for VLSI systems. 3. Proficiency in physical design tools such as Cadence Innovus, Synopsys ICC2, or Mentor Calibre. 4. Strong knowledge of STA tools like PrimeTime, Tempus, or equivalent. 5. Experience with advanced process nodes (e.g., 7nm, 5nm, or below) and FinFET technologies. 6. Expertise in low-power design techniques and methodologies. Solid understanding of DRC/LVS and parasitic extraction. 7. Familiarity with scripting languages (Python, TCL, Perl) for flow automation. 8. Excellent problem-solving skills with the ability to debug and resolve complex physical design challenges. 9. Strong communication and collaboration skills to work effectively in cross-functional teams. Preferred Qualifications: 1. Hands-on experience with hierarchical design flows and methodologies. 2. Knowledge of 3D IC and advanced packaging technologies. 3. Familiarity with machine learning or AI applications in physical design optimization. 4. Exposure to hardware security aspects in physical design.