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7.0 - 10.0 years
15 - 25 Lacs
hyderabad
Hybrid
Key Responsibilities : Perform pre- and post-layout SI/PI analysis across die, package, and board levels. Work on high-speed interfaces such as PCIe Gen 3/4/5, DDR4/5, LPDDR4/5, 10G Ethernet, USB 3.2 Gen 1 & 2 . Analyze S-parameters including insertion loss, return loss, crosstalk, and TDR. Simulate using IBIS/IBIS-AMI models and generate eye diagrams. Recommend equalization settings and constraints to the design/layout team. Select and optimize PCB stack-up including dielectric materials, copper thickness, and impedance control. Collaborate with cross-functional teams to ensure signal integrity across the system. Provide technical guidance during design reviews and debugging sessions. (Opti...
Posted 5 hours ago
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