Flip Chip Packaging Sr Eng/ Sect Manager Tata Electronics

4.0 - 8.0 years

0 Lacs

karnataka

On-site

You will be responsible for the technology and process development of Flip Chip product packaging, including tasks such as Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill, Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing. Your role will involve understanding, integrating, and innovating to meet customers" packaging requirements with a cost-competitive DFM solution. You will initiate and participate in technical discussions with vendors to gather relevant data, conduct initial analysis, and submit final decision submissions. Your involvement will also include selecting 4Ms ...

Posted 1 month ago

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