Job Title: Substrate Designer (OSAT / Package Substrate Design Engineer)
Company:
About CG Semi
CG Semi is building a world-class semiconductor assembly, packaging, and test ecosystem in India. As part of our advanced packaging and manufacturing expansion, we are seeking an experienced Substrate Designer to drive the design and development of next-generation package substrates supporting advanced semiconductor packaging technologies.
This role offers the opportunity to work at the intersection of package engineering, manufacturing, customer engagement, and technology development while contributing to the establishment of a high-volume semiconductor manufacturing operation.
About the Role
The Substrate Designer will be responsible for the design, optimization, and release of advanced semiconductor package substrates across multiple packaging platforms, including FC-BGA, FCCSP, SiP, QFN, and emerging 2.5D/3D integration technologies.
The successful candidate will lead substrate architecture development, stack-up optimization, routing execution, manufacturability reviews, and design validation activities while collaborating closely with customers, material suppliers, package engineering teams, manufacturing, NPI, reliability, and process engineering organizations.
This position plays a critical role in ensuring substrate designs achieve the required electrical performance, reliability, manufacturability, yield, and cost objectives throughout the product lifecycle.
Key Responsibilities
1. Advanced Package Substrate Design
- Lead substrate design and layout activities for advanced semiconductor package platforms, including:
- FC-BGA
- FCCSP
- QFN
- System-in-Package (SiP)
- 2.5D Packaging
- 3D IC Packaging
- Develop and optimize substrate stack-ups, high-density signal routing, Power Delivery Networks (PDN), SMT land patterns, ball maps, and escape routing methodologies.
- Ensure substrate designs meet electrical, thermal, mechanical, reliability, and manufacturing requirements.
- Conduct package feasibility studies, technical assessments, and design reviews during product development.
2. Design Documentation & Engineering Release
- Develop and maintain comprehensive substrate design documentation, including:
- Layer stack definitions
- Material specifications
- Routing guidelines
- Blind, buried, and microvia structures
- Fabrication requirements
- Gerber outputs
- ODB++ data packages
- IPC-2581 manufacturing deliverables
- Own design release packages and revision control processes.
- Manage Engineering Change Requests (ECRs), Engineering Change Orders (ECOs), and design database integrity throughout the product lifecycle.
3. DFM, DFX & Manufacturing Readiness
- Perform Design for Manufacturability (DFM), Design for Reliability (DFR), and Design for Testability (DFT) assessments.
- Collaborate with manufacturing, process engineering, and NPI teams to ensure robust and production-ready designs.
- Drive substrate optimization initiatives focused on yield improvement, reliability enhancement, cycle-time reduction, and cost optimization.
- Support prototype builds, pilot production, engineering qualification lots, and high-volume manufacturing ramp-up activities.
4. Customer & Supplier Engagement
- Interface directly with customers on package architecture reviews, feasibility assessments, and design risk evaluations.
- Participate in technical reviews and design discussions throughout the product development cycle.
- Collaborate with substrate suppliers and material vendors on material selection, technology capability assessments, process development, and cost optimization programs.
- Evaluate emerging substrate and packaging technologies to support future product roadmaps.
5. Engineering Validation & Technical Problem Solving
- Partner with cross-functional teams, including:
- Package Engineering
- Electrical Engineering
- Signal Integrity (SI)
- Power Integrity (PI)
- Mechanical Engineering
- Thermal Engineering
- Reliability Engineering
- NPI Organizations
- Support package qualification, reliability validation, and engineering verification activities.
- Drive technical resolution of issues identified during prototype builds, reliability qualification, failure analysis, root cause analysis, production ramp, and yield improvement programs.
- Implement corrective and preventive actions to improve substrate robustness and manufacturing performance.
6. NPI & Technology Development
- Support New Product Introduction (NPI) programs from concept through high-volume manufacturing.
- Contribute to continuous improvement initiatives involving design methodologies, design automation, library development, standardization, and documentation management.
- Support technology roadmap development for advanced packaging and next-generation substrate platforms.
Required Technical Skills & Expertise
1. EDA & Design Platforms
Strong hands-on experience with:
- Cadence SiP
- Cadence Allegro Package Designer
- Siemens / Mentor Xpedition
- Substrate Integrator
- Equivalent semiconductor package design platforms
2. Package Design Expertise
Strong understanding of:
- Package substrate architecture
- Multilayer stack-up design
- Fine-pitch routing methodologies
- SMT land pattern development
- Ball map optimization
- Power Delivery Network (PDN) design
- Design rule management and constraint handling
3. Standards & Engineering Fundamentals
Working knowledge of:
- IPC-2581
- IPC-4761
- IPC-6012
- Impedance-controlled design
- Signal Integrity (SI)
- Power Integrity (PI)
4. Advanced Packaging Technologies
Experience in:
- Flip-Chip Packaging
- Fan-Out Packaging
- Microvia Stacking
- Blind and Buried Via Technologies
- Sequential Lamination
- ABF Substrates
- SAP / mSAP Processes
- Redistribution Layers (RDL)
5. Preferred Process Knowledge
Exposure to:
- Ball Attach Processes
- ABF Lamination
- Semiconductor Molding Processes
- Wafer Bumping Technologies
- Semiconductor Assembly Flow Integration
Required Experience & Qualifications
- Bachelor's degree in Electronics Engineering, Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Engineering, or a related discipline.
- 1015 years of experience in semiconductor package substrate design, advanced PCB design, or OSAT package development.
- Demonstrated expertise in advanced substrate design supporting semiconductor packaging applications.
- Proven experience leading substrate development programs from concept through production release.
- Strong understanding of substrate fabrication processes and semiconductor assembly requirements.
- Experience working in cross-functional environments involving package engineering, manufacturing, quality, reliability, process engineering, suppliers, and customers.
- Strong technical understanding of substrate architecture, routing, stack-up design, and manufacturing constraints.
Preferred Experience
Candidates with experience in one or more of the following areas will be strongly preferred:
- Semiconductor Packaging
- OSAT Operations
- Advanced Packaging Technologies
- FC-BGA Development
- FCCSP Development
- System-in-Package (SiP)
- 2.5D / 3D Packaging Technologies
- ABF-Based Substrates
- SAP / mSAP Processes
- Redistribution Layer (RDL) Design
- High-Speed Digital Package Design
- Signal Integrity and Power Integrity Optimization
- New Product Introduction (NPI)
- Substrate Supplier Qualification & Management
Preferred Certifications
The following certifications are desirable:
- IPC CID (Certified Interconnect Designer)
- IPC CID+
- Six Sigma Green Belt
- Six Sigma Black Belt
- Certified Reliability Engineer (CRE)
- Project Management Professional (PMP)
While certifications are valued, practical experience in advanced substrate design and semiconductor package development will be given greater consideration.
Frameworks, Standards & Methodologies
Experience with industry-recognized standards and methodologies, including:
- IPC-2581
- IPC-4761
- IPC-6012
- JEDEC Reliability Standards
- Design for Manufacturability (DFM)
- Design for Reliability (DFR)
- Design for Testability (DFT)
- Statistical Process Control (SPC)
- Failure Mode & Effects Analysis (FMEA)
- Design of Experiments (DOE)
- APQP Methodologies
- Semiconductor NPI Frameworks
Candidate Profile
We are specifically looking for professionals who can:
- Independently design and deliver advanced semiconductor package substrates.
- Balance performance, reliability, manufacturability, and cost objectives.
- Engage effectively with customers, suppliers, and internal engineering stakeholders.
- Translate complex package requirements into robust, production-ready substrate solutions.
- Drive technical problem-solving during development, qualification, and manufacturing ramp phases.
- Influence cross-functional teams through technical expertise and data-driven decision-making.
- Successfully manage multiple development programs and design releases in a fast-paced environment.
- Contribute to the advancement of packaging technologies and substrate design methodologies.
Application Details
Interested candidates with relevant Semiconductor / OSAT and Advanced Package Substrate Design experience are encouraged to apply.
Position:
Interested candidates can apply through either channel:
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Candidate Details Required
Please share your updated CV along with the following details:
Full Name
Current CompanyCurrent DesignationCurrent LocationTotal ExperienceRelevant Package Substrate Design ExperienceSemiconductor / OSAT ExperienceExperience in FC-BGA, FCCSP, SiP, 2.5D/3D or Advanced Packaging TechnologiesExperience with Cadence SiP / AllegroExperience with Mentor Xpedition / Substrate IntegratorExperience with ABF Substrate DesignExperience with SAP / mSAP TechnologiesExperience with Signal Integrity (SI), Power Integrity (PI), and Impedance-Controlled DesignExperience with IPC Standards (IPC-2581, IPC-4761, IPC-6012)Experience Supporting NPI and Manufacturing Ramp ProgramsHighest QualificationProfessional CertificationsCurrent Fixed CTCVariable / BonusExpected Fixed CTCNotice Period / Earliest Joining DateCurrent Offers, if anyWillingness to relocate to Sanand, Gujarat: Yes / No
