Job Title: NPI Wire Bond Process SME (Subject Matter Expert)
Function:
About the Role
NPI Wire Bond Process SME (Subject Matter Expert)
The role will be responsible for customer technical alignment, machine readiness (4M), process characterization, recipe development, qualification build support and successful mass production release.
The successful candidate will ensure engineering excellence in wire bond process capability, yield improvement, equipment optimization and APQP deliverables for new semiconductor package launches.
This role requires strong hands-on expertise in wire bonding technologies, semiconductor assembly processes, NPI execution and customer-facing technical discussions.
Key Responsibilities
1. Process Ownership Wire Bond
- Define, optimize and validate wire bonding process parameters, including temperature, bond force, ultrasonic power, bonding speed and stitch profile.
- Lead process characterization and recipe development for:
- Gold Ball Bonding
- Copper Wire Bonding
- Silver Wire Bonding
- Wedge Bonding
- Fine Pitch Bonding
- Low-k / Ultra-low-k Die
- Stacked Die Bonding
- Analyze and prevent wire bond-related defects, including NSOP, weak bond, dog-ear, heel crack, cratering, lifted bond and stitch pull issues.
- Own wire bonding activities throughout the NPI lifecycle, from Engineering Lot and Qualification Build to Mass Production release.
- Execute APQP deliverables, including PFMEA, Control Plan, MSA/GR&R, capability studies and material qualification.
- Conduct 4M readiness assessments covering Machine, Material, Method and Manpower.
- Evaluate tooling, capillary design and bond finger requirements.
- Collaborate with customers on technical discussions and drive closure of open technical issues before qualification approval.
2. Wire Bond Machine & Material Management
- Lead wire bond machine evaluation, capillary selection and consumable optimization.
- Perform FAT, SAT and CIQ activities for wire bonding equipment.
- Drive cost reduction initiatives related to Au/Cu/Ag wire consumption, capillary life and bonding cycle time.
- Optimize machine utilization and UPH (Units Per Hour).
- Work closely with equipment and process engineering teams to ensure machine readiness for new product launches.
3. Yield & Quality Improvement
- Lead root cause analysis using 8D, DMAIC and other structured problem-solving methodologies.
- Improve process yield and reduce NSOP rate, lifted bonds and overall unit fallout.
- Implement SPC and process control strategies to ensure process stability.
- Drive continuous improvement initiatives for wire bond process capability, reliability and productivity.
- Support failure analysis through ball shear testing, pull testing, cross-sectioning and SEM analysis.
4. NPI & Customer Technical Management
- Lead wire bond process activities during new package introduction and qualification.
- Ensure process readiness and technical closure before qualification sign-off.
- Coordinate with NPI, Quality, Equipment, Product Engineering, Manufacturing and customer teams.
- Provide technical guidance and mentoring to wire bond engineering teams.
- Ensure smooth transition of qualified products from NPI to mass production.
Required Technical Skills & Expertise
1. Wire Bond Equipment
- ASM Eagle
- K&S IConn
- K&S Asterion
- Powernexx
- RapidPro
- H&K or K&S Wedge Bonder
2. Materials & Process Knowledge
- Gold (Au), Copper (Cu) and Aluminium (Al) wire.
- Silver (Ag) wire bonding.
- Capillary selection and optimization.
- Leadframe and substrate design interface.
- Bonding process optimization and consumable management.
3. Analysis & Characterization
- Ball Shear Test
- Wire Pull Test
- Cross-sectioning
- SEM Failure Analysis
- Bond strength and process characterization.
4. Software & Analytical Tools
- SPC
- DOE
- Minitab / JMP
- MS Office
- MES / CIM / Smart Factory systems.
5. Methodologies
- APQP
- PFMEA
- Control Plan
- MSA / GR&R
- Process Capability Studies
- 8D Problem Solving
- DMAIC
- Continuous Improvement.
Required Experience & Qualifications
- Bachelor's degree in Electronics & Communication Engineering (ECE), Electrical Engineering (EE), Mechanical Engineering (ME), Materials Engineering or equivalent.
- 510 years of hands-on Wire Bond Engineering experience in Semiconductor Assembly / OSAT.
- Strong technical expertise in wire bonding process development, characterization and optimization.
- Proven experience in New Product Introduction (NPI), package qualification and mass production release.
- Experience in customer-facing technical discussions and qualification issue closure.
- Strong understanding of wire bond process defects, failure analysis and yield improvement.
- Experience with wire bond equipment, material selection and process control.
Preferred Experience
Candidates with experience in the following areas will be strongly preferred:
- Semiconductor Assembly and OSAT manufacturing.
- Advanced semiconductor packaging.
- Gold and Copper Ball Bonding.
- Fine Pitch and Stacked Die Wire Bonding.
- Low-k / Ultra-low-k Die bonding.
- NPI process development and package qualification.
- Wire bond equipment evaluation and optimization.
- APQP implementation and process capability improvement.
- Customer technical interface and qualification management.
Soft Skills & Leadership Competencies
We are specifically looking for someone who can:
- Demonstrate strong technical leadership and subject matter expertise in wire bonding.
- Mentor and guide process engineering teams.
- Coordinate effectively with cross-functional teams.
- Communicate confidently with customers and internal stakeholders.
- Influence technical decisions without direct authority.
- Drive problem-solving and continuous improvement in a fast-paced NPI environment.
- Take end-to-end ownership of process readiness and successful product launches.
Candidate Profile
The ideal candidate should be a hands-on Wire Bond Process Expert with strong semiconductor assembly experience, capable of independently leading wire bond process development and qualification activities.
The candidate must have the ability to translate customer requirements into robust manufacturing processes, ensure process capability, resolve technical challenges and deliver successful NPI-to-Mass Production transitions.
Application Details
Interested candidates with relevant Semiconductor Assembly / OSAT and Wire Bond NPI experience are encouraged to apply.
Position:
Position Code:
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Interested candidates can apply through either channel:
Google Form:
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Please share your updated CV along with the following details:
- Full Name
- Current Company
- Current Designation
- Current Location
- Total Experience
- Relevant Wire Bond Engineering Experience
- NPI Experience
- Wire Bond Equipment Experience (ASM / K&S / H&K)
- Wire Bonding Technologies Handled (Au / Cu / Ag / Wedge / Fine Pitch)
- Semiconductor / OSAT Experience
- Experience in APQP / PFMEA / Control Plan
- Highest Qualification
- Professional Certifications
- Current Fixed CTC
- Variable / Bonus
- Expected Fixed CTC
- Notice Period / Earliest Joining Date
- Current Offers, if any
- Willingness to relocate to Sanand, Gujarat:
Yes / No
