NPI Mold Process SME (Subject Matter Expert)
About CG Semi
NPI Mold Process SME
This role offers the opportunity to drive process development, package qualification, equipment readiness, and manufacturing excellence within a rapidly growing semiconductor packaging environment.
About the Role
NPI Mold Process SME
The role is responsible for mold process characterization, material qualification, tooling readiness, process optimization, APQP execution, yield improvement, and manufacturing transfer activities. The successful candidate will work closely with package design, process engineering, quality, equipment, reliability, suppliers, and customer engineering teams to ensure robust, scalable, and cost-effective manufacturing processes.
This position is critical in ensuring package integrity, process capability, product reliability, and operational readiness for semiconductor package launches.
Key Responsibilities
Mold Process Development & Technical Ownership
- Lead end-to-end ownership of molding processes for NPI programs from engineering build through high-volume production.
- Define, optimize, and validate critical molding parameters including:
- Mold temperature
- Transfer pressure
- Injection speed
- Cure profile
- Clamp force
- Transfer time
- Develop and optimize molding recipes for semiconductor package families including:
- QFN
- DFN
- SOP
- SSOP
- QFP
- BGA
- Advanced package variants
- Establish process windows and operating limits to ensure robust manufacturing performance.
- Drive mold process characterization and qualification activities during:
- Engineering Lots
- Characterization Builds
- Qualification Runs
- Reliability Builds
- Production Ramp-Up
Advanced Package & Process Engineering
- Develop molding solutions for:
- Thin packages
- Large-body packages
- Multi-row QFN/DFN packages
- Exposed-pad packages
- Complex package architectures
- Evaluate package designs and ensure molding process compatibility.
- Collaborate with package design and assembly engineering teams to optimize package manufacturability and reliability.
- Support package development reviews and technical readiness assessments.
APQP & NPI Program Management
- Lead execution of NPI and APQP deliverables including:
- PFMEA
- Control Plans
- Process Validation
- MSA / GR&R
- Capability Studies
- DOE Activities
- Conduct comprehensive 4M readiness reviews covering:
- Machines
- Mold Chase / Tooling
- Materials
- Methods
- Manpower
- Supporting Equipment
- Ensure manufacturing readiness prior to qualification and production release.
- Support customer technical reviews and qualification approvals.
Mold Material, Equipment & Tooling Management
- Lead evaluation and qualification of molding equipment and associated tooling.
- Support FAT, SAT, and CIQ activities for new molding systems.
- Establish technical requirements for:
- Mold chase design
- Gate design
- Runner design
- Cavity layout
- Process specifications
- Evaluate and qualify EMC (Epoxy Molding Compound) materials based on:
- Package architecture
- Moisture Sensitivity Level (MSL)
- Reliability requirements
- Warpage performance
- Flow characteristics
- Customer specifications
- Optimize mold compound utilization, tool life, equipment productivity, and overall manufacturing efficiency.
Defect Reduction & Yield Improvement
- Lead investigations and corrective actions for mold-related defects including:
- Delamination
- Wire Sweep
- Die Shift
- Flash
- Resin Bleed
- Voids
- Incomplete Fill
- Package Cracks
- Chipping
- Mold Compound Contamination
- Apply structured problem-solving methodologies including:
- 8D
- DMAIC
- DOE
- Statistical Analysis
- Improve process capability and reduce package quality excursions.
- Implement SPC-based control strategies to maintain stable manufacturing performance.
Reliability & Quality Engineering
- Support package qualification and reliability programs.
- Partner with Quality, Reliability, and Failure Analysis teams to establish root causes and corrective actions.
- Drive process improvements enhancing:
- Yield
- Reliability
- Cycle Time
- Cost
- Equipment Throughput
- Establish sustainable process controls supporting long-term manufacturing stability.
Cross-Functional & Customer Collaboration
- Collaborate with:
- Package Design
- Wire Bond Engineering
- Die Attach Engineering
- Leadframe Engineering
- Substrate Engineering
- Equipment Engineering
- Manufacturing Operations
- Quality & Reliability Teams
- Interface directly with customers for technical discussions, qualification reviews, and closure of molding-related action items.
- Provide technical guidance and mentorship to engineering and manufacturing teams.
Required Experience
- Bachelor's Degree in Mechanical Engineering, Materials Engineering, Chemical Engineering, Manufacturing Engineering, or a related discipline.
- 10-15+ years of semiconductor assembly and molding process engineering experience within OSAT or semiconductor manufacturing environments.
- Proven experience in:
- Mold Process Development
- Package Qualification
- Process Characterization
- Tooling Development
- Customer Technical Support
- Strong understanding of semiconductor assembly manufacturing and package qualification methodologies.
- Experience supporting product introduction from development through mass production release.
- Demonstrated success in driving process capability improvements and manufacturing optimization initiatives.
Preferred Experience
Candidates with experience in one or more of the following areas will be strongly preferred:
- Semiconductor Assembly & Packaging
- OSAT Manufacturing Operations
- Advanced Packaging Technologies
- QFN / DFN Manufacturing
- QFP Manufacturing
- BGA Manufacturing
- Transfer Molding Processes
- EMC Material Qualification
- Package Reliability Engineering
- High-Volume Manufacturing Environments
- Greenfield Semiconductor Manufacturing Projects
- New Product Introduction (NPI)
- Equipment Commissioning & Qualification
- APQP Deployment
Required Technical Skills
Mold Equipment
Hands-on expertise with:
- TOWA
- ASMPT
- Yamada
- APIC Yamada
- Fico
- Equivalent semiconductor molding platforms
Materials Engineering
Strong understanding of:
- Epoxy Mold Compounds (EMC)
- Release Films
- Mold Chase Materials
- Material Qualification Methodologies
- Moisture Sensitivity Requirements
- Warpage Performance Optimization
Tooling & Mold Design
Experience with:
- Mold Chase Design
- Gate Design
- Runner Configuration
- Cavity Layout Design
- Package Interface Design
- Process Specification Development
Failure Analysis & Inspection Techniques
Hands-on experience with:
- C-SAM Analysis
- X-Ray Inspection
- Cross-Section Analysis
- Warpage Measurement
- Dimensional Analysis
- Defect Characterization
Engineering & Analytical Software
Strong working knowledge of:
- AutoCAD
- SolidWorks
- Siemens NX
- Minitab
- JMP
- Statistical Process Control Tools
- MES Systems
- Microsoft Office Suite
Manufacturing & Quality Methodologies
Practical experience in:
- APQP
- PFMEA
- Control Plans
- GR&R
- Capability Studies
- DOE
- SPC
- Process Validation
Preferred Certifications
The following certifications are desirable:
- Six Sigma Green Belt
- Six Sigma Black Belt
- ASQ Certified Quality Engineer (CQE)
- ASQ Certified Reliability Engineer (CRE)
- PMP (Project Management Professional)
- Lean Manufacturing Certification
While certifications are advantageous, demonstrated expertise in semiconductor molding process development, qualification, and manufacturing ramp-up will be given greater consideration.
Frameworks, Standards & Methodologies
Experience with relevant semiconductor manufacturing and quality frameworks including:
- APQP
- PFMEA
- MSA
- GR&R
- SPC
- DOE
- DMAIC
- 8D Problem Solving
- Statistical Process Control
- Process Capability Analysis (Cp/Cpk)
- JEDEC Reliability Standards
- Semiconductor NPI Methodologies
- Customer Qualification Frameworks
Candidate Profile
We are specifically looking for professionals who can:
- Lead semiconductor mold process development from concept to production.
- Build robust, scalable molding processes for advanced package technologies.
- Balance quality, yield, reliability, throughput, and cost objectives.
- Drive technical problem-solving using structured engineering methodologies.
- Influence cross-functional stakeholders in fast-paced NPI environments.
- Interface confidently with customers, suppliers, equipment vendors, and manufacturing teams.
- Mentor engineers and establish best practices for mold process excellence.
- Lead qualification programs and successful production ramp activities.
- Contribute to the development of a world-class semiconductor manufacturing operation.
Position Details
Position:
Application Process
Interested candidates can apply through either channel:
Google Form
Apply Now:
Email
Email:
Email Subject
Application | NPI Mold Process SME | CG_ENG_NPI_111
Candidate Information Required
Please share the following details along with your updated resume:
- Full Name
- Current Company
- Current Designation
- Current Location
- Total Experience
- Relevant Mold Process Engineering Experience
- Semiconductor / OSAT Experience
- Experience with QFN, DFN, SOP, SSOP, QFP and BGA Packages
- Experience in Mold Process Development & Characterization
- Experience with TOWA, ASMPT, Yamada, Fico or Equivalent Equipment
- EMC Material Qualification Experience
- Experience in Tooling / Mold Chase Development
- APQP, PFMEA, Control Plan and GR&R Experience
- Experience Conducting DOE and Capability Studies
- Experience Supporting NPI, Qualification and Production Ramp Programs
- Experience in Customer-Facing Technical Reviews
- Highest Qualification
- Professional Certifications
- Current Fixed CTC
- Variable / Bonus
- Expected Fixed CTC
- Notice Period / Earliest Joining Date
- Current Offers, if any
- Willingness to Relocate to Sanand, Gujarat (Yes/No)
