Role involves leading AP-ICC at IITGN to design next-gen advanced packaging prototypes (incl. national 3D chiplet test vehicle), set up pilot lines, manage 8 technology programs, coordinate industry partners, and guide a 25-member engineering team
Role involves leading AP-ICC at IITGN to design next-gen advanced packaging prototypes (incl. national 3D chiplet test vehicle), set up pilot lines, manage 8 technology programs, coordinate industry partners, and guide a 25-member engineering team