Job
Description
In the TD Advanced Modeling Group at Micron Technology in Hyderabad, you will work alongside a team of highly skilled engineers focused on modeling materials, processes, structures, and reactors for advanced node development in TD and HVM. Your primary responsibility will involve developing predictive structure modeling simulations for various DRAM and NAND nodes. Collaboration with product design and process/integration teams will be essential for 3D structure model development and deployment on Silicon wafer. Moreover, you will engage with process integration engineers and development teams to address challenges hindering node development milestones, while also creating programs and computational modeling solutions to derive actionable insights from data. Key Responsibilities: - Develop predictive structure modeling simulations for multiple DRAM and NAND nodes - Collaborate with product design and process/integration teams for 3D structure model development and deployment - Identify and address questions and issues hindering node development milestones - Create programs, algorithms, and computational modeling solutions to extract insights from modeling and data - Interpret and communicate insights and findings from models and experiments to engineering teams and leaders Qualifications: - Master's or PhD degree in Applied Mechanics, Materials Science, Mechanical Engineering, or related fields - 5+ years of semiconductor process integration experience - Beginner level hands-on experience with 3D semiconductor structure model building tools like Synopsys, Cadence, Mentor, and Silvaco - Understanding of analysis techniques like TEM/SEM/TDS and metrology techniques - Experience with data analysis tools and machine learning frameworks (e.g., Python, MATLAB, TensorFlow) - Proficiency in HPC on Linux environment - Experience with computational geometry and mesh generation techniques (added advantage) - Strong problem-solving skills and attention to detail - Ability to work independently and collaboratively in a fast-paced environment - Excellent written and verbal communication skills - Experience with customized reports and presentations for users, managers, and leaders - Teamwork and remote collaboration experience At Micron Technology, Inc., we are dedicated to transforming how information enriches life for all through innovative memory and storage solutions. Our focus on technology leadership and operational excellence enables us to deliver high-performance DRAM, NAND, and NOR memory and storage products, driving advancements in artificial intelligence and 5G applications. To explore career opportunities with us, visit micron.com/careers. In the TD Advanced Modeling Group at Micron Technology in Hyderabad, you will work alongside a team of highly skilled engineers focused on modeling materials, processes, structures, and reactors for advanced node development in TD and HVM. Your primary responsibility will involve developing predictive structure modeling simulations for various DRAM and NAND nodes. Collaboration with product design and process/integration teams will be essential for 3D structure model development and deployment on Silicon wafer. Moreover, you will engage with process integration engineers and development teams to address challenges hindering node development milestones, while also creating programs and computational modeling solutions to derive actionable insights from data. Key Responsibilities: - Develop predictive structure modeling simulations for multiple DRAM and NAND nodes - Collaborate with product design and process/integration teams for 3D structure model development and deployment - Identify and address questions and issues hindering node development milestones - Create programs, algorithms, and computational modeling solutions to extract insights from modeling and data - Interpret and communicate insights and findings from models and experiments to engineering teams and leaders Qualifications: - Master's or PhD degree in Applied Mechanics, Materials Science, Mechanical Engineering, or related fields - 5+ years of semiconductor process integration experience - Beginner level hands-on experience with 3D semiconductor structure model building tools like Synopsys, Cadence, Mentor, and Silvaco - Understanding of analysis techniques like TEM/SEM/TDS and metrology techniques - Experience with data analysis tools and machine learning frameworks (e.g., Python, MATLAB, TensorFlow) - Proficiency in HPC on Linux environment - Experience with computational geometry and mesh generation techniques (added advantage) - Strong problem-solving skills and attention to detail - Ability to work independently and collaboratively in a fast-paced environment - Excellent written and verbal communication skills - Experience with customized reports and presentations for users, managers, and leaders - Teamwork and remote collaboration experience At Micron Technology, Inc., we are dedicated to transformi
