Posted:1 week ago|
Platform:
On-site
Full Time
ADC/DAC
? Internal loopback
? SCAN (stuck-at and transition delay
? Pre & Post-trim including temperature sensors
? IO DC parametric tests
? Process monitor / ring oscillator tests
SERDES (CPRI, PCIE)
? Internal & external loopback external loopback at package only
? IO DC parametrics tests
? Register/PLL lock checks using either APB (Advanced Peripheral Bus) or iJTAG for
access.
? Stuck-at and Transition Delay SCAN. Fault coverage levels TBD.
? IDD (Current into VDD supply pin) if separate power supply available.
ATPG (Automatic Test Pattern Generation)
? Stuck-at
? Transition Delay
? Cell-aware / Small Delay Defect()
? Memory Built-in Self-Test (MBIST) & BISR (Built-in Self Repair)
? Logic Built-in Self-Test (LBIST)
Boundary Scan (BSDL, Boundary Scan Description Language)) - IEEE1149.1 &
IEEE1149.6
Programming LTU chip
Process Monitors (ProteanTec / Synopsys)
High Voltage Stress Testing Cyclic Alternating Voltage Stress per TSMC
Very Low Voltage (VLV) Testing
IO Parametric Tests leakage, Vix, Vox
IDD quiescent/gross, functional/dynamic, sleep
Top Level Verification (TLV) functional patterns, e.g., Path Delay, if any
Processor Performance (Coremark/Dhrystone) patterns
Temperature Sensor(s) SoC (system on chip) - calibration & reading
Characterization & Correlation perform characterization across PVT, correlate against
golden data.
Production Test & Yield Ramp optimize test time, support binning, yield analysis.
Failure Analysis Support debug routines (shmoo, scan diagnosis), provide reports.
Canvendor
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